CN102858088A - 电路板及其制作方法及采用该电路板的电子产品 - Google Patents

电路板及其制作方法及采用该电路板的电子产品 Download PDF

Info

Publication number
CN102858088A
CN102858088A CN2011101768132A CN201110176813A CN102858088A CN 102858088 A CN102858088 A CN 102858088A CN 2011101768132 A CN2011101768132 A CN 2011101768132A CN 201110176813 A CN201110176813 A CN 201110176813A CN 102858088 A CN102858088 A CN 102858088A
Authority
CN
China
Prior art keywords
circuit board
supporting component
electronic
component
plate body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011101768132A
Other languages
English (en)
Inventor
周晓晖
李洪
李平
李�瑞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN2011101768132A priority Critical patent/CN102858088A/zh
Priority to TW100123304A priority patent/TW201301960A/zh
Priority to US13/305,756 priority patent/US8832932B2/en
Publication of CN102858088A publication Critical patent/CN102858088A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/048Second PCB mounted on first PCB by inserting in window or holes of the first PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09145Edge details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/366Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126Assembling bases
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • Y10T29/49165Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

本发明公开一种电路板及其制作方法及采用该电路板的电子产品。该电路板包括板体及固定于该板体上的电子元件,该电路板还具有支撑组件,该支撑组件支撑并固定该电子元件的至少一部分,进而将该电子元件固定于该板体上并限定于支撑组件上的部分电子元件与该板体之间的距离。本发明电路板及其制作方法以及采用该电路板的电子产品采用支撑组件来支撑电子元件,可以令电子元件稳固性较高,且可以较精准地与电路板的板体之间具有预设的距离。

