JP6783205B2 - 電磁波シールドフィルム - Google Patents

電磁波シールドフィルム Download PDF

Info

Publication number
JP6783205B2
JP6783205B2 JP2017171417A JP2017171417A JP6783205B2 JP 6783205 B2 JP6783205 B2 JP 6783205B2 JP 2017171417 A JP2017171417 A JP 2017171417A JP 2017171417 A JP2017171417 A JP 2017171417A JP 6783205 B2 JP6783205 B2 JP 6783205B2
Authority
JP
Japan
Prior art keywords
glossiness
insulating layer
less
electromagnetic wave
fingerprint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017171417A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018041962A (ja
Inventor
宗悟 石岡
宗悟 石岡
善治 柳
善治 柳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Publication of JP2018041962A publication Critical patent/JP2018041962A/ja
Application granted granted Critical
Publication of JP6783205B2 publication Critical patent/JP6783205B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A30/00—Adapting or protecting infrastructure or their operation

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electrostatic Charge, Transfer And Separation In Electrography (AREA)
JP2017171417A 2016-09-06 2017-09-06 電磁波シールドフィルム Active JP6783205B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016173793 2016-09-06
JP2016173793 2016-09-06

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020176728A Division JP7083880B2 (ja) 2016-09-06 2020-10-21 電磁波シールドフィルム

Publications (2)

Publication Number Publication Date
JP2018041962A JP2018041962A (ja) 2018-03-15
JP6783205B2 true JP6783205B2 (ja) 2020-11-11

Family

ID=61531537

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2017171417A Active JP6783205B2 (ja) 2016-09-06 2017-09-06 電磁波シールドフィルム
JP2020176728A Active JP7083880B2 (ja) 2016-09-06 2020-10-21 電磁波シールドフィルム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2020176728A Active JP7083880B2 (ja) 2016-09-06 2020-10-21 電磁波シールドフィルム

Country Status (3)

Country Link
JP (2) JP6783205B2 (ko)
KR (2) KR102394462B1 (ko)
CN (3) CN111818784B (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107592783A (zh) 2017-09-15 2018-01-16 中山国安火炬科技发展有限公司 一种电磁屏蔽膜及其制备方法
JP7200675B2 (ja) * 2017-10-10 2023-01-10 東レ株式会社 フィルム
CN108323140A (zh) * 2018-01-24 2018-07-24 中山国安火炬科技发展有限公司 一种电磁波屏蔽膜及其制备方法和应用
JP6431998B1 (ja) * 2018-03-20 2018-11-28 タツタ電線株式会社 導電性接着剤層
JP7234698B2 (ja) * 2018-03-29 2023-03-08 東レ株式会社 二軸配向ポリプロピレンフィルム、金属膜積層フィルムおよびフィルムコンデンサ
CN108513427B (zh) * 2018-04-16 2019-09-06 东莞市航晨纳米材料有限公司 一种超薄低介电常数、低电阻电磁屏蔽膜
US10581081B1 (en) 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
JP6597927B1 (ja) * 2019-06-18 2019-10-30 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、および電磁波シールド性配線回路基板
TW202224551A (zh) * 2020-11-05 2022-06-16 日商拓自達電線股份有限公司 電磁波屏蔽膜及屏蔽印刷配線板
TW202313328A (zh) * 2021-06-18 2023-04-01 日商拓自達電線股份有限公司 電磁波屏蔽膜
TWI799134B (zh) * 2022-02-11 2023-04-11 長春石油化學股份有限公司 聚合物膜及其應用

