CN108257940A - 半导体装置及其制造方法 - Google Patents
半导体装置及其制造方法 Download PDFInfo
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Abstract
目的是提供可实现使制造成本的上升受抑制且端子散热性良好的半导体装置的技术。半导体装置(100)具有基座板(4)、设置于基座板上表面的绝缘基板(2)、设置于绝缘基板上表面的导电图案(1)、配置于导电图案上表面的半导体芯片(3)、将基座板、绝缘基板、导电图案及半导体芯片包围的壳体(5)、将壳体的内部封装的封装树脂(7)及配置于壳体的外部连接端子(6)。外部连接端子(6)的一端部与导电图案(1)连接,在壳体(5)的周壁部(5a)设置有供外部连接端子(6)的另一端部插入的端子插入部(5c),在外部连接端子的另一端部插入至端子插入部(5c)的状态下,外部连接端子(6)的除另一端部外的部分被封装树脂(7)封装。
Description
技术领域
本发明涉及一种半导体装置及其制造方法。
背景技术
半导体装置具有:基座板;绝缘基板,其设置于基座板的上表面;半导体芯片,其搭载于绝缘基板的上表面;以及壳体,其将基座板、绝缘层以及半导体芯片包围。而且,壳体的内部通过封装树脂进行封装。
例如,专利文献1中公开了一种半导体装置,该半导体装置是将半导体芯片、安装了半导体芯片的绝缘电路基板以及散热用金属基座的层叠组装体与外围树脂壳体组合而成的。就该半导体装置而言,将在外围树脂壳体的周壁部排列而设置的外部端子的脚部引出至外围树脂壳体的内侧,在此基础上,在端子脚部与绝缘电路基板的导体图案或半导体芯片之间配置有键合导线。在预先形成于外围树脂壳体的周壁部处的端子安装孔中,从金属基座侧将外部端子压入而进行安装。通过将端子按压框装填至外部端子的L形脚部与金属基座之间的间隙,从而将外部端子支撑于规定的安装位置。
专利文献1:日本专利第4985116号公报
如专利文献1所记载的半导体装置那样,就现有的外插型的端子而言,是端子和绝缘电路基板通过键合导线等导电件进行连接的结构。在该结构中,端子的散热性依赖于导电件的散热性,但导电件的宽度极小,因此导电件的散热性并不充分,端子的散热性也不充分。另外,在导电件的连接时,需要将端子牢固地固定至壳体。因此,需要粘接材料的涂布或固定盖的嵌入等,存在部件以及制造工序增加,制造成本上升这样的问题。
发明内容
因此,本发明的目的在于,提供一种能够实现使制造成本的上升得到抑制,且端子的散热性良好的半导体装置的技术。
本发明涉及的半导体装置具有:基座板;绝缘基板,其设置于所述基座板的上表面;导电图案,其设置于所述绝缘基板的上表面;半导体芯片,其配置于所述导电图案的上表面;壳体,其将所述基座板、所述绝缘基板、所述导电图案以及所述半导体芯片包围;封装树脂,其对所述壳体的内部进行封装;以及外部连接端子,其配置于所述壳体,所述外部连接端子的一端部与所述导电图案连接,在所述壳体的周壁部设置有端子插入部,所述外部连接端子的另一端部能够插入至该端子插入部,在所述外部连接端子的所述另一端部插入至所述端子插入部的状态下,所述外部连接端子的除了所述另一端部以外的部分被所述封装树脂进行了封装。
发明的效果
根据本发明,外部连接端子的一端部与导电图案连接,在壳体的周壁部设置有供外部连接端子的另一端部插入的端子插入部,在外部连接端子的另一端部插入至端子插入部的状态下,外部连接端子的除了另一端部以外的部分被封装树脂进行了封装。
因此,仅通过将外部连接端子的另一端部插入于端子插入部,就能够将外部连接端子固定于壳体,因此能够抑制半导体装置的制造成本的上升。另外,外部连接端子的一端部与导电图案连接,且外部连接端子的宽度大于键合导线等导电件的宽度,因此在外部连接端子的另一端部产生的热容易导热至基座板。由此,能够实现外部连接端子的散热性良好的半导体装置。
附图说明
图1是实施方式1涉及的半导体装置的剖视图。
图2是表示实施方式1涉及的半导体装置的内部结构的斜视图。
图3是用于对实施方式1涉及的半导体装置的制造方法进行说明的流程图。
图4是表示实施方式2涉及的半导体装置的内部结构的斜视图。
图5是表示实施方式3涉及的半导体装置的内部结构的斜视图。
图6是表示实施方式4涉及的半导体装置的内部结构的斜视图。
图7是表示实施方式5涉及的半导体装置的内部结构的斜视图。
图8是表示实施方式6涉及的半导体装置的内部结构的斜视图。
标号的说明