Description

电路板及其制作方法及采用该电路板的电子产品
技术领域
本发明涉及一种电路板及该电路板的制作方法及采用该电路板的电子产品。
背景技术
大型电子产品一般具有电路板,用于传递工作信号给电子产品以实现其自身功能。该电路板上通常设置多个电子元件,电子元件与电路板信号导通,从而该电子元件在经由该电路板传递的信号的控制下工作。
通常,电子元件直接贴敷于电路板上,或者通过管脚与电路板之间的焊接而安装于电路板上。由于电子元件的性能不同,有些电子元件不是简单地固定于电路板上即可,如霍尔元件等需要一定的高度,这就要求霍尔元件的主体部与电路板之间存在一定的距离。则将此类电子元件稳固地设置于电路板上时,仅采用传统的结构,并利用管脚插接到电路板上实现固定,会存在稳固性不高并且精准的距离要求在组装上存有难度的问题。
发明内容
为了解决现有技术电路板上的部分电子元件到电路板板体的距离较难控制的技术问题,有必要提供固定电子元件的稳固性较高且电路板与其上固定的电子元件之间的距离较精准的电路板。
还有必要提供一种上述电路板的制作方法。
还有必要提供一种采用上述电路板的电子产品。
一种电路板,该电路板包括板体及固定于该板体上的电子元件,该电路板还具有支撑组件,该支撑组件支撑并固定该电子元件的至少一部分,进而将该电子元件固定于该板体上并限定于支撑组件上的部分电子元件与该板体之间的距离。
一种电子产品的制作方法,其包括以下步骤:在整板上切割电路板、支撑组件及支撑组件缺口;于该电路板上制作支撑组件开口;插接支撑组件于该电路板的支撑组件开口上,并固定电子元件;将该电路板作波峰焊处理。
一种电子产品,其具有电路板,该电路板包括板体及固定于该板体上的霍尔元件,该霍尔元件包括主体部及管脚,该电路板还具有支撑组件,该支撑组件支撑并固定该霍尔元件的主体部,进而将该霍尔元件固定于该板体上并限定于支撑组件上的该霍尔元件的主体部与该板体之间的距离。
与现有技术相比,本发明电路板及其制作方法以及采用该电路板的电子产品采用支撑组件来支撑电子元件,可以令电子元件稳固性较高,且可以较精准地与电路板的板体之间具有预设的距离。
附图说明
图1是本发明电子产品第一实施方式的立体示意图。
图2是图1中II处的局部放大示意图。
图3是图2中III-III处的剖面示意图。
图4是本发明电子产品的第二实施方式的局部放大示意图。
图5本发明电路板的制作方法的具体实施方式的流程图。
图6是本发明电路板及支撑组件于整板上切割的示意图。
主要元件符号说明
电子产品 1
第一主体 11
第二主体 12
磁铁 110
电路板 13
支撑板 14
电子元件 15
主体部 151
管脚 152
缺口 143、243
管脚接口 137
开口 149
金属内层 135、145
绝缘外层 136、146
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请一并参阅图1-图2。本发明第一实施方式的电子产品1包括第一主体11与第二主体12。第一主体11可相对该第二主体12运动。在本实施例中,第一主体11相对于第二主体12转动,在其他实施例中,第一主体11可以是相对于第二主体12平动。该电子产品1可以是笔记本电脑、电子词典等,该第一主体11可以包括显示屏幕,该第二主体12可以包括键盘等输入装置。
该第二主体12包括电路板13,当该电子产品1采用笔记本电脑、电子词典时,该电路板13设置于该第二主体12内部。该电路板13包括板体(未标示)及固定于板体上的电子元件15,例如,霍尔元件。电子元件15包括本体部151及管脚152,本体部151与板体之间保持特定的距离。该电路板13进一步包括一支撑组件,该支撑组件固定于板体上并支撑电子元件15的本体部151,从而保证本体部151与板体之间的距离。该支撑组件可以是支撑板14。
该支撑板14的远离该电路板13的一端承载并固定该电子元件15;该支撑板14的远离该电路板13的一端具有夹持结构(未标示)用于夹持该电子元件15。
具体地,该夹持结构具有一倒梯形缺口143,该缺口143远离该电路板13一端的缺口宽度略小于该夹持结构夹持的该电子元件15的主体部151对应位置处的宽度。
该电路板13上还具有开口149。该支撑组件开口149用于收容该支撑组件,即该支撑板14的底部。
该支撑板14的材料还可以与该电路板13的材料相同。具体地,请参阅图3。该支撑板14具有金属内层145及绝缘外层146。该电路板13同样具有金属内层135及绝缘外层136。当该支撑板14插入于该电路板13上时,该支撑板14的接合处的金属内层145裸露并与该电路板13的金属内层135连接。具体应用时,可采用通过波峰焊的连接方式。
此外,该电子元件15可以是霍尔元件。该霍尔元件具有本体部151与多个设置于该本体部151的一侧的管脚152。该电路板上具有管脚接口137用于该多个管脚152的插接。该第一主体11上具有与该霍尔元件对应的磁铁110,优选地,该磁体为永久性磁体。
此外,如图4所示,在本发明电子产品的第二实施方式中,该夹持结构可以为一矩形缺口243,该缺口243宽度等于略小于该夹持结构夹持的该电子元件25对应位置处的宽度。
请参阅图5,是本发明电路板的制作方法的具体实施方式的流程图。该制作方法包括以下步骤:
S1. 在整板上切割电路板13、支撑板14及支撑板缺口143;
在整板上切割电路板13及支撑板14,由于对支撑板14的高度要求不高,因此,可利用该整板或电路板13的余料与废料来切割该支撑板14,并一同切出该支撑板缺口143。如图6,A区为该整板或者该电路板13的废料区。
S2.于该电路板13上制作支撑板开口149;
当支撑板14用于支撑具有管脚的电子元件时,还需要于该电路板13上制作管脚接口137。
S3.插接支撑板14于该电路板13的支撑板开口149上,并固定电子元件15;
如该电路板13具有其他电子元件,或者该电子元件15采用霍尔元件时,一并将霍尔元件的管脚152插接于该电路板13的管脚接口137上,并其中霍尔元件15的主体部151收容于该缺口143内。
S4.将该电路板13作波峰焊处理。
则,该支撑板14固定于该电路板13上,该电子元件15的管脚152固定于该电路板13的管脚接口137上。
此外,步骤在整板上切割电路板13、支撑板14及支撑板缺口143与步骤于该电路板13上制作支撑板开口149的顺序可互换。该电路板13及该支撑板14可以为印刷电路板。
与现有技术相比,本发明电路板13及其制作方法以及采用该电路板的电子产品1采用支撑板14来支撑电子元件15,可以令电子元件15稳固性较高,且可以较精准地与电路板13的板体之间具有预设的距离。
进一步地,当支撑板14采用与电路板13的材料相同的材质时,可将电路板13上的废料及余料加以利用,并利用波峰焊的处理方式将支撑板14固定于电路板13上,制作较为简单。

