JP6786764B2 - 回路基板および回路基板の製造方法 - Google Patents
回路基板および回路基板の製造方法 Download PDFInfo
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- JP6786764B2 JP6786764B2 JP2016017522A JP2016017522A JP6786764B2 JP 6786764 B2 JP6786764 B2 JP 6786764B2 JP 2016017522 A JP2016017522 A JP 2016017522A JP 2016017522 A JP2016017522 A JP 2016017522A JP 6786764 B2 JP6786764 B2 JP 6786764B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 239000012792 core layer Substances 0.000 claims description 117
- 239000010410 layer Substances 0.000 claims description 43
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 39
- 239000007769 metal material Substances 0.000 claims description 21
- 229910021389 graphene Inorganic materials 0.000 claims description 19
- 229910002804 graphite Inorganic materials 0.000 claims description 19
- 239000010439 graphite Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 12
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 229960004592 isopropanol Drugs 0.000 claims description 3
- 229910000077 silane Inorganic materials 0.000 claims description 3
- -1 Acryl Chemical group 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- YATIYDNBFHEOFA-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-ol Chemical compound CO[Si](OC)(OC)CCCO YATIYDNBFHEOFA-UHFFFAOYSA-N 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- CIBMHJPPKCXONB-UHFFFAOYSA-N propane-2,2-diol Chemical compound CC(C)(O)O CIBMHJPPKCXONB-UHFFFAOYSA-N 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000009413 insulation Methods 0.000 description 4
- 239000010949 copper Substances 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- BIGOJJYDFLNSGB-UHFFFAOYSA-N 3-isocyanopropyl(trimethoxy)silane Chemical group CO[Si](OC)(OC)CCC[N+]#[C-] BIGOJJYDFLNSGB-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910021386 carbon form Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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- H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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- H05K1/02—Details
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- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
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- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
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- H05K3/46—Manufacturing multilayer circuits
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- Condensed Matter Physics & Semiconductors (AREA)
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
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Description
11、11´、11´´ 第1コア層
12 第2コア層
13 第3コア層
14 絶縁膜
15 プライマー層
100、200 回路基板
121 第1上部絶縁層
121´ 第1下部絶縁層
131 第2上部絶縁層
131´ 第2下部絶縁層
H1 第1スルーホール
H2 第2スルーホール
TVH スルービアホール
VH ビアホール
TV1、TV2 スルービア
V1、V2、V1´、V2´ ビア
SB 半田ボール
300 第1電子部品
500 第2電子部品
800 付加基板
Claims (13)
- グラファイト(graphite)またはグラフェン(graphene)材質からなり、一面と他面との間を貫通するスルーホールが形成された第1コア層と、金属材質からなり、前記第1コア層の一面および他面にそれぞれ形成された第2コア層および第3コア層と、を含むコア部を含み、
前記スルーホールには、前記第2コア層および前記第3コア層をなす前記金属材質が充填されており、
前記コア部の表面の少なくとも一部には絶縁膜が備えられ、
前記絶縁膜は前記第1コア層、第2コア層、および第3コア層のそれぞれより厚さが薄く、
前記コア部の一面および他面のうち一つの面には前記絶縁膜の少なくとも一部を覆う絶縁層が備えられた回路基板。 - 前記コア部の一面と他面との間を貫通するスルービアが前記スルーホールの内側を貫通する、請求項1に記載の回路基板。
- 前記コア部の一面または他面に回路パターンが備えられており、前記スルービアの外面と前記コア部の表面との間、および前記回路パターンの外面と前記コア部の表面との間に前記絶縁膜が備えられる、請求項2に記載の回路基板。
