TWI456379B - 電源系統及其組合式電源裝置 - Google Patents
電源系統及其組合式電源裝置 Download PDFInfo
- Publication number
- TWI456379B TWI456379B TW101126470A TW101126470A TWI456379B TW I456379 B TWI456379 B TW I456379B TW 101126470 A TW101126470 A TW 101126470A TW 101126470 A TW101126470 A TW 101126470A TW I456379 B TWI456379 B TW I456379B
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- Prior art keywords
- substrate
- power supply
- main carrier
- combined power
- supply device
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14324—Housings specially adapted for power drive units or power converters comprising modular units, e.g. DIN rail mounted units
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
- H05K7/08—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses on perforated boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/026—Multiple connections subassemblies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Combinations Of Printed Boards (AREA)
- Dc-Dc Converters (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Claims (15)
- 一種組合式電源裝置,用以將交流電源轉換為直流電源,該組合式電源裝置供安裝於一主載板上,該組合式電源裝置包含:一第一基板,具有一第一軸向及一大致垂直於該第一軸向之第二軸向,該第一基板插設於該主載板上,且該第二軸向大致垂直於該主載板;一驅動模組,直接地設於該第一基板之一側並電連接該第一基板,該驅動模組用以接收輸入該組合式電源裝置的電力,並驅動該組合式電源裝置;以及一轉換模組,位於該第一基板之另一側,並電連接於該驅動模組,該轉換模組接收通過該驅動模組的電壓源,並提供電壓轉換功能,使降低該電壓源的電壓值,其中,該轉換模組之長度大致等於該第一基板之第一軸向的長度,該轉換模組之寬度小於該第一基板之第一軸向的長度。
- 如申請專利範圍第1項所述之組合式電源裝置,其中該轉換模組包含:一第二基板,插設於該主載板並大致垂直於該主載板;一第三基板,位於該第一基板及該第二基板之間,該第三基板插設於該主載板並大致垂直於該主載板;一轉換單元,位於該第一基板;一控制單元,設置於該第二基板上並電連接於該第二基板;一信號傳遞單元,設置於該第三基板上並電連接於該第三基板, 該信號傳遞單元係電連接該控制單元及該轉換單元;以及一輸出單元,電連接於該主載板。
- 如申請專利範圍第2項所述之組合式電源裝置,更包含:一第四基板,位於該第二基板之相反設置該第三基板之一側,該第四基板插接於該主載板並大致垂直於該主載板,該輸出單元設置於該第四基板上並電連接於該第四基板。
- 如申請專利範圍第2項所述之組合式電源裝置,其中該輸出單元包含至少一電容器及至少一電感器。
- 如申請專利範圍第2項所述之組合式電源裝置,其中該轉換模組更包含:一第一連接器,設置於該第一基板;一第二連接器,設置於該第二基板;一第三連接器,設置於該第三基板並與該第一連接器結合,使電連接該轉換單元及該信號傳遞單元;以及一第四連接器,設置於該第三基板並與該第二連接器結合,使電連接該信號傳遞單元及該控制單元。
- 如申請專利範圍第2項所述之組合式電源裝置,更包含一承載座,該承載座包含一第一板體、一第二板體、及一連接部,該連接部連接該第一板體及該第二板體,該第一板體、該第二板體及該連接部配合構成一容置空間,該轉換單元位於該容置空間,該連接部包含複數支撐件,用以插設於該主載板上。
- 如申請專利範圍第3項所述之組合式電源裝置,其中該第一基板、該第二基板及該第四基板之一端部具有至少一凸柱,該等凸柱分別地插設於形成於該主載板上之複數插槽,並與該主載板形成電性連接。
- 如申請專利範圍第3項所述之組合式電源裝置,更包含一中介載板,該第二基板及該第四基板相反插設於該主載板之另一端部分別地插設於該中介載板。
- 如申請專利範圍第8項所述之組合式電源裝置,其中該中介載板包含:一多層電路板;一第一金屬層,貼附於該多層電路板之一側面;以及一第二金屬層,貼附於該多層電路板之另一側面。
- 如申請專利範圍第1項所述之組合式電源裝置,更包含:一第二基板,大致平行於該主載板並位於該第一基板相反插設該主載板之一側,該第一基板插設於該第二基板;一轉換單元,設於該第二基板上並電連接於該第二基板;一控制單元,設於該第二基板上並電連接於該第二基板;以及一輸出單元,設置於該第二基板上並電連接於該第二基板。
- 如申請專利範圍第10項所述之組合式電源裝置,更包含一第一連接柱,插設於該第二基板及該主載板,用以電連接該第二基板及該主載板。
- 如申請專利範圍第11項所述之組合式電源裝置,更包含:一導電層,貼附於該第二基板上,該導電層電連接該輸出單元;至少一第二連接柱,位於該第二基板及該主載板之間;以及一連結件,結合該導電層及該等第二連接柱。
- 如申請專利範圍第1項所述之組合式電源裝置,更包含:一第一絕緣散熱板,位於該第一基板之一側;一第二絕緣散熱板,位於該第一基板之另一側;以及複數固定件,貫穿該第一絕緣散熱板並鎖固於該第二絕緣散熱板 。
- 一種電源系統,包含:一主載板;以及複數如專利範圍第1項至第13項中任一項之組合式電源裝置,該等組合式電源裝置安裝於該主載板上,且該等組合式電源裝置呈並聯連接。
- 如申請專利範圍第14項所述之電源系統,其中該等組合式電源裝置並列地設置於該主載板上。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101126470A TWI456379B (zh) | 2012-07-23 | 2012-07-23 | 電源系統及其組合式電源裝置 |
US13/647,385 US9198319B2 (en) | 2012-07-23 | 2012-10-09 | Modular power device |