1导电图案,2绝缘基板,3半导体芯片,4基座板,5壳体,5a周壁部,5c端子插入部,6外部连接端子,6e固定用孔,6f压配合部,6g连接器部,7封装树脂,100、100A、100B、100C、100D、100E半导体装置。
具体实施方式
<实施方式1>
下面,使用附图对本发明的实施方式1进行说明。图1是实施方式1涉及的半导体装置100的剖视图。图2是表示半导体装置100的内部结构的斜视图。此外,朝向图1的纸面,将左右方向设为左右方向,将上下方向设为上下方向,将近端侧设为前方,将远端侧设为后方而进行说明。
如图1所示,半导体装置100具有:基座板4、绝缘基板2、导电图案1、半导体芯片3、壳体5、外部连接端子6以及封装树脂7。
基座板4例如由铜等金属构成,在俯视观察时形成为矩形形状。绝缘基板2例如由环氧树脂构成,是在基座板4的整个上表面设置的。导电图案1例如由铜构成,设置于绝缘基板2的上表面。半导体芯片3搭载于导电图案1的上表面。
壳体5具有在俯视观察时呈矩形框形状的周壁部5a,该壳体5将基座板4、绝缘基板2、导电图案1以及半导体芯片3包围。周壁部5a的下部形成为向内周侧凸出。在周壁部5a的下端部的内周部的整个范围设置有凹部5b,该凹部5b能够与基座板4的上部以及绝缘基板2相嵌合。
如图1和图2所示,外部连接端子6例如由铜的薄板形成,具有:主体部6a、连接部6b、端子部6c以及外部连接部6d。主体部6a通过沿左右方向延伸的水平部分和从水平部分的一端部向下方延伸的铅垂部分而形成为在剖视观察时呈L字形状。主体部6a以将主面朝向前方的状态配置。此外,在图2中,为了容易观察附图,省略了基座板4、绝缘基板2、封装树脂7以及壳体5的前侧部分的图示。另外,在后面的附图中也是同样的。
连接部6b设置于主体部6a的一端部,形成为向前方弯折的形状。连接部6b以将主面朝向上方的状态配置,与主面相对的连接面被连接至导电图案1。
端子部6c设置于主体部6a的另一端部。端子部6c的前端部形成为向前方弯折的形状,端子部6c在俯视观察时形成为L字形状。在周壁部5a的上部设置有多个端子插入部5c,端子部6c能够插入至该端子插入部5c。端子插入部5c通过沿前后方向延伸的前后部分和从前后部分的后端部沿左右方向延伸的左右部分而形成为在俯视观察时呈L字形状。
端子部6c通过插入至端子插入部5c而经由主体部6a以及连接部6b与导电图案1电连接。此时,端子部6c的上部以及在端子部6c的上端部设置的外部连接部6d从端子插入部5c向上方凸出。在此,连接部6b构成外部连接端子6的一端部,端子部6c构成外部连接端子6的另一端部。
封装树脂7例如为热固化性树脂,对壳体5的内部进行封装。在外部连接端子6的另一端部、即端子部6c插入至端子插入部5c的状态下,外部连接端子6的除了另一端部以外的部分被封装树脂7进行了封装。更具体而言,主体部6a以及连接部6b被封装树脂7进行了封装。由此,不仅主体部6a以及连接部6b,端子部6c也通过封装树脂7而得到固定。
接着,使用图3对半导体装置100的制造方法中的特征性工序进行说明。图3是用于对半导体装置100的制造方法进行说明的流程图。
如图3所示,在步骤S1中,将壳体5与设置有绝缘基板2和导电图案1的基座板4粘接。就壳体5的粘接而言,例如将硅酮粘接剂等涂布于壳体5的凹部5b,使凹部5b与基座板4的上部以及绝缘基板2粘接。如果结束了步骤S1的工序,则工序进入至步骤S2。在步骤S2中,将外部连接端子6的作为另一端部的端子部6c插入至已完成粘接的壳体5的端子插入部5c,配置为连接部6b位于导电图案1之上。如果结束了步骤S2的工序,则工序进入至步骤S3。
在步骤S3中,使导电图案1与位于导电图案1的上表面处的外部连接端子6的作为一端部的连接部6b连接。就连接而言,例如在导电图案1的上表面设置或涂布作为接合材料的焊料,在其之上设置连接部6b,然后,将焊料加热之后进行冷却,从而使连接部6b与导电图案1连接。
或者,也能够进行超声波接合来代替通过焊料进行的连接。将连接部6b设置在导电图案1之上,然后从连接部6b的上表面使用超声波接合用工具使连接部6b进行超声波振动。通过此时产生的摩擦热对连接部6b和导电图案1进行焊接而将它们连接。就该超声波接合而言,由于不需要焊料等接合材料的加热以及冷却的工序,因此能够实现半导体装置100的制造时间的缩短。
如果结束了步骤S3的工序,则工序进入至步骤S4。在步骤S4中,以将连接有连接部6b的导电图案1覆盖的方式,向壳体5的内部注入热固化性树脂即封装树脂7,加热之后进行冷却,从而进行半导体装置100的封装以及外部连接端子6的固定。
