JP2018518044A5 - - Google Patents

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Publication number
JP2018518044A5
JP2018518044A5 JP2017556588A JP2017556588A JP2018518044A5 JP 2018518044 A5 JP2018518044 A5 JP 2018518044A5 JP 2017556588 A JP2017556588 A JP 2017556588A JP 2017556588 A JP2017556588 A JP 2017556588A JP 2018518044 A5 JP2018518044 A5 JP 2018518044A5
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JP
Japan
Prior art keywords
coolant
supply
coolant channels
channels
disposed
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JP2017556588A
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English (en)
Japanese (ja)
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JP6839096B2 (ja
JP2018518044A (ja
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Priority claimed from US15/142,220 external-priority patent/US9818624B2/en
Priority claimed from PCT/US2016/030079 external-priority patent/WO2016176566A1/en
Publication of JP2018518044A publication Critical patent/JP2018518044A/ja
Publication of JP2018518044A5 publication Critical patent/JP2018518044A5/ja
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Publication of JP6839096B2 publication Critical patent/JP6839096B2/ja
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JP2017556588A 2015-04-29 2016-04-29 基板の変形を矯正する方法及び装置 Expired - Fee Related JP6839096B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
IN1190DE2015 2015-04-29
IN1190/DEL/2015 2015-04-29
US15/142,220 US9818624B2 (en) 2015-04-29 2016-04-29 Methods and apparatus for correcting substrate deformity
PCT/US2016/030079 WO2016176566A1 (en) 2015-04-29 2016-04-29 Methods and apparatus for correcting substrate deformity
US15/142,220 2016-04-29

Publications (3)

Publication Number Publication Date
JP2018518044A JP2018518044A (ja) 2018-07-05
JP2018518044A5 true JP2018518044A5 (enExample) 2019-06-06
JP6839096B2 JP6839096B2 (ja) 2021-03-03

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ID=57205753

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017556588A Expired - Fee Related JP6839096B2 (ja) 2015-04-29 2016-04-29 基板の変形を矯正する方法及び装置

Country Status (6)

Country Link
US (1) US9818624B2 (enExample)
JP (1) JP6839096B2 (enExample)
KR (1) KR102589733B1 (enExample)
CN (1) CN107534003B (enExample)
SG (2) SG11201708116RA (enExample)
TW (1) TWI697974B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10325790B2 (en) * 2016-04-29 2019-06-18 Applied Materials, Inc. Methods and apparatus for correcting substrate deformity
US10612135B2 (en) * 2016-07-19 2020-04-07 Applied Materials, Inc. Method and system for high temperature clean
KR102015336B1 (ko) * 2017-06-12 2019-08-28 삼성전자주식회사 반도체 패키지 기판의 휨 감소 방법 및 휨 감소 장치
CN108803702B (zh) * 2018-06-26 2020-12-29 武汉华星光电技术有限公司 阵列基板制程中的温度调控系统及方法
US10889894B2 (en) * 2018-08-06 2021-01-12 Applied Materials, Inc. Faceplate with embedded heater
US11421316B2 (en) * 2018-10-26 2022-08-23 Applied Materials, Inc. Methods and apparatus for controlling warpage in wafer level packaging processes
US20210057238A1 (en) * 2019-08-20 2021-02-25 Applied Materials, Inc. Methods and apparatus for contactless substrate warpage correction
JP7365423B2 (ja) * 2019-10-04 2023-10-19 東京エレクトロン株式会社 加熱冷却装置及び加熱冷却方法
US11177146B2 (en) * 2019-10-31 2021-11-16 Applied Materials, Inc. Methods and apparatus for processing a substrate
WO2022169561A1 (en) * 2021-02-05 2022-08-11 Applied Materials, Inc. Apparatus, methods, and systems of using hydrogen radicals for thermal annealing
JPWO2023181367A1 (enExample) 2022-03-25 2023-09-28
CN115747955A (zh) * 2022-10-26 2023-03-07 中环领先半导体材料有限公司 一种改善Logic产品衬底外延后弯曲度和翘曲度工艺
US12224192B2 (en) 2022-11-10 2025-02-11 Applied Materials, Inc. Bowed substrate clamping method, apparatus, and system

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6189694A (ja) * 1984-10-09 1986-05-07 ソニー株式会社 プリント基板の形状矯正方法及びその装置
JPH01160080A (ja) * 1987-12-17 1989-06-22 Sumitomo Bakelite Co Ltd プリント回路板の反り直し方法
JPH07112715B2 (ja) * 1993-10-28 1995-12-06 菱華産業株式会社 エアシャワーを用いた遠赤外線アニール機
JPH0825086A (ja) * 1994-07-07 1996-01-30 Tanaka Seisakusho Kk 鋼材加工装置
US6191399B1 (en) * 2000-02-01 2001-02-20 Asm America, Inc. System of controlling the temperature of a processing chamber
JP5374039B2 (ja) 2007-12-27 2013-12-25 東京エレクトロン株式会社 基板処理方法、基板処理装置及び記憶媒体
WO2009144456A1 (en) * 2008-05-28 2009-12-03 Aixtron Ag Thermal gradient enhanced chemical vapour deposition (tge-cvd)
JP5424201B2 (ja) * 2009-08-27 2014-02-26 アユミ工業株式会社 加熱溶融処理装置および加熱溶融処理方法
JP5673523B2 (ja) 2011-12-28 2015-02-18 東京エレクトロン株式会社 基板処理方法、基板処理装置及び記憶媒体
US8975817B2 (en) * 2012-10-17 2015-03-10 Lam Research Corporation Pressure controlled heat pipe temperature control plate
JP2015035584A (ja) * 2013-07-11 2015-02-19 東京エレクトロン株式会社 熱処理装置及び成膜システム
JP5905509B2 (ja) 2014-05-14 2016-04-20 東京エレクトロン株式会社 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体

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