JP6814588B2 - パルスレーザー光線のスポット形状検出方法 - Google Patents
パルスレーザー光線のスポット形状検出方法 Download PDFInfo
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- JP6814588B2 JP6814588B2 JP2016196326A JP2016196326A JP6814588B2 JP 6814588 B2 JP6814588 B2 JP 6814588B2 JP 2016196326 A JP2016196326 A JP 2016196326A JP 2016196326 A JP2016196326 A JP 2016196326A JP 6814588 B2 JP6814588 B2 JP 6814588B2
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- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 238000012360 testing method Methods 0.000 claims description 2
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- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
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- 229910052594 sapphire Inorganic materials 0.000 description 1
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J1/4257—Photometry, e.g. photographic exposure meter using electric radiation detectors applied to monitoring the characteristics of a beam, e.g. laser beam, headlamp beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/705—Beam measuring device
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
- B23K31/125—Weld quality monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Quality & Reliability (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
3 チャックテーブル(保持手段)
4 レーザー光線照射手段
20 加工送り手段
42 レーザー光線発振手段
43 光学系
44 集光器
50 撮像手段
60 制御手段
61 記憶手段
LS レーザースポット
S 隙間
TS 検査用ウェーハ
W ウェーハ(被加工物)
Claims (1)
- 被加工物を保持する保持手段と、該保持手段に保持された被加工物にレーザー光線を照射するレーザー光線照射手段と、該保持手段と該レーザー光線照射手段とを加工送り方向に相対的に移動させる加工送り手段と、該保持手段に保持された被加工物の上面を撮像する撮像手段と、制御手段と、を具備し、該レーザー光線照射手段は、パルスレーザー光線を発振するレーザー光線発振手段と、該レーザー光線発振手段が発振したパルスレーザー光線を集光して該保持手段に保持された被加工物に照射する集光器と、該レーザー光線発振手段と該集光器との間に配設されレーザー光線発振手段が発振したレーザー光線を伝送する光学系とを具備しているレーザー加工装置において、該レーザー光線発振手段によって発振された該パルスレーザー光線のスポット形状を検出するパルスレーザー光線のスポット形状検出方法であって、
該保持手段上に検査用ウェーハを載置する検査用ウェーハ載置ステップと、
該検査用ウェーハ載置ステップを実施した後に、該検査用ウェーハ上面に集光点を位置づけて該検査用ウェーハに対して吸収性を有する波長のパルスレーザー光線を照射して隣接するレーザースポット間に隙間を介在させて連続して照射し、複数のレーザースポットを形成するレーザースポット形成ステップと、
該レーザースポット形成ステップを実施した後に、該撮像手段によりレーザースポットを撮像し、該制御手段により撮像したレーザースポット画像から該レーザースポットの輪郭を抽出し、予め記憶手段に記憶されている理想のレーザースポット形状の輪郭との類似度を算出し、該類似度がしきい値を下回る場合に、該レーザースポット形状は適正でないと判定する判定ステップと、
該判定ステップで該レーザースポット形状が適正でないと判定された場合に、その旨を報知する報知ステップと、から構成され、
該レーザースポット形成ステップにおいて、該光学系又は該集光器に不純物が付着している場合にパルスレーザー光線が光学系及び該集光器を通過するとパルスレーザー光線の通過経路の部材が発熱し膨張が生じる所定時間経過後に、該検査用ウェーハ上にレーザースポットを形成するパルスレーザー光線のスポット形状検出方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016196326A JP6814588B2 (ja) | 2016-10-04 | 2016-10-04 | パルスレーザー光線のスポット形状検出方法 |
TW106130302A TWI729201B (zh) | 2016-10-04 | 2017-09-05 | 脈衝雷射光線的光點形狀檢測方法 |
CN201710880932.3A CN107894214B (zh) | 2016-10-04 | 2017-09-26 | 脉冲激光光线的光斑形状检测方法 |
KR1020170124185A KR102312237B1 (ko) | 2016-10-04 | 2017-09-26 | 펄스 레이저 광선의 스폿 형상 검출 방법 |
US15/723,771 US10648855B2 (en) | 2016-10-04 | 2017-10-03 | Method of detecting spot shape of pulsed laser beam |
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JP2016196326A JP6814588B2 (ja) | 2016-10-04 | 2016-10-04 | パルスレーザー光線のスポット形状検出方法 |
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JP2018058081A JP2018058081A (ja) | 2018-04-12 |