US14/882,208 US9271420B1 (en) | 2012-07-23 | 2015-10-13 | Modular power device |
US14/882,163 US9271419B1 (en) | 2012-07-23 | 2015-10-13 | Modular power device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101126470A TWI456379B (zh) | 2012-07-23 | 2012-07-23 | 電源系統及其組合式電源裝置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201405281A TW201405281A (zh) | 2014-02-01 |
TWI456379B true TWI456379B (zh) | 2014-10-11 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101126470A TWI456379B (zh) | 2012-07-23 | 2012-07-23 | 電源系統及其組合式電源裝置 |
Country Status (2)
Country | Link |
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US (3) | US9198319B2 (zh) |
TW (1) | TWI456379B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10355608B2 (en) | 2017-09-19 | 2019-07-16 | Chicony Power Technology Co., Ltd. | Power converter module |
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WO2015178880A1 (en) * | 2014-05-19 | 2015-11-26 | Hewlett-Packard Development Company, L.P. | Substrate sprayer |
CN106465542B (zh) * | 2014-05-22 | 2019-07-05 | 飞利浦照明控股有限公司 | 印刷电路板装置和用于将产品安装至主印刷电路板的方法 |
DE102015217426A1 (de) * | 2015-09-11 | 2017-03-16 | Zf Friedrichshafen Ag | Mehrfunktionale Hochstromleiterplatte |
JP6451655B2 (ja) * | 2016-01-15 | 2019-01-16 | 株式会社村田製作所 | 複合電子部品 |
TWI647995B (zh) * | 2016-05-30 | 2019-01-11 | 財團法人工業技術研究院 | 插拔式功率模組及次系統 |
DE102016224653B4 (de) * | 2016-12-12 | 2022-07-21 | Vitesco Technologies Germany Gmbh | Leiterplattenverbund und Verfahren zu dessen Herstellung |
KR102622914B1 (ko) * | 2017-02-06 | 2024-01-10 | 삼성전자주식회사 | 전력 공급 장치 및 전력 공급 장치를 포함하는 전자 장치 |
TWM577968U (zh) * | 2019-01-19 | 2019-05-11 | 擎宏電子企業有限公司 | Adapter plate structure for DC power supply power module |
JP7111079B2 (ja) * | 2019-09-10 | 2022-08-02 | 株式会社デンソー | 電力変換装置 |
JP7273077B2 (ja) * | 2021-01-15 | 2023-05-12 | 矢崎総業株式会社 | 基板ユニット及び基板ユニットの製造方法 |
CN113707643A (zh) * | 2021-08-30 | 2021-11-26 | 中国振华集团永光电子有限公司(国营第八七三厂) | 一种高集成高可靠igbt功率模块及其制造方法 |
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2012
- 2012-07-23 TW TW101126470A patent/TWI456379B/zh active
- 2012-10-09 US US13/647,385 patent/US9198319B2/en active Active
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2015
- 2015-10-13 US US14/882,163 patent/US9271419B1/en active Active
- 2015-10-13 US US14/882,208 patent/US9271420B1/en active Active
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CN101581914B (zh) * | 2009-06-26 | 2011-06-15 | 江苏北斗科技有限公司 | 电力系统授时装置的模块化结构 |
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US10355608B2 (en) | 2017-09-19 | 2019-07-16 | Chicony Power Technology Co., Ltd. | Power converter module |
Also Published As
Publication number | Publication date |
---|---|
US20160037671A1 (en) | 2016-02-04 |
US20140022737A1 (en) | 2014-01-23 |
US9271420B1 (en) | 2016-02-23 |
US9271419B1 (en) | 2016-02-23 |
US9198319B2 (en) | 2015-11-24 |
US20160037670A1 (en) | 2016-02-04 |
TW201405281A (zh) | 2014-02-01 |
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