JP6799397B2 - インプリント装置、および物品の製造方法 - Google Patents

インプリント装置、および物品の製造方法 Download PDF

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Publication number
JP6799397B2
JP6799397B2 JP2016132779A JP2016132779A JP6799397B2 JP 6799397 B2 JP6799397 B2 JP 6799397B2 JP 2016132779 A JP2016132779 A JP 2016132779A JP 2016132779 A JP2016132779 A JP 2016132779A JP 6799397 B2 JP6799397 B2 JP 6799397B2
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JP
Japan
Prior art keywords
mold
unit
imprint material
substrate
imaging unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016132779A
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English (en)
Japanese (ja)
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JP2017038042A5 (enExample
JP2017038042A (ja
Inventor
佐藤　浩司
浩司 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2016132779A priority Critical patent/JP6799397B2/ja
Priority to US15/224,911 priority patent/US10011057B2/en
Priority to KR1020197002514A priority patent/KR102241655B1/ko
Priority to PCT/JP2017/002625 priority patent/WO2018008174A1/ja
Priority to TW106103720A priority patent/TWI737675B/zh
Publication of JP2017038042A publication Critical patent/JP2017038042A/ja
Publication of JP2017038042A5 publication Critical patent/JP2017038042A5/ja
Application granted granted Critical
Publication of JP6799397B2 publication Critical patent/JP6799397B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/002—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/585—Measuring, controlling or regulating detecting defects, e.g. foreign matter between the moulds, inaccurate position, breakage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5891—Measuring, controlling or regulating using imaging devices, e.g. cameras
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2016132779A 2015-08-10 2016-07-04 インプリント装置、および物品の製造方法 Active JP6799397B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016132779A JP6799397B2 (ja) 2015-08-10 2016-07-04 インプリント装置、および物品の製造方法
US15/224,911 US10011057B2 (en) 2015-08-10 2016-08-01 Imprint apparatus, and method of manufacturing article
KR1020197002514A KR102241655B1 (ko) 2015-08-10 2017-01-26 임프린트 장치 및 물품 제조 방법
PCT/JP2017/002625 WO2018008174A1 (ja) 2015-08-10 2017-01-26 インプリント装置、および物品の製造方法
TW106103720A TWI737675B (zh) 2015-08-10 2017-02-03 壓印裝置及物品之製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015158495 2015-08-10
JP2015158495 2015-08-10
JP2016132779A JP6799397B2 (ja) 2015-08-10 2016-07-04 インプリント装置、および物品の製造方法

Publications (3)

Publication Number Publication Date
JP2017038042A JP2017038042A (ja) 2017-02-16
JP2017038042A5 JP2017038042A5 (enExample) 2019-07-25
JP6799397B2 true JP6799397B2 (ja) 2020-12-16

Family

ID=57994655

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016132779A Active JP6799397B2 (ja) 2015-08-10 2016-07-04 インプリント装置、および物品の製造方法

Country Status (5)

Country Link
US (1) US10011057B2 (enExample)
JP (1) JP6799397B2 (enExample)
KR (1) KR102241655B1 (enExample)
TW (1) TWI737675B (enExample)
WO (1) WO2018008174A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6188382B2 (ja) * 2013-04-03 2017-08-30 キヤノン株式会社 インプリント装置および物品の製造方法
JP5960198B2 (ja) * 2013-07-02 2016-08-02 キヤノン株式会社 パターン形成方法、リソグラフィ装置、リソグラフィシステムおよび物品製造方法
US10353299B2 (en) * 2016-06-01 2019-07-16 Canon Kabushiki Kaisha Lithography method, determination method, information processing apparatus, storage medium, and method of manufacturing article
JP7222623B2 (ja) * 2018-07-23 2023-02-15 キヤノン株式会社 パターン形成方法および物品製造方法
US11107678B2 (en) 2019-11-26 2021-08-31 Canon Kabushiki Kaisha Wafer process, apparatus and method of manufacturing an article
KR102227885B1 (ko) * 2020-06-02 2021-03-15 주식회사 기가레인 패턴 정렬 가능한 전사 장치
JP7494037B2 (ja) * 2020-07-15 2024-06-03 キヤノン株式会社 情報処理装置、判定方法、検査装置、成形装置、および物品の製造方法
JP7407465B2 (ja) 2022-03-04 2024-01-04 株式会社菊水製作所 成形品処理システム

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2432029A (en) * 2005-11-02 2007-05-09 Crime Scene Invest Equipment L Imprint identification system using image scanner calibration
WO2007124007A2 (en) * 2006-04-21 2007-11-01 Molecular Imprints, Inc. Method for detecting a particle in a nanoimprint lithography system
US7815824B2 (en) * 2008-02-26 2010-10-19 Molecular Imprints, Inc. Real time imprint process diagnostics for defects
US8345242B2 (en) * 2008-10-28 2013-01-01 Molecular Imprints, Inc. Optical system for use in stage control
JP5173944B2 (ja) 2009-06-16 2013-04-03 キヤノン株式会社 インプリント装置及び物品の製造方法
JP5455583B2 (ja) 2009-11-30 2014-03-26 キヤノン株式会社 インプリント装置
JP5539011B2 (ja) * 2010-05-14 2014-07-02 キヤノン株式会社 インプリント装置、検出装置、位置合わせ装置、及び物品の製造方法
JP5597031B2 (ja) * 2010-05-31 2014-10-01 キヤノン株式会社 リソグラフィ装置及び物品の製造方法
JP5576822B2 (ja) * 2011-03-25 2014-08-20 富士フイルム株式会社 モールドに付着した異物の除去方法
JP6039222B2 (ja) * 2011-05-10 2016-12-07 キヤノン株式会社 検出装置、検出方法、インプリント装置及びデバイス製造方法
JP6071221B2 (ja) * 2012-03-14 2017-02-01 キヤノン株式会社 インプリント装置、モールド、インプリント方法及び物品の製造方法
JP6140990B2 (ja) * 2012-11-30 2017-06-07 キヤノン株式会社 測定装置、インプリントシステム、測定方法及びデバイス製造方法
JP6083340B2 (ja) * 2013-07-12 2017-02-22 富士通株式会社 化合物半導体装置及びその製造方法
JP6119474B2 (ja) * 2013-07-12 2017-04-26 大日本印刷株式会社 インプリント装置及びインプリント方法
JP6282069B2 (ja) 2013-09-13 2018-02-21 キヤノン株式会社 インプリント装置、インプリント方法、検出方法及びデバイス製造方法
JP6415120B2 (ja) * 2014-06-09 2018-10-31 キヤノン株式会社 インプリント装置及び物品の製造方法
JP6403627B2 (ja) * 2015-04-14 2018-10-10 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法

Also Published As

Publication number Publication date
US10011057B2 (en) 2018-07-03
WO2018008174A1 (ja) 2018-01-11
TW201802873A (zh) 2018-01-16
JP2017038042A (ja) 2017-02-16
TWI737675B (zh) 2021-09-01
US20170043511A1 (en) 2017-02-16
KR20190022763A (ko) 2019-03-06
KR102241655B1 (ko) 2021-04-19

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