JP6800316B2 - シリカ粒子の製造方法 - Google Patents
シリカ粒子の製造方法 Download PDFInfo
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- JP6800316B2 JP6800316B2 JP2019511304A JP2019511304A JP6800316B2 JP 6800316 B2 JP6800316 B2 JP 6800316B2 JP 2019511304 A JP2019511304 A JP 2019511304A JP 2019511304 A JP2019511304 A JP 2019511304A JP 6800316 B2 JP6800316 B2 JP 6800316B2
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- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 7
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- 125000006615 aromatic heterocyclic group Chemical group 0.000 claims description 5
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- -1 optical members Substances 0.000 description 77
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- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
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- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 4
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- YZVRVDPMGYFCGL-UHFFFAOYSA-N triacetyloxysilyl acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)OC(C)=O YZVRVDPMGYFCGL-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- ORVMIVQULIKXCP-UHFFFAOYSA-N trichloro(phenyl)silane Chemical compound Cl[Si](Cl)(Cl)C1=CC=CC=C1 ORVMIVQULIKXCP-UHFFFAOYSA-N 0.000 description 1
- YNJBWRMUSHSURL-UHFFFAOYSA-N trichloroacetic acid Chemical compound OC(=O)C(Cl)(Cl)Cl YNJBWRMUSHSURL-UHFFFAOYSA-N 0.000 description 1
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- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- JLGNHOJUQFHYEZ-UHFFFAOYSA-N trimethoxy(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)F JLGNHOJUQFHYEZ-UHFFFAOYSA-N 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- 239000005051 trimethylchlorosilane Substances 0.000 description 1
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- QHUNJMXHQHHWQP-UHFFFAOYSA-N trimethylsilyl acetate Chemical compound CC(=O)O[Si](C)(C)C QHUNJMXHQHHWQP-UHFFFAOYSA-N 0.000 description 1
- PHYFQTYBJUILEZ-IUPFWZBJSA-N triolein Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCC(OC(=O)CCCCCCC\C=C/CCCCCCCC)COC(=O)CCCCCCC\C=C/CCCCCCCC PHYFQTYBJUILEZ-IUPFWZBJSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
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| JP6564517B1 (ja) | 2018-12-17 | 2019-08-21 | 株式会社アドマテックス | 電子材料用フィラー及びその製造方法、電子材料用樹脂組成物の製造方法、高周波用基板、並びに電子材料用スラリー |
| CN114127605B (zh) * | 2019-07-26 | 2025-03-04 | 住友电气工业株式会社 | 光纤带和光纤缆线 |
| JP7333225B2 (ja) * | 2019-08-23 | 2023-08-24 | 株式会社日本触媒 | (メタ)アクリル樹脂の製造方法及び(メタ)アクリル樹脂 |
| JP7516763B2 (ja) * | 2020-01-28 | 2024-07-17 | 三菱ケミカル株式会社 | シリカ粒子の製造方法、シリカゾルの製造方法、中間生成物の除去方法及び研磨方法 |
| CN115397775B (zh) * | 2020-03-31 | 2024-08-06 | 日产化学株式会社 | 表面改性二氧化硅粒子的有机溶剂分散溶胶的制造方法 |
| US12265270B2 (en) * | 2021-03-08 | 2025-04-01 | Corning Research & Development Corporation | Flame retardant compositions for buffer tubes and method of making same |
| CN113698554B (zh) * | 2021-09-16 | 2024-05-07 | 西安热工研究院有限公司 | 一种以纳米SiO2为内核的阴离子交换树脂及其制备方法 |
| US20240383760A1 (en) * | 2021-10-18 | 2024-11-21 | Mitsubishi Materials Electronic Chemicals Co., Ltd. | Surface-treated silica particle dispersion sol and production method therefor |
| CN113861812B (zh) * | 2021-12-02 | 2022-03-29 | 富维薄膜(山东)有限公司 | 一种聚酯薄膜用涂布液及其应用 |
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| JP2023170440A (ja) * | 2022-05-19 | 2023-12-01 | 株式会社日本触媒 | 表面処理シリカ粒子分散体 |
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| JP2011206762A (ja) | 2010-03-10 | 2011-10-20 | Konica Minolta Business Technologies Inc | 粒子の疎水化処理方法 |
| JP5622277B2 (ja) | 2010-08-25 | 2014-11-12 | 関西ペイント株式会社 | 複層塗膜形成方法及び塗装物品 |
| JP5404568B2 (ja) | 2010-09-21 | 2014-02-05 | 日揮触媒化成株式会社 | シリカ系微粒子、被膜形成用塗料および被膜付基材 |
| JP5787705B2 (ja) | 2011-10-11 | 2015-09-30 | 扶桑化学工業株式会社 | 高純度単分散シリカ粒子及びその製造方法 |
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| US10239758B2 (en) | 2013-06-10 | 2019-03-26 | Nissan Chemical Industries, Ltd. | Silica sol and method for producing silica sol |
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