JP6828164B2 - プリント基板複合体およびプリント基板複合体を製造する方法 - Google Patents
プリント基板複合体およびプリント基板複合体を製造する方法 Download PDFInfo
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- JP6828164B2 JP6828164B2 JP2019531276A JP2019531276A JP6828164B2 JP 6828164 B2 JP6828164 B2 JP 6828164B2 JP 2019531276 A JP2019531276 A JP 2019531276A JP 2019531276 A JP2019531276 A JP 2019531276A JP 6828164 B2 JP6828164 B2 JP 6828164B2
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- printed circuit
- circuit board
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- circuit boards
- groove
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- 239000002131 composite material Substances 0.000 title claims description 37
- 238000000034 method Methods 0.000 title claims description 19
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 229920003023 plastic Polymers 0.000 claims description 31
- 239000004033 plastic Substances 0.000 claims description 31
- 239000000470 constituent Substances 0.000 claims description 15
- 238000000465 moulding Methods 0.000 description 12
- 238000005219 brazing Methods 0.000 description 9
- 230000008878 coupling Effects 0.000 description 7
- 238000010168 coupling process Methods 0.000 description 7
- 238000005859 coupling reaction Methods 0.000 description 7
- 229920001187 thermosetting polymer Polymers 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 6
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 238000005304 joining Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Description
2 第2プリント基板
2.1 幅の広い領域
2.2 細い領域
3 第3プリント基板
4 構成素子
5 位置決め成形部
6 構成素子切欠
7 係止突起
8 プリント基板ラッチ突起
B1,B2 幅延在
D1,D2 厚さ延在
L1,L2 長さ方向延在
N1,N2 溝
V プリント基板複合体
Claims (10)
- 第1プリント基板(1)、特にセンサ支持体プリント基板を、第2プリント基板(2)、特に支持プリント基板に形状接続的に接続する、プリント基板複合体(V)を製造する方法であって、
前記第2プリント基板(2)は、前記第1プリント基板(1)に接続された状態で、該第1プリント基板(1)上の構成素子(4)、特にセンサまで延在するように、前記第2プリント基板(2)の長さ方向延在(L2)を形成しており、
前記第1プリント基板(1)上に配置された構成素子(4)を前記第2プリント基板(2)によってその位置で支持するように、前記両プリント基板(1,2)を互いに接続することを特徴とする、方法。 - 前記第2プリント基板(2)は、支持すべき前記構成素子(4)の形状に対応する構成素子切欠(6)を有しており、前記第1プリント基板(1)と前記第2プリント基板(2)とが接続された後、前記構成素子(4)が前記構成素子切欠(6)内に配置される、請求項1記載の方法。
- 両プリント基板(1,2)はそれぞれ1つの溝(N1,N2)を有しており、前記両溝(N1,N2)の溝底面が互いに接触するように、前記両プリント基板(1,2)を互いに接続する、請求項1記載の方法。
- 前記両プリント基板(1,2)の面法線が互いに直角に向くように、前記両プリント基板(1,2)を互いに方向付けて接続する、請求項1または2記載の方法。
- 前記両プリント基板(1,2)を互いに掛止させる、請求項1から4までのいずれか1項記載の方法。
- 少なくとも前記第1プリント基板(1)を第3プリント基板(3)に接続する、請求項1から5までのいずれか1項記載の方法。
- 前記第1プリント基板(1)の少なくとも1つの位置決め成形部(5)を、第3プリント基板(3)における対応する凹部内に導入し、かつ/または前記第1プリント基板(1)と前記第3プリント基板(3)とを互いにろう付けする、請求項1から6までのいずれか1項記載の方法。
- 少なくとも前記第1プリント基板(1)をプラスチックによって少なくとも所定の領域でオーバーモールドする、請求項1から7までのいずれか1項記載の方法。
- 形状接続に互いに接続された少なくとも2つのプリント基板(1,2)を含む、特に請求項1から8までのいずれか1項記載の方法によって製造される、プリント基板複合体(V)。
- 互いに接続された3つのプリント基板(1,2,3)を含む、請求項9記載のプリント基板複合体(V)。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102016224653.4 | 2016-12-12 | ||
DE102016224653.4A DE102016224653B4 (de) | 2016-12-12 | 2016-12-12 | Leiterplattenverbund und Verfahren zu dessen Herstellung |
