JP6806024B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP6806024B2
JP6806024B2 JP2017193299A JP2017193299A JP6806024B2 JP 6806024 B2 JP6806024 B2 JP 6806024B2 JP 2017193299 A JP2017193299 A JP 2017193299A JP 2017193299 A JP2017193299 A JP 2017193299A JP 6806024 B2 JP6806024 B2 JP 6806024B2
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Japan
Prior art keywords
press
wall portion
semiconductor device
recess
insulating substrate
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Active
Application number
JP2017193299A
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English (en)
Japanese (ja)
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JP2019067970A (ja
JP2019067970A5 (enExample
Inventor
秀俊 石橋
秀俊 石橋
晋助 浅田
晋助 浅田
義孝 木村
義孝 木村
稔 江草
稔 江草
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2017193299A priority Critical patent/JP6806024B2/ja
Priority to US15/959,353 priority patent/US10388581B2/en
Priority to DE102018212828.6A priority patent/DE102018212828B4/de
Priority to CN201811139732.3A priority patent/CN109599372B/zh
Publication of JP2019067970A publication Critical patent/JP2019067970A/ja
Publication of JP2019067970A5 publication Critical patent/JP2019067970A5/ja
Application granted granted Critical
Publication of JP6806024B2 publication Critical patent/JP6806024B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
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    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
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    • H01L2224/45124—Aluminium (Al) as principal constituent
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    • H01L2224/48153—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
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    • H01L2224/48157—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2017193299A 2017-10-03 2017-10-03 半導体装置 Active JP6806024B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017193299A JP6806024B2 (ja) 2017-10-03 2017-10-03 半導体装置
US15/959,353 US10388581B2 (en) 2017-10-03 2018-04-23 Semiconductor device having press-fit terminals disposed in recesses in a case frame
DE102018212828.6A DE102018212828B4 (de) 2017-10-03 2018-08-01 Halbleitervorrichtung
CN201811139732.3A CN109599372B (zh) 2017-10-03 2018-09-28 半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017193299A JP6806024B2 (ja) 2017-10-03 2017-10-03 半導体装置

Publications (3)

Publication Number Publication Date
JP2019067970A JP2019067970A (ja) 2019-04-25
JP2019067970A5 JP2019067970A5 (enExample) 2020-01-09
JP6806024B2 true JP6806024B2 (ja) 2020-12-23

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JP2017193299A Active JP6806024B2 (ja) 2017-10-03 2017-10-03 半導体装置

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US (1) US10388581B2 (enExample)
JP (1) JP6806024B2 (enExample)
CN (1) CN109599372B (enExample)
DE (1) DE102018212828B4 (enExample)

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KR102500480B1 (ko) * 2017-12-22 2023-02-16 삼성전자주식회사 접촉 부재를 포함하는 전자 장치 및 그 제작 방법
JP7180570B2 (ja) * 2019-09-03 2022-11-30 三菱電機株式会社 半導体モジュール
JP7224272B2 (ja) 2019-10-30 2023-02-17 三菱電機株式会社 パワー半導体装置
CN111162057B (zh) * 2020-01-06 2022-01-21 珠海格力电器股份有限公司 半导体功率器件及用于半导体功率器件的功率处理组件
EP3961697A1 (de) * 2020-08-25 2022-03-02 Siemens Aktiengesellschaft Halbleitermodul mit einer vertiefung
DE102022118268A1 (de) * 2022-07-21 2024-02-01 Semikron Elektronik Gmbh & Co. Kg Baugruppe mit einem Kunststoffformkörper und einer Mehrzahl von Lastanschlusselementen und Leistungshalbleitereinrichtung hiermit
EP4336551B1 (en) 2022-09-09 2025-09-03 Hitachi Energy Ltd Power module comprising a semiconductor module component and an alignment part, and method for forming the power module

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JP5383621B2 (ja) * 2010-10-20 2014-01-08 三菱電機株式会社 パワー半導体装置
CN103210489B (zh) * 2010-11-16 2016-06-15 富士电机株式会社 半导体装置
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US20190103330A1 (en) 2019-04-04
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