KR102266118B1 - 액체 토출 장치, 임프린트 장치 및 방법 - Google Patents

액체 토출 장치, 임프린트 장치 및 방법 Download PDF

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Publication number
KR102266118B1
KR102266118B1 KR1020170121015A KR20170121015A KR102266118B1 KR 102266118 B1 KR102266118 B1 KR 102266118B1 KR 1020170121015 A KR1020170121015 A KR 1020170121015A KR 20170121015 A KR20170121015 A KR 20170121015A KR 102266118 B1 KR102266118 B1 KR 102266118B1
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South Korea
Prior art keywords
liquid
discharge
nozzle
switching means
pressure
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KR1020170121015A
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Korean (ko)
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KR20180035677A (ko
Inventor
요시마사 아라키
유이치 다카하시
츠요시 아라이
유타카 미타
도오루 이시바시
Original Assignee
캐논 가부시끼가이샤
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Publication of KR20180035677A publication Critical patent/KR20180035677A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H01L21/67051—
    • H01L21/02052—
    • H01L21/0274—
    • H01L21/6715—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

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  • Coating Apparatus (AREA)
  • Ink Jet (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020170121015A 2016-09-29 2017-09-20 액체 토출 장치, 임프린트 장치 및 방법 Active KR102266118B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-192139 2016-09-29
JP2016192139A JP6781600B2 (ja) 2016-09-29 2016-09-29 液体吐出装置、インプリント装置および方法

Publications (2)

Publication Number Publication Date
KR20180035677A KR20180035677A (ko) 2018-04-06
KR102266118B1 true KR102266118B1 (ko) 2021-06-17

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KR1020170121015A Active KR102266118B1 (ko) 2016-09-29 2017-09-20 액체 토출 장치, 임프린트 장치 및 방법

Country Status (2)

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JP (1) JP6781600B2 (https=)
KR (1) KR102266118B1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7134847B2 (ja) * 2018-11-28 2022-09-12 キヤノン株式会社 吐出材吐出装置およびインプリント装置
JP7395890B2 (ja) * 2019-09-10 2023-12-12 株式会社リコー 液体を吐出する装置
CN115210934B (zh) 2020-10-23 2025-04-22 株式会社Lg新能源 电极绝缘液供应设备及电极绝缘液供应方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016120613A (ja) * 2014-12-24 2016-07-07 エスアイアイ・プリンテック株式会社 液体供給システム及び液体供給システムの駆動方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004223829A (ja) * 2003-01-22 2004-08-12 Ricoh Co Ltd インクジェット記録装置
JP4645066B2 (ja) * 2004-05-28 2011-03-09 凸版印刷株式会社 塗工装置
JP2006212879A (ja) * 2005-02-02 2006-08-17 Konica Minolta Medical & Graphic Inc インクジェットプリンタ
JP2008105360A (ja) * 2006-10-27 2008-05-08 Fujifilm Corp インク貯留容器およびインクジェット記録装置
JP5269329B2 (ja) * 2007-03-09 2013-08-21 富士フイルム株式会社 液体吐出装置及び液体吐出面メンテナンス方法
JP6286905B2 (ja) * 2013-07-11 2018-03-07 大日本印刷株式会社 インプリント装置及びインプリント方法
JP6362109B2 (ja) 2013-10-04 2018-07-25 キヤノン株式会社 インプリント装置および部品の製造方法
JP2015128849A (ja) * 2014-01-07 2015-07-16 セイコーエプソン株式会社 液体吐出装置、および液体供給路の状態検出方法
JP6530653B2 (ja) * 2014-07-25 2019-06-12 キヤノン株式会社 液体吐出装置、インプリント装置および物品製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016120613A (ja) * 2014-12-24 2016-07-07 エスアイアイ・プリンテック株式会社 液体供給システム及び液体供給システムの駆動方法

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Publication number Publication date
KR20180035677A (ko) 2018-04-06
JP6781600B2 (ja) 2020-11-04
JP2018051495A (ja) 2018-04-05

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