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6777045B2 (en) * 2001-06-27 2004-08-17 Applied Materials Inc. Chamber components having textured surfaces and method of manufacture
JP4201548B2 (ja) 2002-07-08 2008-12-24 タツタ電線株式会社 シールドフィルム、シールドフレキシブルプリント配線板及びそれらの製造方法
TWI384940B (zh) * 2005-02-25 2013-02-01 Dainippon Printing Co Ltd Electromagnetic wave shielding filter
GB0505517D0 (en) * 2005-03-17 2005-04-27 Dupont Teijin Films Us Ltd Coated polymeric substrates
JP5282675B2 (ja) * 2009-06-23 2013-09-04 日立電線株式会社 プリント配線板用銅箔およびその製造方法
JP2011099744A (ja) * 2009-11-05 2011-05-19 Nippon Paint Co Ltd 耐指紋性評価方法および耐指紋性被膜
KR101046200B1 (ko) * 2010-06-23 2011-07-05 에스디플렉스(주) 전자파 차폐필름의 제조방법 및 이에 의해 제조된 전자파 차폐필름
KR20170045394A (ko) * 2010-08-30 2017-04-26 에이케이 스틸 프로퍼티즈 인코포레이티드 최종 형태가 스테인리스강인 아연 코팅 탄소강
JP5703815B2 (ja) * 2011-02-16 2015-04-22 Ｊｆｅスチール株式会社 表面処理鋼板、電磁波シールド部材および電磁波シールド筐体
SG193340A1 (en) * 2011-03-07 2013-10-30 Entegris Inc Chemical mechanical planarization pad conditioner
US20140110153A1 (en) * 2012-01-17 2014-04-24 Panasonic Corporation Wiring board and method for manufacturing the same
JP6010945B2 (ja) * 2012-03-16 2016-10-19 住友ベークライト株式会社 ダイシングフィルム
CN103811654B (zh) * 2012-11-15 2017-03-08 纳米新能源（唐山）有限责任公司 具有压电效应的压电电缆及其制备方法和用途
CN104002515B (zh) * 2013-02-25 2016-08-03 南亚塑胶工业股份有限公司 复合式双面黑色铜箔及其制造方法
WO2014175124A1 (ja) * 2013-04-24 2014-10-30 旭硝子株式会社 反射防止層付き基材
CN105612052B (zh) * 2013-10-11 2018-04-20 琳得科株式会社 工艺片
JP2016018068A (ja) * 2014-07-08 2016-02-01 旭硝子株式会社 防眩膜付き基材および物品
CN204087849U (zh) * 2014-08-13 2015-01-07 卜汝雪 一种具有超高屏蔽性能的电缆
JP6381117B2 (ja) * 2014-09-04 2018-08-29 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きフレキシブルプリント配線板の製造方法
JP6184025B2 (ja) * 2014-09-04 2017-08-23 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きフレキシブルプリント配線板の製造方法
US10244627B2 (en) * 2014-12-25 2019-03-26 Sumitomo Electric Industries, Ltd. Substrate for printed wiring board and method for producing the same, printed wiring board and method for producing the same, and resin base material
KR101862121B1 (ko) * 2015-02-02 2018-05-29 토요잉크Sc홀딩스주식회사 전자파 차폐 시트, 프린트 배선판 및 전자 기기
JP5796690B1 (ja) * 2015-02-02 2015-10-21 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびプリント配線板
JP2016150473A (ja) * 2015-02-16 2016-08-22 リンテック株式会社 粗面化フィルム及びその製造方法
CN204869869U (zh) * 2015-04-28 2015-12-16 比亚迪股份有限公司 一种防指纹壳体
CN105246313B (zh) * 2015-09-29 2018-07-27 朱春芳 一种电磁波屏蔽膜、含有该屏蔽膜的印刷线路板及该线路板的制备方法
CN205030048U (zh) * 2015-10-25 2016-02-10 东莞市导谷电子材料科技有限公司 一种新型软体电磁波屏蔽膜
JP6621487B2 (ja) * 2016-02-12 2019-12-18 タツタ電線株式会社 電磁波シールドフィルム
CN105907287B (zh) * 2016-05-16 2018-04-27 四川龙华光电薄膜股份有限公司 防紫外防眩光防指纹增硬涂液组合物、涂层及其制备方法

Also Published As

Publication number Publication date
JP7083880B2 (ja) 2022-06-13
KR102394462B1 (ko) 2022-05-03
CN111800997A (zh) 2020-10-20
CN107801366A (zh) 2018-03-13
CN111800997B (zh) 2023-08-29
KR102567422B1 (ko) 2023-08-14
CN107801366B (zh) 2020-07-17
JP2018041962A (ja) 2018-03-15
CN111818784A (zh) 2020-10-23
CN111818784B (zh) 2023-03-24
KR20220058520A (ko) 2022-05-09
JP2021010032A (ja) 2021-01-28
KR20180027388A (ko) 2018-03-14

Similar Documents

Publication Publication Date Title
JP7083880B2 (ja) 電磁波シールドフィルム
JP6722370B2 (ja) プリント配線基板用貼付フィルム
KR101956091B1 (ko) 전자파 차폐 필름
KR102432750B1 (ko) 전자파 차폐 필름
CN112136368B (zh) 印制线路基材用贴附膜及屏蔽线路基材
JP6426865B1 (ja) 電磁波シールドフィルム
TWI728302B (zh) 電磁波屏蔽膜
JP7410182B2 (ja) 形状転写フィルム
JP2019125618A (ja) 電磁波シールドフィルム
WO2024004991A1 (ja) 電磁波シールドフィルム
TWI844723B (zh) 形狀轉印薄膜
JP2011204775A (ja) 電磁波シールド材
TW202313328A (zh) 電磁波屏蔽膜

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190710

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20200423

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200923

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20201021

R150 Certificate of patent or registration of utility model

Ref document number: 6783205

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250