JP6781600B2 - 液体吐出装置、インプリント装置および方法 - Google Patents

液体吐出装置、インプリント装置および方法 Download PDF

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Publication number
JP6781600B2
JP6781600B2 JP2016192139A JP2016192139A JP6781600B2 JP 6781600 B2 JP6781600 B2 JP 6781600B2 JP 2016192139 A JP2016192139 A JP 2016192139A JP 2016192139 A JP2016192139 A JP 2016192139A JP 6781600 B2 JP6781600 B2 JP 6781600B2
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Japan
Prior art keywords
liquid
discharge
nozzle
storage unit
positive pressure
Prior art date
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Active
Application number
JP2016192139A
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English (en)
Japanese (ja)
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JP2018051495A (ja
JP2018051495A5 (https=
Inventor
義雅 荒木
義雅 荒木
祐一 ▲高▼橋
祐一 ▲高▼橋
新井　剛
剛 新井
裕 三田
裕 三田
達 石橋
達 石橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2016192139A priority Critical patent/JP6781600B2/ja
Priority to KR1020170121015A priority patent/KR102266118B1/ko
Publication of JP2018051495A publication Critical patent/JP2018051495A/ja
Publication of JP2018051495A5 publication Critical patent/JP2018051495A5/ja
Application granted granted Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

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  • Coating Apparatus (AREA)
  • Ink Jet (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2016192139A 2016-09-29 2016-09-29 液体吐出装置、インプリント装置および方法 Active JP6781600B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016192139A JP6781600B2 (ja) 2016-09-29 2016-09-29 液体吐出装置、インプリント装置および方法
KR1020170121015A KR102266118B1 (ko) 2016-09-29 2017-09-20 액체 토출 장치, 임프린트 장치 및 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016192139A JP6781600B2 (ja) 2016-09-29 2016-09-29 液体吐出装置、インプリント装置および方法

Publications (3)

Publication Number Publication Date
JP2018051495A JP2018051495A (ja) 2018-04-05
JP2018051495A5 JP2018051495A5 (https=) 2019-10-31
JP6781600B2 true JP6781600B2 (ja) 2020-11-04

Family

ID=61834823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016192139A Active JP6781600B2 (ja) 2016-09-29 2016-09-29 液体吐出装置、インプリント装置および方法

Country Status (2)

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JP (1) JP6781600B2 (https=)
KR (1) KR102266118B1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7134847B2 (ja) * 2018-11-28 2022-09-12 キヤノン株式会社 吐出材吐出装置およびインプリント装置
JP7395890B2 (ja) * 2019-09-10 2023-12-12 株式会社リコー 液体を吐出する装置
CN115210934B (zh) 2020-10-23 2025-04-22 株式会社Lg新能源 电极绝缘液供应设备及电极绝缘液供应方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004223829A (ja) * 2003-01-22 2004-08-12 Ricoh Co Ltd インクジェット記録装置
JP4645066B2 (ja) * 2004-05-28 2011-03-09 凸版印刷株式会社 塗工装置
JP2006212879A (ja) * 2005-02-02 2006-08-17 Konica Minolta Medical & Graphic Inc インクジェットプリンタ
JP2008105360A (ja) * 2006-10-27 2008-05-08 Fujifilm Corp インク貯留容器およびインクジェット記録装置
JP5269329B2 (ja) * 2007-03-09 2013-08-21 富士フイルム株式会社 液体吐出装置及び液体吐出面メンテナンス方法
JP6286905B2 (ja) * 2013-07-11 2018-03-07 大日本印刷株式会社 インプリント装置及びインプリント方法
JP6362109B2 (ja) 2013-10-04 2018-07-25 キヤノン株式会社 インプリント装置および部品の製造方法
JP2015128849A (ja) * 2014-01-07 2015-07-16 セイコーエプソン株式会社 液体吐出装置、および液体供給路の状態検出方法
JP6530653B2 (ja) * 2014-07-25 2019-06-12 キヤノン株式会社 液体吐出装置、インプリント装置および物品製造方法
JP2016120613A (ja) * 2014-12-24 2016-07-07 エスアイアイ・プリンテック株式会社 液体供給システム及び液体供給システムの駆動方法

Also Published As

Publication number Publication date
KR20180035677A (ko) 2018-04-06
JP2018051495A (ja) 2018-04-05
KR102266118B1 (ko) 2021-06-17

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