JP6818141B2 - 二次電池用電解銅箔及びその製造方法 - Google Patents
二次電池用電解銅箔及びその製造方法 Download PDFInfo
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 179
- 239000011889 copper foil Substances 0.000 title claims description 167
- 238000004519 manufacturing process Methods 0.000 title claims description 24
- 238000003825 pressing Methods 0.000 claims description 52
- 238000007747 plating Methods 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 14
- 238000009713 electroplating Methods 0.000 claims description 13
- 239000006182 cathode active material Substances 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 229910052799 carbon Inorganic materials 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 239000000243 solution Substances 0.000 description 16
- 239000008151 electrolyte solution Substances 0.000 description 10
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 229910001431 copper ion Inorganic materials 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 6
- 239000000460 chlorine Substances 0.000 description 6
- 229910052801 chlorine Inorganic materials 0.000 description 6
- 239000011149 active material Substances 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000002265 prevention Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000872 buffer Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910000457 iridium oxide Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
- H01M10/0525—Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/04—Processes of manufacture in general
- H01M4/0402—Methods of deposition of the material
- H01M4/0404—Methods of deposition of the material by coating on electrode collectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/04—Processes of manufacture in general
- H01M4/043—Processes of manufacture in general involving compressing or compaction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/66—Selection of materials
- H01M4/661—Metal or alloys, e.g. alloy coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
Description
(実施例1)
銅イオン100g/L、硫酸130g/L、塩素30ppm、TOC360ppmを含むめっき液を用意して、50℃、90ASDの電流密度で、ドラムを利用して電解めっきを実行した。その後、電解めっきによって形成された電解銅箔に陰極活物質をコーティングした後、4Mpaでプレスした。
めっき液内に含まれるTOCの濃度と、電解銅箔を製造した後、プレスの強度を下記表1及び表2のように実行することを除いて実施例1と同様に製造した。
比較例1乃至比較例3は、めっき液の製造の時、TOCの濃度をすべて下記表2のように、100ppm以下で投入することを除いて実施例1と同じ条件で電解銅箔を製造した。
Claims (14)
- TOC(総有機炭素;Total organic carbon)を含むめっき液でドラムを利用して製造された二次電池用電解銅箔であって、
前記電解銅箔は、前記ドラムと直接に接する一面と、前記一面の反対面である他面からなり、ドラムと直接に接する一面のグレインサイズの断面平均は、0.5μm乃至1.55μmであり、かつ、前記一面の反対面である他面のグレインサイズの断面平均は、1.5μm乃至2.1μmである、
前記一面のグレインサイズの断面平均は、前記他面のグレインサイズの断面平均に対して、80%以下である、二次電池用電解銅箔。 - 前記電解銅箔は、陰極活物質がコーティングされた後にプレスされ、プレス前の電解銅箔のグレインサイズの断面平均が、0.5μm乃至1μm以下であり、プレス後の電解銅箔のグレインサイズの断面平均が、プレス前のグレインサイズの断面平均の90%以上である、請求項1に記載の二次電池用電解銅箔。
- 前記電解銅箔は、プレス後のグレインサイズの断面平均が0.45μm乃至0.9μmである、請求項2に記載の二次電池用電解銅箔。
- 前記めっき液中に含まれるTOCの濃度は、100ppm以上である、請求項1に記載の二次電池用電解銅箔。
- 前記プレスの強度は、4Mpa以上である、請求項2に記載の二次電池用電解銅箔。
- 前記電解銅箔の引張強度は、30kgf/mm2乃至50kgf/mm2である、請求項1に記載の二次電池用電解銅箔。
- 前記電解銅箔の延伸率は、2%乃至12%である、請求項1に記載の二次電池用電解銅箔。
- 前記電解銅箔の厚さは、2μm乃至10μmである、請求項1に記載の二次電池用電解銅箔。
- 二次電池用電解銅箔の製造方法であって、
(1)銅、TOCを含むめっき液を用意するステップと、
(2)温度が30℃乃至70℃である条件で、電流密度30ASD乃至150ASDを
加え、ドラムを利用して電解めっきを実行するステップと、及び
(3)前記電解めっきによって形成された電解銅箔に陰極活物質をコーティングした後
、プレスするステップとを含み、
前記ステップ(2)を介する電解めっきによって形成された電解銅箔は、前記ドラムと接する一面と、前記一面の反対面である他面からなり、