如上所述,就实施方式1涉及的半导体装置100而言,外部连接端子6的一端部与导电图案1连接,在壳体5的周壁部5a设置有供外部连接端子6的另一端部插入的端子插入部5c,在外部连接端子6的另一端部插入至端子插入部5c的状态下,外部连接端子6的除了另一端部以外的部分被封装树脂7进行了封装。
在现有的结构中,为了将端子牢固地固定,进行了将端子通过粘接剂等粘接于壳体的工序、或者将固定盖嵌入而固定的工序。就半导体装置100而言,不需要上述的工序,仅通过将外部连接端子6的另一端部插入于端子插入部5c,就能够将外部连接端子6固定于壳体5,因此能够抑制半导体装置100的制造成本的上升。
在现有的结构中,需要在端子与导电图案之间对键合导线等导电件进行连接,在连接时需要将端子牢固地固定。但是,就半导体装置100而言,由于不需要对导电件进行连接的工序,因此也不需要将外部连接端子6的另一端部牢固地固定。
并且,就现有的结构而言,为了将端子牢固地固定,进行了端子向壳体的压入等工序,在将端子压入至由刚性高的材料形成的壳体时有可能发生端子的破损、壳体的破损。但是,就半导体装置100而言,由于不需要进行压入,因此即使是由刚性高的材料、例如PPS(聚苯硫醚)等材料成型的壳体也可以使用而无需担心破损。
另外,外部连接端子6的一端部与导电图案1连接,且外部连接端子6的宽度大于键合导线等导电件的宽度,因此在外部连接端子6的另一端部产生的热容易导热至基座板4。由此,能够实现外部连接端子6的散热性良好的半导体装置100。
另外,在壳体5向基座板4的粘接之后,将外部连接端子6的另一端部插入至端子插入部5c,因此能够在半导体装置100的制造时选择各种引脚布局,能够灵活地应对各种引脚布局需求。
外部连接端子6的一端部是使用超声波接合与导电图案1接合的,因此不需要焊料等接合材料的加热以及冷却的工序,因此能够实现半导体装置100的制造时间的缩短。
另外,在代替超声波接合,使用焊料等接合材料使外部连接端子6的一端部与导电图案接合的情况下,不需要导入新的设备,因此能够进一步抑制半导体装置100的制造成本的上升。
此外,作为基座板,也可以是一体地形成基座板4、绝缘基板2以及导电图案1。更具体而言,半导体装置100也能够采用树脂绝缘基座板,该树脂绝缘基座板具有使基座板4、绝缘基板2以及导电图案1成为一体的结构。在该情况下,能够削减将绝缘基板和基座板连接的工序,因此能够提高半导体装置100的组装性,进一步缩短制造时间。
<实施方式2>
接着,对实施方式2涉及的半导体装置100A进行说明。图4是表示实施方式2涉及的半导体装置100A的内部结构的斜视图。此外,在实施方式2中,对与实施方式1中说明的结构要素相同的结构要素标注相同标号而省略其说明。
如图4所示,在实施方式2中,在外部连接端子6的另一端部设置有多个外部连接部6d。更具体而言,在端子部6c的上端部设置有例如两个外部连接部6d。两个外部连接部6d一起与外部的同一控制基板等连接。在该情况下,与外部连接部6d为一个的情况相比,与外部的控制基板等接触的部位增加,因此能够进一步提高外部连接端子6的散热性。此外,外部连接部6d并不限定于两个,大于或等于两个即可。
<实施方式3>
接着,对实施方式3涉及的半导体装置100B进行说明。图5是表示实施方式3涉及的半导体装置100B的内部结构的斜视图。此外,在实施方式3中,对与实施方式1、2中说明的结构要素相同的结构要素标注相同标号而省略其说明。
如图5所示,在实施方式3中,在外部连接端子6的另一端部设置有能够供螺钉的轴部插入的固定用孔6e。更具体而言,端子部6c形成为前端部向下方延伸的U字形状,在端子部6c的上端部设置有固定用孔6e。由此,外部连接部6d能够使用螺钉与外部的控制基板等连接,因此外部连接端子6的便利性提高。
<实施方式4>
接着,对实施方式4涉及的半导体装置100C进行说明。图6是表示实施方式4涉及的半导体装置100C的内部结构的斜视图。此外,在实施方式4中,对与实施方式1~3中说明的结构要素相同的结构要素标注相同标号而省略其说明。
如图6所示,在实施方式4中,设置有多个外部连接端子6,在彼此相邻的位置设置有多个端子插入部5c,在多个外部连接端子6的另一端部分别插入至多个端子插入部5c的状态下,多个外部连接端子6的除了另一端部以外的部分被封装树脂7(参照图1)进行了封装。
两个外部连接端子6配置于彼此相邻的位置,因此两个主体部6a彼此接近。由此,能够降低外部连接端子6所具有的电感成分。此外,在图6中,虽然示出了具有固定用孔6e的外部连接端子6,但是固定用孔6e并不是必需的结构,例如也可以是具有图2和图4示出的外部连接部6d等的外部连接端子6。