Claims (10)

1.一种电路板,该电路板包括板体及固定于该板体上的电子元件,其特征在于:该电路板还具有支撑组件,该支撑组件支撑并固定该电子元件的至少一部分,进而将该电子元件固定于该板体上并限定于支撑组件上的部分电子元件与该板体之间的距离。
2.如权利要求1所述的电路板,其特征在于:该支撑组件具有金属内层及绝缘外层,该金属内层与该电路板的金属内层连接。
3.如权利要求2所述的电路板,其特征在于:该支撑组件的金属内层通过波峰焊的连接方式与电路板的金属内层连接。
4.如权利要求3所述的电路板,其特征在于:该支撑组件的远离该电路板的一端具有夹持结构用于夹持该电子元件,该夹持结构具有一缺口,该缺口的宽度等于或者略小于该夹持结构夹持的该电子元件对应位置处的宽度。
5.如权利要求4所述的电路板,其特征在于:该电子元件包括主体部及多个管脚,该多个管脚设置于该主体的一侧,该夹持结构夹持该电子元件的主体部,该管脚与该电路板电连接。
6.一种如权利要求1所述的电路板的制作方法,其包括以下步骤:在整板上切割电路板、支撑组件及支撑组件缺口;于该电路板上制作支撑组件开口;插接支撑组件于该电路板的支撑组件开口上,并固定电子元件;将该电路板作波峰焊处理。
7.如权利要求6所述的电路板的制作方法,其特征在于:步骤在整板上切割电路板、支撑组件及支撑组件缺口与步骤于该电路板上制作支撑组件开口的顺序可互换。
8.如权利要求6所述的电路板的制作方法,其特征在于:该电路板及该支撑组件为印刷电路板。
9.如权利要求6所述的电路板的制作方法,其特征在于:电子元件具有管脚,插接支撑组件于该电路板的支撑组件开口上的步骤与插接电子元件管脚于电路板上的步骤同时进行。
10.一种电子产品,其具有电路板,该电路板包括板体及固定于该板体上的霍尔元件,该霍尔元件包括主体部及管脚,其特征在于:该电路板还具有支撑组件,该支撑组件支撑并固定该霍尔元件的主体部分,进而将该霍尔元件固定于该板体上并限定于支撑组件上的该霍尔元件的主体部与该板体之间的距离。
CN2011101768132A 2011-06-28 2011-06-28 电路板及其制作方法及采用该电路板的电子产品 Pending CN102858088A (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2011101768132A CN102858088A (zh) 2011-06-28 2011-06-28 电路板及其制作方法及采用该电路板的电子产品
TW100123304A TW201301960A (zh) 2011-06-28 2011-07-01 電路板及其製作方法及採用該電路板的電子產品
US13/305,756 US8832932B2 (en) 2011-06-28 2011-11-29 Method of mounting an electronic component on a circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011101768132A CN102858088A (zh) 2011-06-28 2011-06-28 电路板及其制作方法及采用该电路板的电子产品

Publications (1)

Publication Number Publication Date
CN102858088A true CN102858088A (zh) 2013-01-02

Family

ID=47390495

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011101768132A Pending CN102858088A (zh) 2011-06-28 2011-06-28 电路板及其制作方法及采用该电路板的电子产品

Country Status (3)

Country Link
US (1) US8832932B2 (zh)
CN (1) CN102858088A (zh)
TW (1) TW201301960A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109792842A (zh) * 2016-09-29 2019-05-21 菲尼克斯电气公司 结构元件、定位装置、以及用于焊接固定所述结构元件的方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9852266B2 (en) * 2012-09-21 2017-12-26 Md Revolution, Inc. Interactive graphical user interfaces for implementing personalized health and wellness programs
DE102016224653B4 (de) 2016-12-12 2022-07-21 Vitesco Technologies Germany Gmbh Leiterplattenverbund und Verfahren zu dessen Herstellung

