ATE545151T1 - Verfahren zum binden zweier aus materialien, die aus halbleitermaterialien ausgewählt wurden, hergestellter wafer - Google Patents
Verfahren zum binden zweier aus materialien, die aus halbleitermaterialien ausgewählt wurden, hergestellter waferInfo
- Publication number
- ATE545151T1 ATE545151T1 AT06743328T AT06743328T ATE545151T1 AT E545151 T1 ATE545151 T1 AT E545151T1 AT 06743328 T AT06743328 T AT 06743328T AT 06743328 T AT06743328 T AT 06743328T AT E545151 T1 ATE545151 T1 AT E545151T1
- Authority
- AT
- Austria
- Prior art keywords
- plasma
- activated
- wafers
- activation
- bonding
- Prior art date
Links
Classifications
-
- H10P90/1916—
-
- H10P34/40—
-
- H10W10/181—
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Element Separation (AREA)
- Recrystallisation Techniques (AREA)
- Electrodes Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0504093A FR2884966B1 (fr) | 2005-04-22 | 2005-04-22 | Procede de collage de deux tranches realisees dans des materiaux choisis parmi les materiaux semiconducteurs |
| PCT/EP2006/061647 WO2006111533A1 (en) | 2005-04-22 | 2006-04-18 | A method of bonding two wafers made out of materials selected from semiconductor materials |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE545151T1 true ATE545151T1 (de) | 2012-02-15 |
Family
ID=35708624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT06743328T ATE545151T1 (de) | 2005-04-22 | 2006-04-18 | Verfahren zum binden zweier aus materialien, die aus halbleitermaterialien ausgewählt wurden, hergestellter wafer |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US7419884B2 (de) |
| EP (1) | EP1872388B1 (de) |
| JP (1) | JP4976372B2 (de) |
| KR (1) | KR100904873B1 (de) |
| CN (1) | CN101138071B (de) |
| AT (1) | ATE545151T1 (de) |
| FR (1) | FR2884966B1 (de) |
| TW (1) | TWI305010B (de) |
| WO (1) | WO2006111533A1 (de) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6902987B1 (en) | 2000-02-16 | 2005-06-07 | Ziptronix, Inc. | Method for low temperature bonding and bonded structure |
| US7601271B2 (en) * | 2005-11-28 | 2009-10-13 | S.O.I.Tec Silicon On Insulator Technologies | Process and equipment for bonding by molecular adhesion |
| FR2912839B1 (fr) | 2007-02-16 | 2009-05-15 | Soitec Silicon On Insulator | Amelioration de la qualite de l'interface de collage par nettoyage froid et collage a chaud |
| EP1986230A2 (de) * | 2007-04-25 | 2008-10-29 | Semiconductor Energy Laboratory Co., Ltd. | Verfahren zur Herstellung eines SOI-Substrats und Verfahren zur Herstellung einer Halbleitervorrichtung |
| US9059247B2 (en) * | 2007-05-18 | 2015-06-16 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing SOI substrate and method for manufacturing semiconductor device |
| US8119490B2 (en) * | 2008-02-04 | 2012-02-21 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing SOI substrate |
| US7858495B2 (en) * | 2008-02-04 | 2010-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing SOI substrate |
| KR100958279B1 (ko) * | 2008-02-25 | 2010-05-19 | 참앤씨(주) | 웨이퍼 본딩방법 및 웨이퍼 본딩장치 |
| FR2938702B1 (fr) * | 2008-11-19 | 2011-03-04 | Soitec Silicon On Insulator | Preparation de surface d'un substrat saphir pour la realisation d'heterostructures |
| FR2965974B1 (fr) * | 2010-10-12 | 2013-11-29 | Soitec Silicon On Insulator | Procédé de collage moléculaire de substrats en silicium et en verre |
| KR102353489B1 (ko) * | 2011-01-25 | 2022-01-19 | 에베 그룹 에. 탈너 게엠베하 | 웨이퍼들의 영구적 결합을 위한 방법 |
| CN105374667B (zh) * | 2011-01-25 | 2019-01-11 | Ev 集团 E·索尔纳有限责任公司 | 用于永久接合晶片的方法 |
| CN108470679B (zh) * | 2011-01-25 | 2022-03-29 | Ev 集团 E·索尔纳有限责任公司 | 用于永久接合晶片的方法 |
| WO2012136266A1 (de) * | 2011-04-08 | 2012-10-11 | Ev Group E. Thallner Gmbh | Verfahren zum permanenten bonden von wafern |