- 前記第2コア層または前記第3コア層を貫通するビアが備えられており、前記ビアの表面と前記コア部との間に前記絶縁膜が備えられる、請求項1から3の何れか一項に記載の回路基板。
- 前記スルーホールは、前記スルービアが内側を貫通する第1スルーホールと、前記スルービアが内側を貫通しない第2スルーホールと、を含む、請求項2または3に記載の回路基板。
- 前記第1コア層の外周縁側壁の少なくとも一部が前記第2コア層および前記第3コア層の外部に露出される、請求項1から5の何れか一項に記載の回路基板。
- 前記第1コア層の外周縁側壁の少なくとも一部が前記第2コア層および前記第3コア層をなす金属材質で覆われる、請求項1から6の何れか一項に記載の回路基板。
- 前記コア部の一面と他面との間を貫通するキャビティ(cavity)が備えられており、前記キャビティの内部に第1電子部品の少なくとも一部が挿入される、請求項1から7の何れか一項に記載の回路基板。
- 前記第1電子部品の外周縁側壁の少なくとも一部が前記絶縁膜を挟んで前記キャビティに接触される、請求項8に記載の回路基板。
- グラファイト(graphite)またはグラフェン(graphene)材質からなり、一面と他面との間を貫通するスルーホールが形成された第1コア層と、金属材質からなり、前記第1コア層の一面および他面にそれぞれ形成された第2コア層および第3コア層と、を含むコア部を含み、
前記スルーホールには、前記第2コア層および前記第3コア層をなす前記金属材質が充填されており、
前記第1コア層の表面にプライマー層が備えられ、
前記プライマー層は、イソプロピルアルコール(Iso Propyl alcohol)、アクリル(Acryl)系シラン(Silan)、およびMPS(3‐(trimethoxysilyl)propylmethacrylate)のうち少なくとも一つを含む回路基板。 - 前記第1コア層は、グラファイトまたはグラフェンの表面にプライマー層が備えられてなる単位体が積層されてなる、請求項10に記載の回路基板。
- グラファイト(graphite)またはグラフェン(graphene)材質からなり、一面と他面との間を貫通するスルーホールが形成された第1コア層を提供する段階と、
前記スルーホールの内部に金属材が充填されるように前記第1コア層の一面および他面に前記金属材を提供して第2コア層および第3コア層を形成することで、コア部を形成する段階と、
前記コア部の一面と他面との間を貫通し、且つ前記スルーホールの内側を通過するスルービアホールを形成する段階と、
前記スルービアホールの内側壁に絶縁膜を形成する段階と、
前記スルービアホールに導体を充填してスルービアを形成する段階と、を含む回路基板の製造方法。 - 前記スルービアホールを形成する段階と前記絶縁膜を形成する段階との間に、
前記第2コア層または前記第3コア層を貫通して前記第1コア層を露出させるビアホールを形成する段階をさらに含む、請求項12に記載の回路基板の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR10-2015-0025165 | 2015-02-23 | ||
KR1020150025165A KR102295104B1 (ko) | 2015-02-23 | 2015-02-23 | 회로기판 및 회로기판 제조방법 |
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Publication Number | Publication Date |
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JP2016157926A JP2016157926A (ja) | 2016-09-01 |
JP6786764B2 true JP6786764B2 (ja) | 2020-11-18 |
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Application Number | Title | Priority Date | Filing Date |
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JP2016017522A Active JP6786764B2 (ja) | 2015-02-23 | 2016-02-01 | 回路基板および回路基板の製造方法 |
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Country | Link |
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US (1) | US20160249450A1 (ja) |
JP (1) | JP6786764B2 (ja) |
KR (1) | KR102295104B1 (ja) |
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CN115735420A (zh) * | 2020-07-02 | 2023-03-03 | 株式会社村田制作所 | 多层电路基板以及电子部件安装多层基板 |
EP4233496A4 (en) * | 2020-10-26 | 2024-10-02 | Ericsson Telefon Ab L M | CIRCUIT BOARD ARRANGEMENT COMPRISING A CIRCUIT BOARD WITH A GRAPHENE ISLAND AND METHOD FOR COMMUNICATION BETWEEN A FIRST AND A SECOND CIRCUIT |
US12096561B2 (en) * | 2021-11-01 | 2024-09-17 | Raytheon Company | Nanocomposite material for ultraviolet curable direct write semiconductor applications |
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JPH1140902A (ja) * | 1997-07-18 | 1999-02-12 | Cmk Corp | プリント配線板及びその製造方法 |
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JP3988764B2 (ja) * | 2004-10-13 | 2007-10-10 | 三菱電機株式会社 | プリント配線板用基材、プリント配線板及びプリント配線板用基材の製造方法 |
KR100976201B1 (ko) | 2007-10-30 | 2010-08-17 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조 방법 |
JP5754333B2 (ja) * | 2011-09-30 | 2015-07-29 | イビデン株式会社 | 多層プリント配線板及び多層プリント配線板の製造方法 |
JP5938577B2 (ja) * | 2012-04-19 | 2016-06-22 | パナソニックIpマネジメント株式会社 | 熱伝導シートおよびその製造方法およびこれを用いた熱伝導体 |
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