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5282751A (en) * 1991-07-31 1994-02-01 Nai Hock Lwee Connector apparatus
US5991154A (en) * 1997-10-07 1999-11-23 Thermalloy, Inc. Attachment of electronic device packages to heat sinks
CN1528110A (zh) * 2001-04-12 2004-09-08 奥地利西门子股份有限公司 用于将电气元件安装到线路支架的固定器部件
CN101146418A (zh) * 2006-09-11 2008-03-19 台达电子工业股份有限公司 散热器固定结构及其组装方法
CN101668391A (zh) * 2008-09-02 2010-03-10 深圳市龙岗区横岗光台电子厂 电路板组件及其制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6097609A (en) * 1998-12-30 2000-08-01 Intel Corporation Direct BGA socket
US6957963B2 (en) * 2000-01-20 2005-10-25 Gryphics, Inc. Compliant interconnect assembly
US6312266B1 (en) * 2000-08-24 2001-11-06 High Connection Density, Inc. Carrier for land grid array connectors
US6663399B2 (en) * 2001-01-31 2003-12-16 High Connection Density, Inc. Surface mount attachable land grid array connector and method of forming same
US6638077B1 (en) * 2001-02-26 2003-10-28 High Connection Density, Inc. Shielded carrier with components for land grid array connectors

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5282751A (en) * 1991-07-31 1994-02-01 Nai Hock Lwee Connector apparatus
US5991154A (en) * 1997-10-07 1999-11-23 Thermalloy, Inc. Attachment of electronic device packages to heat sinks
CN1528110A (zh) * 2001-04-12 2004-09-08 奥地利西门子股份有限公司 用于将电气元件安装到线路支架的固定器部件
CN101146418A (zh) * 2006-09-11 2008-03-19 台达电子工业股份有限公司 散热器固定结构及其组装方法
CN101668391A (zh) * 2008-09-02 2010-03-10 深圳市龙岗区横岗光台电子厂 电路板组件及其制造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109792842A (zh) * 2016-09-29 2019-05-21 菲尼克斯电气公司 结构元件、定位装置、以及用于焊接固定所述结构元件的方法
CN109792842B (zh) * 2016-09-29 2021-09-07 菲尼克斯电气公司 结构元件、定位装置、以及用于焊接固定所述结构元件的方法

Also Published As

Publication number Publication date
TW201301960A (zh) 2013-01-01
US8832932B2 (en) 2014-09-16
US20130003331A1 (en) 2013-01-03

Similar Documents

Publication Publication Date Title
EP3489858B1 (en) Mobile terminal and manufacturing method thereof
CN102300403A (zh) 一种pcb连接结构和连接方法
TWI267092B (en) Anisotropic conductive sheet
CN102858088A (zh) 电路板及其制作方法及采用该电路板的电子产品
JP2003051347A (ja) 電気コネクタ
CN101227805A (zh) 具有卡固功能的固定装置
US20130003330A1 (en) Connection unit for electronic devices
US20080151514A1 (en) Method and apparatus for interfacing components
US20080202802A1 (en) Printed circuit board module having two printed circuit boards for mounting inline package elements and adhibit elements respectively
CN104244578A (zh) 整合式电路板及电子装置
CN105449383A (zh) 一种导电连接弹片
JP2006024503A (ja) プリント配線基板へのジャックの固定構造
CN1942051A (zh) 印刷电路板的焊盘
CN104852172A (zh) 一种电子设备和电路板连接方法
CN220067798U (zh) 蓝牙板卡插接组件
CN207720525U (zh) 电路板组件
CN215345519U (zh) 一种便于安装的pcba板
CN213991287U (zh) 一种异形屏
KR102248047B1 (ko) 인쇄회로기판의 지지핀 위치 설정방법
KR100453514B1 (ko) 전자 기기의 터치 패널 및 제조 방법
US10297935B2 (en) Power supply and circuit board output structure thereof
KR20110066244A (ko) Fpcb 커넥터
US20080305660A1 (en) Display and circuit device thereof
KR20070069546A (ko) 통신 단말기의 디버그용 패턴을 갖는 인쇄회로기판 구조
JP2003017164A (ja) コネクタ及びその実装方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130102