| WO2012136268A1 (de) * | 2011-04-08 | 2012-10-11 | Ev Group E. Thallner Gmbh | Verfahren zum permanenten bonden von wafern |
| SG192180A1 (en) * | 2011-04-08 | 2013-08-30 | Ev Group E Thallner Gmbh | Method for permanent bonding of wafer |
| US9329336B2 (en) | 2012-07-06 | 2016-05-03 | Micron Technology, Inc. | Method of forming a hermetically sealed fiber to chip connection |
| EP3035370A1 (de) * | 2012-07-24 | 2016-06-22 | EV Group E. Thallner GmbH | Vorrichtung zum permanenten bonden von wafern |
| SG2014013585A (en) * | 2012-07-26 | 2014-06-27 | Ev Group E Thallner Gmbh | Method for bonding of substrates |
| JP6185474B2 (ja) * | 2012-09-07 | 2017-08-23 | 京セラ株式会社 | 複合基板およびその製造方法 |
| JP6106239B2 (ja) * | 2015-09-30 | 2017-03-29 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | ウェハを恒久的にボンディングするための方法 |
| JP2016178340A (ja) * | 2016-06-15 | 2016-10-06 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | ウエハの永久接合方法 |
| JP6679666B2 (ja) * | 2018-07-05 | 2020-04-15 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | ウエハの永久接合方法 |
| KR20200015264A (ko) * | 2018-08-03 | 2020-02-12 | 삼성전자주식회사 | 웨이퍼 접합 방법 및 웨이퍼 접합 시스템 |
| US10978292B2 (en) * | 2019-05-29 | 2021-04-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Cuprous oxide devices and formation methods |
| JP7592118B2 (ja) * | 2021-11-26 | 2024-11-29 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | ウエハの永久接合方法 |
| CN114582781A (zh) * | 2022-03-11 | 2022-06-03 | 深圳先进电子材料国际创新研究院 | 一种电磁场辅助激光解键合的方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3294934B2 (ja) * | 1994-03-11 | 2002-06-24 | キヤノン株式会社 | 半導体基板の作製方法及び半導体基板 |
| EP1018153A1 (de) * | 1997-08-29 | 2000-07-12 | Sharon N. Farrens | In sito-plasmaverbindungsverfahren für scheiben |
| JP3582566B2 (ja) * | 1997-12-22 | 2004-10-27 | 三菱住友シリコン株式会社 | Soi基板の製造方法 |
| US6563133B1 (en) * | 2000-08-09 | 2003-05-13 | Ziptronix, Inc. | Method of epitaxial-like wafer bonding at low temperature and bonded structure |
| US7183177B2 (en) * | 2000-08-11 | 2007-02-27 | Applied Materials, Inc. | Silicon-on-insulator wafer transfer method using surface activation plasma immersion ion implantation for wafer-to-wafer adhesion enhancement |
| US6780759B2 (en) * | 2001-05-09 | 2004-08-24 | Silicon Genesis Corporation | Method for multi-frequency bonding |
| US7078317B2 (en) * | 2004-08-06 | 2006-07-18 | Silicon Genesis Corporation | Method and system for source switching and in-situ plasma bonding |
| US7261793B2 (en) | 2004-08-13 | 2007-08-28 | Hewlett-Packard Development Company, L.P. | System and method for low temperature plasma-enhanced bonding |
-
2005
- 2005-04-22 FR FR0504093A patent/FR2884966B1/fr not_active Expired - Lifetime
- 2005-11-23 US US11/285,009 patent/US7419884B2/en active Active
-
2006
- 2006-04-18 JP JP2008503535A patent/JP4976372B2/ja active Active
- 2006-04-18 KR KR1020077021882A patent/KR100904873B1/ko active Active
- 2006-04-18 CN CN200680007529XA patent/CN101138071B/zh active Active
- 2006-04-18 WO PCT/EP2006/061647 patent/WO2006111533A1/en not_active Ceased
- 2006-04-18 AT AT06743328T patent/ATE545151T1/de active
- 2006-04-18 EP EP06743328A patent/EP1872388B1/de active Active
- 2006-04-21 TW TW095114205A patent/TWI305010B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| EP1872388B1 (de) | 2012-02-08 |
| TWI305010B (en) | 2009-01-01 |
| CN101138071B (zh) | 2012-01-11 |
| FR2884966B1 (fr) | 2007-08-17 |
| FR2884966A1 (fr) | 2006-10-27 |
| US20060240642A1 (en) | 2006-10-26 |
| KR20070114769A (ko) | 2007-12-04 |
| CN101138071A (zh) | 2008-03-05 |
| JP2008535230A (ja) | 2008-08-28 |
| WO2006111533A1 (en) | 2006-10-26 |
| JP4976372B2 (ja) | 2012-07-18 |
| TW200710971A (en) | 2007-03-16 |
| KR100904873B1 (ko) | 2009-06-26 |
| EP1872388A1 (de) | 2008-01-02 |
| US7419884B2 (en) | 2008-09-02 |
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