JP6813671B2 - 部品をはんだ付けにより固定する方法 - Google Patents
部品をはんだ付けにより固定する方法 Download PDFInfo
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- JP6813671B2 JP6813671B2 JP2019514306A JP2019514306A JP6813671B2 JP 6813671 B2 JP6813671 B2 JP 6813671B2 JP 2019514306 A JP2019514306 A JP 2019514306A JP 2019514306 A JP2019514306 A JP 2019514306A JP 6813671 B2 JP6813671 B2 JP 6813671B2
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- 238000005476 soldering Methods 0.000 title claims description 29
- 238000000034 method Methods 0.000 claims description 36
- 229910000679 solder Inorganic materials 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 16
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 4
- 230000005484 gravity Effects 0.000 description 7
- 230000033001 locomotion Effects 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0263—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for positioning or holding parts during soldering or welding process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
- H01R12/707—Soldering or welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/50—Bases; Cases formed as an integral body
- H01R13/501—Bases; Cases formed as an integral body comprising an integral hinge or a frangible part
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10606—Permanent holder for component or auxiliary printed circuits mounted on a printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0182—Using a temporary spacer element or stand-off during processing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
−コンタクト穴を有するプリント回路基板を提供するステップと、
−コンタクト穴の中に電気接続要素に入れて、部品をプリント回路基板上に配置するステップと、
−部品を支持するように、プリント回路基板上に位置決め装置の少なくとも1つの保持要素を解放可能に配置するステップであって、保持要素は少なくとも部分的にコンタクト要素又は支持要素を取り囲み、及び/又はコンタクト要素と係合するようなステップと、
−少なくとも1つのコンタクト穴に液体はんだ材料を充填し、はんだ材料を固化させるステップ又は
−少なくとも1つのコンタクト穴の中にすでにあるはんだ材料を溶融させ、固化するステップと、
−位置決め装置を取り除くステップ、を提供する。
−追加的に、プリント回路基板に少なくとも1つの、好ましくはメタライズされた受け穴を提供するステップであって、少なくとも1つの受け穴は少なくとも、固定要素の断面より大きい直径を有し、それよって固定要素を受け穴の中に力を入れずに挿入できるようなステップと、
−少なくとも1つのコンタクト穴と少なくとも1つの受け穴とに液体はんだ材料を充填し、はんだ材料を固化するステップ又は、
−少なくとも1つのコンタクト穴及び少なくとも1つの受け穴の中にすでにあったはんだ材料を溶融させ、固化するステップと、
を提供できる。
−コンタクト穴と少なくとも1つの受け穴とを有するプリント回路基板を提供するステップであって、少なくとも1つの受け穴は少なくとも、固定要素の断面より大きい直径を有し、それによって固定要素を力を入れずに受け穴に挿入できるようなステップと、
−部品をプリント回路基板上に、電気接続要素がコンタクト穴の中に入り、部品の固定要素の少なくとも1つのラッチング手段がプリント回路基板の少なくとも1つの受け穴の中に力を加えずに入る状態で配置し、固定要素のラッチング手段が受け穴の中又は受け穴を通って位置決めされるようにするステップと、
−少なくとも1つのコンタクト穴と少なくとも1つの受け穴とに液体はんだ材料を充填し、はんだ材料を固化するステップ又は
−少なくとも1つのコンタクト穴と少なくとも1つの受け穴との中にすでにあったはんだ材料を溶融させ、固化するステップと、
を提供する。
Claims (5)
- 部品(4)であって、プリント回路基板(1)と接触するための電気接続要素(5)と、前記部品(4)を機械的に固定するための少なくとも1つの固定要素(8)を有する部品(4)を前記プリント回路基板(1)にはんだ付けにより固定する方法であって、前記少なくとも1つの固定要素(8)は、軸方向に作用する少なくとも1つのラッチング手段(11)を有するシャフト(8)を有するような方法において、
コンタクト穴(18)を有し、少なくとも1つの受け穴(2)を有するプリント回路基板(1)を提供するステップであって、前記少なくとも1つの受け穴(2)は少なくとも、前記固定要素(8)の断面より大きい直径を有し、それによって前記固定要素(8)を前記受け穴(2)の中に力を入れずに挿入できるようなステップと、
前記部品(4)を前記プリント回路基板(1)に、前記電気接続要素(5)が前記コンタクト穴(18)の中に入り、前記部品(4)の前記固定要素(8)の前記少なくとも1つのラッチング手段(11)が前記プリント回路基板(1)の前記少なくとも1つの受け穴(2)の中に力を入れずに入る状態で配置し、それによって前記固定要素(8)の前記ラッチング手段(11)が前記受け穴(2)の中に、又は前記受け穴(2)を通って位置決めされるようにするステップと、