ドラムと直接に接する一面のグレインサイズの断面平均は、0.5μm乃至1.55μmであり、かつ、前記一面の反対面である他面のグレインサイズの断面平均は、1.5μm乃至2.1μmである、
前記一面のグレインサイズの断面平均は、前記他面のグレインサイズの断面平均に対して、80%以下である、前記二次電池用電解銅箔の製造方法。 - 前記めっき液中に含まれるTOCの濃度は、100ppm以上である、請求項9に記載の二次電池用電解銅箔の製造方法。
- 前記電解銅箔の引張強度は、30kgf/mm2乃至50kgf/mm2である、請求項9に記載の二次電池用電解銅箔の製造方法。
- 前記電解銅箔の延伸率は、2%乃至15%である、請求項9に記載の二次電池用電解銅箔の製造方法。
- 前記電解銅箔の厚さは、2μm乃至10μmである、請求項9に記載の二次電池用電解銅箔の製造方法。
- 前記電解銅箔は、プレス前のグレインサイズの断面平均が0.5μm乃至1μm以下であり、プレス後のグレインサイズの断面平均が前記プレス前のグレインサイズの断面平均の90%以上である、請求項9に記載の二次電池用電解銅箔の製造方法。
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KR1020160150349A KR101755203B1 (ko) | 2016-11-11 | 2016-11-11 | 이차전지용 전해동박 및 그의 제조방법 |
KR10-2016-0150349 | 2016-11-11 | ||
PCT/KR2017/003375 WO2018088646A1 (ko) | 2016-11-11 | 2017-03-28 | 이차전지용 전해동박 및 그의 제조방법 |
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JP2019536211A JP2019536211A (ja) | 2019-12-12 |
JP6818141B2 true JP6818141B2 (ja) | 2021-01-20 |
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US (2) | US10920330B2 (ja) |
EP (1) | EP3540832A4 (ja) |
JP (1) | JP6818141B2 (ja) |
KR (1) | KR101755203B1 (ja) |
CN (1) | CN109952674B (ja) |
TW (1) | TWI634239B (ja) |
WO (1) | WO2018088646A1 (ja) |
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US20220112618A1 (en) * | 2018-12-10 | 2022-04-14 | Nippon Denkai, Ltd. | Electrolytic copper foil and method for producing same |
US10581081B1 (en) * | 2019-02-01 | 2020-03-03 | Chang Chun Petrochemical Co., Ltd. | Copper foil for negative electrode current collector of lithium ion secondary battery |
KR20210062204A (ko) * | 2019-11-21 | 2021-05-31 | 에스케이넥실리스 주식회사 | 주름 발생이 방지된 동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법 |
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KR101449342B1 (ko) * | 2013-11-08 | 2014-10-13 | 일진머티리얼즈 주식회사 | 전해동박, 이를 포함하는 전기부품 및 전지 |
CN107078305B (zh) * | 2015-01-19 | 2020-06-12 | 古河电气工业株式会社 | 锂离子二次电池用表面处理电解铜箔、使用该铜箔的锂离子二次电池用电极以及锂离子二次电池 |
JP6014186B2 (ja) * | 2015-03-03 | 2016-10-25 | イルジン マテリアルズ カンパニー リミテッドIljin Materials Co., Ltd. | 電解銅箔、これを含む電気部品および電池 |
US9899683B2 (en) * | 2015-03-06 | 2018-02-20 | Iljin Materials Co., Ltd. | Electrolytic copper foil, electric component and battery including the same |
JP2016184482A (ja) * | 2015-03-26 | 2016-10-20 | 日立オートモティブシステムズ株式会社 | 二次電池 |
US9287566B1 (en) * | 2015-04-17 | 2016-03-15 | Chang Chun Petrochemical Co., Ltd. | Anti-curl copper foil |
US9709348B2 (en) * | 2015-10-27 | 2017-07-18 | Chang Chun Petrochemical Co., Ltd. | Heat-dissipating copper foil and graphene composite |
DE102015224464A1 (de) * | 2015-12-07 | 2017-06-08 | Aurubis Stolberg Gmbh & Co. Kg | Kupfer-Keramik-Substrat, Kupferhalbzeug zur Herstellung eines Kupfer-Keramik-Substrats und Verfahren zur Herstellung eines Kupfer-Keramik-Substrats |
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TW201817922A (zh) | 2018-05-16 |
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US11118279B2 (en) | 2021-09-14 |
US20200165738A1 (en) | 2020-05-28 |
TWI634239B (zh) | 2018-09-01 |
JP2019536211A (ja) | 2019-12-12 |
KR101755203B1 (ko) | 2017-07-10 |
EP3540832A1 (en) | 2019-09-18 |
US10920330B2 (en) | 2021-02-16 |
EP3540832A4 (en) | 2020-10-21 |
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CN109952674B (zh) | 2022-03-01 |
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