JP6776344B2 - 半導電性シールド組成物 - Google Patents
半導電性シールド組成物 Download PDFInfo
- Publication number
- JP6776344B2 JP6776344B2 JP2018514978A JP2018514978A JP6776344B2 JP 6776344 B2 JP6776344 B2 JP 6776344B2 JP 2018514978 A JP2018514978 A JP 2018514978A JP 2018514978 A JP2018514978 A JP 2018514978A JP 6776344 B2 JP6776344 B2 JP 6776344B2
- Authority
- JP
- Japan
- Prior art keywords
- semi
- conductive shield
- composition
- shield layer
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen
- C08L23/0853—Ethene vinyl acetate copolymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/005—Stabilisers against oxidation, heat, light, ozone
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
- C08L9/02—Copolymers with acrylonitrile
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D123/00—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers
- C09D123/02—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
- C09D123/04—Homopolymers or copolymers of ethene
- C09D123/08—Copolymers of ethene
- C09D123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09D123/0853—Vinylacetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/08—Anti-corrosive paints
- C09D5/082—Anti-corrosive paints characterised by the anti-corrosive pigment
- C09D5/086—Organic or non-macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/20—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for coatings strippable as coherent films, e.g. temporary coatings strippable as coherent films
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/28—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances natural or synthetic rubbers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/446—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylacetals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/02—Disposition of insulation
- H01B7/0291—Disposition of insulation comprising two or more layers of insulation having different electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B9/00—Power cables
- H01B9/02—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients
- H01B9/027—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients composed of semi-conducting layers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2323/04—Homopolymers or copolymers of ethene
- C08J2323/08—Copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/202—Applications use in electrical or conductive gadgets use in electrical wires or wirecoating
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562238272P | 2015-10-07 | 2015-10-07 | |
| US62/238,272 | 2015-10-07 | ||
| PCT/US2016/054401 WO2017062255A1 (en) | 2015-10-07 | 2016-09-29 | Semiconductive shield composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018531299A JP2018531299A (ja) | 2018-10-25 |
| JP2018531299A6 JP2018531299A6 (ja) | 2018-12-13 |
| JP6776344B2 true JP6776344B2 (ja) | 2020-10-28 |
Family
ID=57138142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018514978A Active JP6776344B2 (ja) | 2015-10-07 | 2016-09-29 | 半導電性シールド組成物 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US10501645B2 (enExample) |
| EP (1) | EP3359601B1 (enExample) |
| JP (1) | JP6776344B2 (enExample) |
| KR (1) | KR102664628B1 (enExample) |
| CN (1) | CN108026348B (enExample) |
| BR (1) | BR112018005526B1 (enExample) |
| CA (1) | CA3001160C (enExample) |
| MX (1) | MX392439B (enExample) |
| WO (1) | WO2017062255A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109651694A (zh) * | 2018-12-26 | 2019-04-19 | 江阴市海江高分子材料有限公司 | 一种易剥离硅烷交联电缆用半导电外屏蔽料及其制备方法 |
| RU2700506C1 (ru) * | 2019-03-28 | 2019-09-17 | Николай Даниелян | Токопровод |
| KR102560235B1 (ko) * | 2019-12-23 | 2023-07-28 | 한화솔루션 주식회사 | 반도전 컴파운드 조성물 |
| KR102641968B1 (ko) * | 2019-12-23 | 2024-02-29 | 한화솔루션 주식회사 | 고압 케이블의 반도전층 조성물 |
| CN115286855A (zh) * | 2022-07-15 | 2022-11-04 | 青岛科技大学 | 一种高压直流半导电屏蔽材料及其制备方法 |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2115207A (en) * | 1935-04-05 | 1938-04-26 | Nicholas A Milas | Organic peroxides, and process of preparing the same |
| SE440709B (sv) | 1976-06-10 | 1985-08-12 | Asea Ab | Sett att med anvendning av en strengsprutmaskin pa en med isolering av icke tverbunden eller tverbunden polyten forsedd kabelledare applicera ett ledande, avrivbart skikt |
| US4246142A (en) | 1976-10-04 | 1981-01-20 | Union Carbide Corporation | Vulcanizable semi-conductive compositions |
| US4286023A (en) | 1976-10-04 | 1981-08-25 | Union Carbide Corporation | Article of manufacture, the cross-linked product of a semi-conductive composition bonded to a crosslinked polyolefin substrate |
| US4150193A (en) * | 1977-12-19 | 1979-04-17 | Union Carbide Corporation | Insulated electrical conductors |