<实施方式5>
接着,对实施方式5涉及的半导体装置100D进行说明。图7是表示实施方式5涉及的半导体装置100D的内部结构的斜视图。此外,在实施方式5中,对与实施方式1~4中说明的结构要素相同的结构要素标注相同标号而省略其说明。
如图7所示,在实施方式5中,在外部连接端子6的另一端部设置有压配合部6f。压配合部6f是指,在端子部6c的上端部设置的外部连接部具有空隙部分的结构。对于通过使压配合部6f以空隙部分为中心进行伸缩而被从上方插入的控制基板等,无需进行焊料粘接等处理即可进行连接。由此,外部连接端子6的便利性提高。
<实施方式6>
接着,对实施方式6涉及的半导体装置100E进行说明。图8是表示实施方式6涉及的半导体装置100E的内部结构的斜视图。此外,在实施方式6中,对与实施方式1~5中说明的结构要素相同的结构要素标注相同标号而省略其说明。
如图8所示,在实施方式6中,在外部连接端子6的另一端部设置有连接器部6g。更具体而言,连接器部6g设置于端子部6c的上端部,构成为能够进行连接器连接。由此,外部连接端子6的便利性提高。
此外,本发明能够在其发明的范围内对各实施方式自由地进行组合,或者对各实施方式适当地进行变形、省略。
Claims (9)
1.一种半导体装置,其具有:
基座板;
绝缘基板,其设置于所述基座板的上表面;
导电图案,其设置于所述绝缘基板的上表面;
半导体芯片,其配置于所述导电图案的上表面;
壳体,其将所述基座板、所述绝缘基板、所述导电图案以及所述半导体芯片包围;
封装树脂,其对所述壳体的内部进行封装;以及
外部连接端子,其配置于所述壳体,
所述外部连接端子的一端部与所述导电图案连接,
在所述壳体的周壁部设置有端子插入部,所述外部连接端子的另一端部能够插入至该端子插入部,
在所述外部连接端子的所述另一端部插入至所述端子插入部的状态下,所述外部连接端子的除了所述另一端部以外的部分被所述封装树脂进行了封装。
2.根据权利要求1所述的半导体装置,其中,
所述基座板、所述绝缘基板以及所述导电图案是一体地形成的。
3.根据权利要求1所述的半导体装置,其中,
在所述外部连接端子的所述另一端部设置有多个外部连接部。
4.根据权利要求1所述的半导体装置,其中,
在所述外部连接端子的所述另一端部设置有固定用孔,螺钉的轴部能够插入至该固定用孔。
5.根据权利要求1所述的半导体装置,其中,
设置有多个所述外部连接端子,
在彼此相邻的位置设置有多个所述端子插入部,
在多个所述外部连接端子的所述另一端部分别插入至多个所述端子插入部的状态下,多个所述外部连接端子的除了所述另一端部以外的部分被所述封装树脂进行了封装。
6.根据权利要求1所述的半导体装置,其中,
在所述外部连接端子的所述另一端部设置有压配合部。
7.根据权利要求1所述的半导体装置,其中,
在所述外部连接端子的所述另一端部设置有连接器部。
8.一种半导体装置的制造方法,其是制造权利要求1至7中任一项所述的半导体装置的制造方法,
在该半导体装置的制造方法中,
所述外部连接端子的所述一端部是使用超声波接合而与所述导电图案接合的。
9.一种半导体装置的制造方法,其是制造权利要求1至7中任一项所述的半导体装置的制造方法,
在该半导体装置的制造方法中,
所述外部连接端子的所述一端部是使用接合材料而与所述导电图案接合的。
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CN112086413B (zh) * | 2019-06-14 | 2024-04-23 | Jmj韩国株式会社 | 半导体封装 |
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DE102017220211A1 (de) | 2018-06-28 |
CN108257940B (zh) | 2021-07-06 |
DE102017220211B4 (de) | 2022-02-03 |
US20180182679A1 (en) | 2018-06-28 |
JP6625044B2 (ja) | 2019-12-25 |
JP2018107414A (ja) | 2018-07-05 |
US10366933B2 (en) | 2019-07-30 |
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