JP6814588B2 true JP6814588B2 (ja) | 2021-01-20 |
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Country Status (5)
Country | Link |
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US (1) | US10648855B2 (ja) |
JP (1) | JP6814588B2 (ja) |
KR (1) | KR102312237B1 (ja) |
CN (1) | CN107894214B (ja) |
TW (1) | TWI729201B (ja) |
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CN109822231A (zh) * | 2019-02-15 | 2019-05-31 | 英特尔产品(成都)有限公司 | 检测用于晶圆划片的激光光束的质量的方法和装置 |
JP2022065259A (ja) * | 2020-10-15 | 2022-04-27 | 株式会社ディスコ | レーザー加工装置 |
CN112828451B (zh) * | 2020-12-31 | 2023-09-22 | 华灿光电(浙江)有限公司 | 发光二极管芯片的激光切割方法及装置 |
Family Cites Families (16)
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JPH0899186A (ja) * | 1994-09-30 | 1996-04-16 | A G Technol Kk | レーザ加工装置 |
JP2001044532A (ja) * | 1999-07-28 | 2001-02-16 | Nec Corp | レーザビーム品質監視システム |
JP2001284281A (ja) * | 2000-03-30 | 2001-10-12 | Sumitomo Heavy Ind Ltd | レーザ加工装置及び方法 |
KR100486088B1 (ko) * | 2002-08-21 | 2005-04-29 | 주식회사 이오테크닉스 | 포스트 비젼 카메라를 이용한 레이저 마킹시스템의 마킹보정방법 |
US7846152B2 (en) * | 2004-03-24 | 2010-12-07 | Amo Manufacturing Usa, Llc. | Calibrating laser beam position and shape using an image capture device |
JP4231349B2 (ja) * | 2003-07-02 | 2009-02-25 | 株式会社ディスコ | レーザー加工方法およびレーザー加工装置 |
JP4684717B2 (ja) | 2005-04-06 | 2011-05-18 | 株式会社ディスコ | ウエーハのレーザー加工方法およびレーザー加工装置 |
JPWO2010137637A1 (ja) * | 2009-05-27 | 2012-11-15 | 株式会社ニコン | 形状測定装置、形状測定方法、および、製造方法 |
JP5797963B2 (ja) * | 2011-07-25 | 2015-10-21 | 株式会社ディスコ | レーザー光線のスポット形状検出方法 |
JP5902490B2 (ja) * | 2012-01-25 | 2016-04-13 | 株式会社ディスコ | レーザー光線のスポット形状検出方法およびスポット形状検出装置 |
KR101358287B1 (ko) * | 2012-04-27 | 2014-02-05 | (주)하드램 | 레이저 빔 스캔 장치의 캘리브레이션 시스템 |
KR101531816B1 (ko) * | 2014-05-21 | 2015-06-25 | 주식회사 엘아이에스 | 웨이퍼 마킹장치의 마킹위치 보정방법 |
US20150364374A1 (en) * | 2014-06-12 | 2015-12-17 | Toshiba Corporation | Semiconductor Device Die Singulation by Discontinuous Laser Scribe and Break |
JP6328521B2 (ja) * | 2014-08-18 | 2018-05-23 | 株式会社ディスコ | レーザー光線のスポット形状検出方法 |
KR102313363B1 (ko) * | 2015-01-12 | 2021-10-18 | 삼성디스플레이 주식회사 | 레이저 어닐링 장치 |
CN106595482B (zh) * | 2016-12-14 | 2019-06-04 | 海信集团有限公司 | 激光投影系统的光斑测量方法及装置 |
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- 2016-10-04 JP JP2016196326A patent/JP6814588B2/ja active Active
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2017
- 2017-09-05 TW TW106130302A patent/TWI729201B/zh active
- 2017-09-26 CN CN201710880932.3A patent/CN107894214B/zh active Active
- 2017-09-26 KR KR1020170124185A patent/KR102312237B1/ko active IP Right Grant
- 2017-10-03 US US15/723,771 patent/US10648855B2/en active Active
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Publication number | Publication date |
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JP2018058081A (ja) | 2018-04-12 |
CN107894214A (zh) | 2018-04-10 |
CN107894214B (zh) | 2021-06-04 |
TWI729201B (zh) | 2021-06-01 |
US20180094972A1 (en) | 2018-04-05 |
US10648855B2 (en) | 2020-05-12 |
KR102312237B1 (ko) | 2021-10-12 |
TW201816863A (zh) | 2018-05-01 |
KR20180037580A (ko) | 2018-04-12 |
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