前記少なくとも1つのコンタクト穴(18)と前記少なくとも1つの受け穴(2)に液体のはんだ材料(17)を充填し、前記はんだ材料(17)を固化するステップ又は、
前記少なくとも1つのコンタクト穴(18)と前記少なくとも1つの受け穴(2)の中にすでにあるはんだ材料(17)を溶融させ、固化するステップ
を特徴とする方法。 - 前記部品(4)に解放可能に接続できる少なくとも1つの保持要素(15)と少なくとも1つの支持部(16)を有する少なくとも1つの位置決め装置(14)を前記プリント回路基板(1)又は隣接するプリント回路基板(1)上に配置するステップであって、前記少なくとも1つの位置決め装置(14)は前記部品(4)を前記保持要素(15)によって保持し、プリント回路基板(1)上に前記支持部(16)によって解放可能に支持されるようなステップと、前記はんだ材料(17)が固化した後に前記位置決め装置(14)を取り除くステップを特徴とする、請求項1に記載の方法。
- 前記少なくとも1つの保持要素(15)は少なくとも、前記部品(4)上に配置されたコンタクト要素(6)又は支持要素(13)を少なくとも部分的に包囲し、及び/又は前記コンタクト要素(6)と係合することを特徴とする、請求項2に記載の方法。
- 少なくとも1つの追加の支持要素(13)を有する部品(4)を前記プリント回路基板(1)上に配置するステップであって、前記支持要素は前記部品(4)を前記プリント回路基板(1)又は隣接するプリント回路基板上に支持するようなステップを特徴とする、請求項1に記載の方法。
- 前記少なくとも1つの支持要素(13)は、前記はんだ材料(17)が固化した後に取り除かれることを特徴とする、請求項4に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102016118527.2A DE102016118527A1 (de) | 2016-09-29 | 2016-09-29 | Bauelement, Positioniervorrichtung und Verfahren zur Lötbefestigung des Bauelements |
DE102016118527.2 | 2016-09-29 | ||
PCT/DE2017/100822 WO2018059625A1 (de) | 2016-09-29 | 2017-09-26 | Bauelement, positioniervorrichtung und verfahren zur lötbefestigung des bauelements |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019530231A JP2019530231A (ja) | 2019-10-17 |
JP6813671B2 true JP6813671B2 (ja) | 2021-01-13 |
Family
ID=60201273
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019514306A Active JP6813671B2 (ja) | 2016-09-29 | 2017-09-26 | 部品をはんだ付けにより固定する方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11688989B2 (ja) |
EP (1) | EP3520581B1 (ja) |
JP (1) | JP6813671B2 (ja) |
CN (1) | CN109792842B (ja) |
DE (1) | DE102016118527A1 (ja) |
WO (1) | WO2018059625A1 (ja) |
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DE102017104819A1 (de) | 2017-03-08 | 2018-09-13 | Phoenix Contact Gmbh & Co. Kg | Bauelement, Bestückungshilfe und Verfahren zur Lötbefestigung des Bauelements |
JP7482021B2 (ja) * | 2020-12-25 | 2024-05-13 | 日本航空電子工業株式会社 | 電気部品 |
DE102021111250B4 (de) * | 2021-04-30 | 2023-03-16 | Te Connectivity Germany Gmbh | Anordnung zur Sicherung einer Leiterplatte an einem Steckerkörper, Verfahren zur Sicherung einer Leiterplatte an einem Steckerkörper |
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JP5737252B2 (ja) * | 2012-09-25 | 2015-06-17 | 株式会社村田製作所 | 回路装置とその製造方法 |
US9437997B2 (en) | 2013-04-26 | 2016-09-06 | Signalcraft Technologies | Process for attaching devices to a circuit board |
CN204560052U (zh) * | 2015-05-08 | 2015-08-12 | 宁波晨翔电子有限公司 | 一种固定底座 |
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2016
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- 2017-09-26 WO PCT/DE2017/100822 patent/WO2018059625A1/de unknown
- 2017-09-26 JP JP2019514306A patent/JP6813671B2/ja active Active
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US11688989B2 (en) | 2023-06-27 |
JP2019530231A (ja) | 2019-10-17 |
CN109792842B (zh) | 2021-09-07 |
US20190363500A1 (en) | 2019-11-28 |
WO2018059625A1 (de) | 2018-04-05 |
EP3520581A1 (de) | 2019-08-07 |
DE102016118527A1 (de) | 2018-03-29 |
CN109792842A (zh) | 2019-05-21 |
EP3520581B1 (de) | 2024-05-08 |
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