| JPS5662846A (en) | 1979-10-29 | 1981-05-29 | Mitsubishi Petrochem Co Ltd | Semiconductive resin composition |
| EP0420271B1 (en) | 1989-09-29 | 1994-12-21 | Union Carbide Chemicals And Plastics Company, Inc. | Insulated electrical conductors |
| JPH04311746A (ja) * | 1991-04-09 | 1992-11-04 | Mitsubishi Cable Ind Ltd | 電力ケーブル用剥離性半導電性組成物 |
| US5246783A (en) | 1991-08-15 | 1993-09-21 | Exxon Chemical Patents Inc. | Electrical devices comprising polymeric insulating or semiconducting members |
| US5747559A (en) * | 1995-11-22 | 1998-05-05 | Cabot Corporation | Polymeric compositions |
| US6496629B2 (en) | 1999-05-28 | 2002-12-17 | Tycom (Us) Inc. | Undersea telecommunications cable |
| JP2001302856A (ja) * | 2000-02-17 | 2001-10-31 | Fujikura Ltd | 半導電性樹脂組成物およびそれを用いた電力ケーブル |
| US6291772B1 (en) * | 2000-04-25 | 2001-09-18 | General Cable Technologies Corporation | High performance power cable shield |
| US6858296B1 (en) | 2000-10-05 | 2005-02-22 | Union Carbide Chemicals & Plastics Technology Corporation | Power cable |
| JP5025050B2 (ja) * | 2001-06-01 | 2012-09-12 | 日本ユニカー株式会社 | 架橋性半導電性樹脂組成物およびそれを用いた電力ケーブル |
| US6714707B2 (en) | 2002-01-24 | 2004-03-30 | Alcatel | Optical cable housing an optical unit surrounded by a plurality of gel layers |
| JP2004177934A (ja) | 2002-11-13 | 2004-06-24 | Keyence Corp | 透過型光電センサ、これに組み込まれる素子ホルダ並びにその製造方法 |
| WO2004088674A1 (en) | 2003-03-27 | 2004-10-14 | Dow Global Technologies Inc. | Power cable compositions for strippable adhesion |
| US6972099B2 (en) | 2003-04-30 | 2005-12-06 | General Cable Technologies Corporation | Strippable cable shield compositions |
| EP1869120B1 (en) * | 2005-04-04 | 2014-12-31 | Showa Denko K.K. | Electrically conducting curable resin composition, cured product thereof and molded article of the same |
| US7767299B2 (en) | 2005-04-29 | 2010-08-03 | General Cable Technologies Corporation | Strippable cable shield compositions |
| TW200713336A (en) * | 2005-08-05 | 2007-04-01 | Dow Global Technologies Inc | Polypropylene-based wire and cable insulation or jacket |
| KR101468482B1 (ko) * | 2006-10-16 | 2014-12-03 | 시바 홀딩 인코포레이티드 | 안정화된 중압 및 고압 절연 조성물 |
| WO2009042364A1 (en) | 2007-09-25 | 2009-04-02 | Dow Global Technologies Inc. | Styrenic polymers as blend components to control adhesion between olefinic substrates |
| ATE503797T1 (de) * | 2008-05-27 | 2011-04-15 | Borealis Ag | Ablösbare halbleitende zusammensetzung mit bei niedriger temperatur schmelzenden polyolefinen |
| EP2576689B1 (en) | 2010-06-03 | 2014-12-17 | Dow Global Technologies LLC | Strippable insulation shield for cables |
| WO2012040058A1 (en) * | 2010-09-22 | 2012-03-29 | Union Carbide Chemichal & Plastics Technology Llc | Acetylene black semiconducting shield material with improved processing |
| CN103460302A (zh) * | 2011-03-29 | 2013-12-18 | 联合碳化化学及塑料技术有限责任公司 | 具有改进的剥离性能的半导电护套组合物 |
| US20140193744A1 (en) * | 2011-08-31 | 2014-07-10 | Showa Denko K.K. | Heat-curable resin composition, production method of cured article and molded article of the same, cured article, molded article, and separator for a fuel cell |
| US20130178726A1 (en) * | 2012-01-05 | 2013-07-11 | Medtronic Minimed, Inc. | Stabilized polymers for use with analyte sensors and methods for making and using them |
| KR20150058296A (ko) * | 2012-09-19 | 2015-05-28 | 제너럴 케이블 테크놀로지즈 코오포레이션 | 스트리퍼블 반도체 쉴드 조성물들 |
| CN104361945B (zh) * | 2014-11-13 | 2016-08-24 | 无锡市明珠电缆有限公司 | 一种无卤阻燃耐低温中压风能电缆的制备方法 |
-
2016
- 2016-09-29 CA CA3001160A patent/CA3001160C/en active Active
- 2016-09-29 KR KR1020187011447A patent/KR102664628B1/ko active Active
- 2016-09-29 MX MX2018003558A patent/MX392439B/es unknown
- 2016-09-29 BR BR112018005526-3A patent/BR112018005526B1/pt active IP Right Grant
- 2016-09-29 WO PCT/US2016/054401 patent/WO2017062255A1/en not_active Ceased
- 2016-09-29 US US15/765,624 patent/US10501645B2/en active Active
- 2016-09-29 EP EP16782146.1A patent/EP3359601B1/en active Active
- 2016-09-29 CN CN201680054751.9A patent/CN108026348B/zh active Active
- 2016-09-29 JP JP2018514978A patent/JP6776344B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP3359601B1 (en) | 2019-10-23 |
| KR20180097507A (ko) | 2018-08-31 |
| CN108026348B (zh) | 2021-03-09 |
| MX2018003558A (es) | 2018-06-18 |
| US20180298205A1 (en) | 2018-10-18 |
| CA3001160C (en) | 2023-10-17 |
| KR102664628B1 (ko) | 2024-05-09 |
| CN108026348A (zh) | 2018-05-11 |
| MX392439B (es) | 2025-03-24 |
| WO2017062255A1 (en) | 2017-04-13 |
| CA3001160A1 (en) | 2017-04-13 |
| US10501645B2 (en) | 2019-12-10 |
| BR112018005526B1 (pt) | 2022-06-14 |
| JP2018531299A (ja) | 2018-10-25 |
| EP3359601A1 (en) | 2018-08-15 |
| BR112018005526A2 (enExample) | 2018-10-02 |
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