CN109599372B - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN109599372B
CN109599372B CN201811139732.3A CN201811139732A CN109599372B CN 109599372 B CN109599372 B CN 109599372B CN 201811139732 A CN201811139732 A CN 201811139732A CN 109599372 B CN109599372 B CN 109599372B
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China
Prior art keywords
wall
semiconductor device
insulating substrate
main body
press
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CN201811139732.3A
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English (en)
Chinese (zh)
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CN109599372A (zh
Inventor
石桥秀俊
浅田晋助
木村义孝
江草稔
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication of CN109599372A publication Critical patent/CN109599372A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/657—Shapes or dispositions of interconnections on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/755—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a laterally-adjacent insulating package substrate, interpose or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
CN201811139732.3A 2017-10-03 2018-09-28 半导体装置 Active CN109599372B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-193299 2017-10-03
JP2017193299A JP6806024B2 (ja) 2017-10-03 2017-10-03 半導体装置

Publications (2)

Publication Number Publication Date
CN109599372A CN109599372A (zh) 2019-04-09
CN109599372B true CN109599372B (zh) 2023-02-28

Family

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CN201811139732.3A Active CN109599372B (zh) 2017-10-03 2018-09-28 半导体装置

Country Status (4)

Country Link
US (1) US10388581B2 (enExample)
JP (1) JP6806024B2 (enExample)
CN (1) CN109599372B (enExample)
DE (1) DE102018212828B4 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102500480B1 (ko) * 2017-12-22 2023-02-16 삼성전자주식회사 접촉 부재를 포함하는 전자 장치 및 그 제작 방법
JP7180570B2 (ja) * 2019-09-03 2022-11-30 三菱電機株式会社 半導体モジュール
JP7224272B2 (ja) * 2019-10-30 2023-02-17 三菱電機株式会社 パワー半導体装置
CN111162057B (zh) * 2020-01-06 2022-01-21 珠海格力电器股份有限公司 半导体功率器件及用于半导体功率器件的功率处理组件
EP3961697A1 (de) * 2020-08-25 2022-03-02 Siemens Aktiengesellschaft Halbleitermodul mit einer vertiefung
DE102022118268B4 (de) * 2022-07-21 2026-06-18 Semikron Danfoss Elektronik Gmbh & Co. Kg Baugruppe mit einem Kunststoffformkörper und einer Mehrzahl von Lastanschlusselementen und Leistungshalbleitereinrichtung hiermit
EP4336551B1 (en) 2022-09-09 2025-09-03 Hitachi Energy Ltd Power module comprising a semiconductor module component and an alignment part, and method for forming the power module
JP7825551B2 (ja) * 2022-12-23 2026-03-06 三菱電機株式会社 半導体装置

Citations (6)

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Publication number Priority date Publication date Assignee Title
CN1722418A (zh) * 2004-06-08 2006-01-18 富士电机电子设备技术株式会社 半导体装置
CN1848427A (zh) * 2005-04-13 2006-10-18 株式会社电装 电子装置及其制造方法
CN101261966A (zh) * 2007-03-08 2008-09-10 富士电机电子设备技术株式会社 半导体装置及其制造方法
CN103210489A (zh) * 2010-11-16 2013-07-17 富士电机株式会社 半导体装置
CN103531555A (zh) * 2013-10-24 2014-01-22 江苏宏微科技股份有限公司 免焊接端子的功率模块
CN105074919A (zh) * 2013-02-26 2015-11-18 三菱电机株式会社 电力用半导体装置

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JP2928987B2 (ja) * 1995-03-31 1999-08-03 日本航空電子工業株式会社 コンタクト及びその製造方法
DE102006040435B3 (de) 2006-08-29 2008-01-31 Infineon Technologies Ag Anordnung und Verfahren zur Montage eines Leistungshalbleitermoduls
DE102010003367B4 (de) * 2010-03-26 2015-06-25 Infineon Technologies Ag Einpress-Verbindungen für Elektronikmodule
DE102010038727B4 (de) 2010-07-30 2015-07-16 Infineon Technologies Ag Leistungshaltleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls
JP5383621B2 (ja) * 2010-10-20 2014-01-08 三菱電機株式会社 パワー半導体装置
WO2013111276A1 (ja) * 2012-01-25 2013-08-01 三菱電機株式会社 電力用半導体装置
JP5867966B2 (ja) * 2012-08-29 2016-02-24 新電元工業株式会社 半導体装置
JP2015026820A (ja) * 2013-06-18 2015-02-05 株式会社デンソー 電子装置
JP2015023226A (ja) 2013-07-23 2015-02-02 三菱電機株式会社 ワイドギャップ半導体装置
US20160240452A1 (en) * 2015-02-18 2016-08-18 Semiconductor Components Industries, Llc Semiconductor packages with sub-terminals and related methods
US9979105B2 (en) * 2015-05-15 2018-05-22 Mitsubishi Electric Corporation Power semiconductor device
JP6541593B2 (ja) * 2015-05-15 2019-07-10 三菱電機株式会社 電力用半導体装置
DE112016004757T5 (de) * 2015-12-10 2018-07-05 Hitachi Automotive Systems, Ltd. Elektronische steuervorrichtung
JP2017193299A (ja) 2016-04-22 2017-10-26 トヨタ自動車株式会社 車両のバッテリ搭載構造
JP6705394B2 (ja) * 2017-02-16 2020-06-03 三菱電機株式会社 半導体モジュールおよびインバータ装置

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Publication number Priority date Publication date Assignee Title
CN1722418A (zh) * 2004-06-08 2006-01-18 富士电机电子设备技术株式会社 半导体装置
CN1848427A (zh) * 2005-04-13 2006-10-18 株式会社电装 电子装置及其制造方法
CN101261966A (zh) * 2007-03-08 2008-09-10 富士电机电子设备技术株式会社 半导体装置及其制造方法
CN103210489A (zh) * 2010-11-16 2013-07-17 富士电机株式会社 半导体装置
CN105074919A (zh) * 2013-02-26 2015-11-18 三菱电机株式会社 电力用半导体装置
CN103531555A (zh) * 2013-10-24 2014-01-22 江苏宏微科技股份有限公司 免焊接端子的功率模块

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Publication number Publication date
JP2019067970A (ja) 2019-04-25
DE102018212828A1 (de) 2019-04-04
JP6806024B2 (ja) 2020-12-23
US10388581B2 (en) 2019-08-20
CN109599372A (zh) 2019-04-09
US20190103330A1 (en) 2019-04-04
DE102018212828B4 (de) 2023-10-26

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