SG11201811636RA - Method and Apparatus for Resuming the Wire Sawing Process of a Workpiece after an Unplanned Interruption - Google Patents

Method and Apparatus for Resuming the Wire Sawing Process of a Workpiece after an Unplanned Interruption

Info

Publication number
SG11201811636RA
SG11201811636RA SG11201811636RA SG11201811636RA SG11201811636RA SG 11201811636R A SG11201811636R A SG 11201811636RA SG 11201811636R A SG11201811636R A SG 11201811636RA SG 11201811636R A SG11201811636R A SG 11201811636RA SG 11201811636R A SG11201811636R A SG 11201811636RA
Authority
SG
Singapore
Prior art keywords
workpiece
sawing
wire
resuming
multiplicity
Prior art date
Application number
SG11201811636RA
Inventor
Alexander Rieger
Walter Spöckner
Original Assignee
Siltronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag filed Critical Siltronic Ag
Publication of SG11201811636RA publication Critical patent/SG11201811636RA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0053—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of drives for saw wires; of wheel mountings; of wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
    • B23D57/0023—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires with a plurality of saw wires or saw wires having plural cutting zones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0061—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for guiding or feeding saw wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0069—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for tensioning saw wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

Method and Apparatus for Resuming the Wire Sawing Process of a Workpiece after an Unplanned Interruption 5 The present invention relates to a method for resuming an interrupted process for the sawing of a workpiece into a multiplicity of wafers with a wire saw, which uses a sawing wire covered with abrasive, for example a diamond sawing wire. The method according to the invention is presented here with reference to the example of a process for sawing a workpiece made of semiconductor material into a multiplicity of wafers with a diamond wire saw, but is also 10 suitable for workpieces made of other materials. Furthermore, the present invention also relates to an apparatus for sawing a workpiece into a multiplicity of wafers with a sawing wire, this apparatus making it possible to detect the position of a wire break. Fig. 3 15
SG11201811636RA 2016-06-30 2017-06-20 Method and Apparatus for Resuming the Wire Sawing Process of a Workpiece after an Unplanned Interruption SG11201811636RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016211883.8A DE102016211883B4 (en) 2016-06-30 2016-06-30 Method and apparatus for resuming the wire sawing process of a workpiece after an unscheduled interruption
PCT/EP2017/065082 WO2018001793A1 (en) 2016-06-30 2017-06-20 Method and device for resuming the wire sawing process of a workpiece after an unscheduled interruption

Publications (1)

Publication Number Publication Date
SG11201811636RA true SG11201811636RA (en) 2019-01-30

Family

ID=59276697

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201811636RA SG11201811636RA (en) 2016-06-30 2017-06-20 Method and Apparatus for Resuming the Wire Sawing Process of a Workpiece after an Unplanned Interruption

Country Status (9)

Country Link
US (1) US20200316817A1 (en)
EP (1) EP3478437A1 (en)
JP (1) JP2019519385A (en)
KR (1) KR20190025654A (en)
CN (1) CN109414774A (en)
DE (1) DE102016211883B4 (en)
SG (1) SG11201811636RA (en)
TW (1) TWI628020B (en)
WO (1) WO2018001793A1 (en)

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TWI656931B (en) 2018-02-01 2019-04-21 力山工業股份有限公司 A foldable miter saw
DE102018218016A1 (en) 2018-10-22 2020-04-23 Siltronic Ag Method and device for simultaneously separating a plurality of disks from a workpiece
DE102019207719A1 (en) * 2019-05-27 2020-12-03 Siltronic Ag Method for severing a multiplicity of wafers from workpieces during a number of severing operations by means of a wire saw and semiconductor wafer made of monocrystalline silicon
JP7226286B2 (en) * 2019-12-10 2023-02-21 信越半導体株式会社 How to resume wire saw operation
CN111098419B (en) * 2019-12-30 2021-07-13 郑州合晶硅材料有限公司 Slicing device for silicon wafer production
EP3858569A1 (en) 2020-01-28 2021-08-04 Siltronic AG Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation operations
DE102020105223B4 (en) 2020-02-27 2021-11-04 Gebrüder Linck, Maschinenfabrik "Gatterlinck" GmbH & Co. KG Device for predicting a blade breakage of a band saw blade of a band saw
CN113521920A (en) * 2020-04-15 2021-10-22 安徽恒泰工程咨询有限公司 Building site raise dust detection device
EP3943265A1 (en) 2020-07-21 2022-01-26 Siltronic AG Method and device for simultaneously separating a plurality of plates from a workpiece
EP4047635A1 (en) 2021-02-18 2022-08-24 Siltronic AG Method of manufacturing wafers from a cylindrical rod of semiconductor material
CN114589824B (en) * 2021-11-01 2024-02-02 青岛高测科技股份有限公司 Cutting device of silicon rod cutting system and silicon rod cutting system
CN117584301A (en) * 2021-11-01 2024-02-23 青岛高测科技股份有限公司 Silicon rod cutting system
EP4302952A1 (en) 2022-07-07 2024-01-10 Siltronic AG Method for simultaneously separating a plurality of slices from a workpiece using a wire saw

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DE19519460A1 (en) * 1995-05-26 1996-11-28 Wacker Siltronic Halbleitermat Wire saw and method for cutting slices from a workpiece
US5878737A (en) * 1997-07-07 1999-03-09 Laser Technology West Limited Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire
DE19959414A1 (en) * 1999-12-09 2001-06-21 Wacker Chemie Gmbh Device for simultaneously separating number of discs from workpiece has framesaw with number of individual wires and device for holding workpiece and turning it about longitudinal axis
JP4820108B2 (en) * 2005-04-25 2011-11-24 コマツＮｔｃ株式会社 Semiconductor wafer manufacturing method, workpiece slicing method, and wire saw used therefor
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JP2010029955A (en) * 2008-07-25 2010-02-12 Shin Etsu Handotai Co Ltd Method for resuming operation of wire saw and wire saw
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Also Published As

Publication number Publication date
DE102016211883B4 (en) 2018-02-08
WO2018001793A1 (en) 2018-01-04
US20200316817A1 (en) 2020-10-08
CN109414774A (en) 2019-03-01
TWI628020B (en) 2018-07-01
EP3478437A1 (en) 2019-05-08
TW201801831A (en) 2018-01-16
DE102016211883A1 (en) 2018-01-04
KR20190025654A (en) 2019-03-11
JP2019519385A (en) 2019-07-11

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