PCT/EP2017/082109 WO2018108758A1 (de) | 2016-12-12 | 2017-12-08 | Leiterplattenverbund und verfahren zu dessen herstellung |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020501377A JP2020501377A (ja) | 2020-01-16 |
JP6828164B2 true JP6828164B2 (ja) | 2021-02-10 |
Family
ID=60702710
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019531276A Active JP6828164B2 (ja) | 2016-12-12 | 2017-12-08 | プリント基板複合体およびプリント基板複合体を製造する方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10893615B2 (ja) |
EP (1) | EP3552463B1 (ja) |
JP (1) | JP6828164B2 (ja) |
KR (1) | KR102423939B1 (ja) |
CN (1) | CN110169212B (ja) |
DE (1) | DE102016224653B4 (ja) |
WO (1) | WO2018108758A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102622914B1 (ko) * | 2017-02-06 | 2024-01-10 | 삼성전자주식회사 | 전력 공급 장치 및 전력 공급 장치를 포함하는 전자 장치 |
JP1663729S (ja) * | 2018-12-26 | 2020-07-20 | ||
JP1663818S (ja) * | 2018-12-26 | 2020-07-20 | ||
TWD202895S (zh) * | 2019-03-27 | 2020-02-21 | 家登精密工業股份有限公司 | 光罩盒組裝件 |
CN114498117A (zh) * | 2020-10-23 | 2022-05-13 | 台达电子工业股份有限公司 | 插座结构 |
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DE2441209A1 (de) | 1974-08-28 | 1976-03-11 | Erie Elektronik Gmbh | Elektrische anschlusskontaktierung |
US4513064A (en) * | 1982-12-17 | 1985-04-23 | The United States Of America As Represented By The Secretary Of The Army | Package for rugged electronics |
DE3919273C2 (de) | 1989-06-13 | 1993-10-14 | Bosch Gmbh Robert | Leiterplattenanordnung |
DE4244626C2 (de) * | 1992-12-29 | 1995-02-09 | Mannesmann Ag | Anordnung zum Positionieren |
JPH1154875A (ja) * | 1997-07-31 | 1999-02-26 | Nec Home Electron Ltd | プリント基板の保持構造 |
SE0004161D0 (sv) * | 2000-11-13 | 2000-11-13 | Ericsson Telefon Ab L M | Circuit board assembly |
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JP2009152331A (ja) | 2007-12-20 | 2009-07-09 | Panasonic Corp | 配線基板の加工方法、および半導体装置 |
US8328571B2 (en) * | 2010-11-04 | 2012-12-11 | Tyco Electronics Corporation | Connector assemblies having moveable mating arrays and power connectors |
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-
2016
- 2016-12-12 DE DE102016224653.4A patent/DE102016224653B4/de active Active
-
2017
- 2017-12-08 KR KR1020197018382A patent/KR102423939B1/ko active IP Right Grant
- 2017-12-08 WO PCT/EP2017/082109 patent/WO2018108758A1/de active Application Filing
- 2017-12-08 US US16/468,820 patent/US10893615B2/en active Active
- 2017-12-08 EP EP17816673.2A patent/EP3552463B1/de active Active
- 2017-12-08 JP JP2019531276A patent/JP6828164B2/ja active Active
- 2017-12-08 CN CN201780071642.2A patent/CN110169212B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR20190087565A (ko) | 2019-07-24 |
US10893615B2 (en) | 2021-01-12 |
DE102016224653B4 (de) | 2022-07-21 |
JP2020501377A (ja) | 2020-01-16 |
KR102423939B1 (ko) | 2022-07-21 |
EP3552463B1 (de) | 2023-07-26 |
CN110169212B (zh) | 2023-01-20 |
US20200077525A1 (en) | 2020-03-05 |
DE102016224653A1 (de) | 2018-06-14 |
WO2018108758A1 (de) | 2018-06-21 |
CN110169212A (zh) | 2019-08-23 |
EP3552463A1 (de) | 2019-10-16 |
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