JP6764421B2 - 電子部品を成形するためのモジュールシステムおよびそのモジュールシステムを組み立てるためのパーツキット - Google Patents
電子部品を成形するためのモジュールシステムおよびそのモジュールシステムを組み立てるためのパーツキット Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/50—Removing moulded articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0084—General arrangement or lay-out of plants
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/03—Injection moulding apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
- B29C2043/182—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated completely
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3406—Components, e.g. resistors
Description
Claims (17)
- 少なくとも3つの個別のシステムモジュールを有する、電子部品を成形するためのモジュールシステム(30)であって、
前記システムモジュールとして、
インテリジェント電子制御システムを含むサービスモジュール(31)と、
電子部品を成形するためのプレス構造を有する少なくとも1つのプレスモジュール(33、34)と、
成形すべき前記電子部品をカセットから前記プレスモジュール(33、34)に装入するための少なくとも1つのローダーモジュール(32)と、を有し、
前記少なくとも1つのプレスモジュール(33、34)および前記少なくとも1つのローダーモジュール(32)を横方向に直列に整列して相互に連結固定するための協働カップリング(8)を備え、
前記インテリジェント電子制御システムは前記少なくとも1つのプレスモジュールおよび前記少なくとも1つのローダーモジュールの各々を少なくとも部分的に制御するように構成されており、
前記少なくとも1つのプレスモジュール(33、34)の前記協働カップリング(8)は、前記プレス構造に一体に設けられていることを特徴とするモジュールシステム(30)。 - 成形された電子部品をプレスから取り外してカセットへの導くための少なくとも1つのオフ・ローダーモジュール(35)をさらに備え、前記オフ・ローダーモジュール(35)は、少なくとも一方の側に、前記オフ・ローダーモジュール(35)を前記プレスモジュール(33、34)に直列に整列して連結固定するための協働カップリング(8)を備える、請求項1に記載のモジュールシステム(30)。
- 封入する材料を前記プレスモジュール(33、34)に供給するための少なくとも1つの供給モジュールをさらに備える、請求項1または2に記載のモジュールシステム(30)。
- 成形すべき電子部品を伴ったウエファーをFOUP支持体から隣接するモジュールに装入するためのFOUP・ローダーモジュール(41)をさらに備える、請求項1から3のいずれか1項に記載のモジュールシステム(30)。
- 電子部品を伴った成形されたウエファーを隣接するモジュールから取り出してFOUP・カセットへと導くためのFOUP・オフ・ローダーモジュール(42)をさらに備える、請求項1から4のいずれか1項に記載のモジュールシステム(30)。
- 前記ローダーモジュール(32)が、少なくとも1つのプレスモジュール(33、34)へと延在するように構成されたローダーヘッド(10)を有する、請求項1から5のいずれか1項に記載のモジュールシステム(30)。
- 各プレスモジュール(33、34)が、両側に覆い可能な移動用開口(38)を有するハウジング(37)を備える、請求項1から6のいずれか1項に記載のモジュールシステム(30)。
- 前記オフ・ローダーモジュール(35)が、前記少なくとも1つのプレスモジュール(33、34)へと延在するように構成されたクリーニングおよびオフ・ローダーヘッド(11)を備えている、請求項2に記載のモジュールシステム(30)。
- 少なくとも2つの前記プレスモジュール(33、34)を備える、請求項1から8のいずれか1項に記載のモジュールシステム(30)。
- 前記プレスモジュール(33、34)が協働するガイドパーツ(13、14、15、16)を備える、請求項9に記載のモジュールシステム(30)。
- 成形された電子部品をプレスから取り外してカセットへの導くための少なくとも1つのオフ・ローダーモジュール(35)を備え、前記オフ・ローダーモジュール(35)は、少なくとも一方の側に、前記オフ・ローダーモジュール(35)を前記プレスモジュール(33、34)に直列に整列して連結固定するための協働カップリング(8)を備え、
封入する材料を前記プレスモジュール(33、34)に供給するための少なくとも1つの供給モジュールを備え、
前記供給モジュールが、前記オフ・ローダーモジュール(35)に一体化されている、請求項1に記載のモジュールシステム(30)。 - 前記プレスモジュール(33、34)、前記サービスモジュール(31)、前記ローダーモジュール(32)、および前記オフ・ローダーモジュール(35)が、それらが備えられている場合に限り、横方向に同じ幅を有する、請求項2に記載のモジュールシステム(30)。
- 成形された電子部品をプレスから取り外してカセットへの導くための少なくとも1つのオフ・ローダーモジュール(35)を備え、前記オフ・ローダーモジュール(35)は、少なくとも一方の側に、前記オフ・ローダーモジュール(35)を前記プレスモジュール(33、34)に直列に整列して連結固定するための協働カップリング(8)を備え、
封入する材料を前記プレスモジュール(33、34)に供給するための少なくとも1つの供給モジュールを備え、
成形すべき電子部品を伴ったウエファーをFOUP支持体から隣接するモジュールに装入するためのFOUP・ローダーモジュール(41)を備え、
電子部品を伴った成形されたウエファーを隣接するモジュールから取り出してFOUP・カセットへと導くためのFOUP・オフ・ローダーモジュール(42)を備え、
前記プレスモジュール(33、34)、前記ローダーモジュール(32)、前記オフ・ローダーモジュール(35)、前記供給モジュール、前記FOUP・ローダーモジュール(41)、および前記FOUP・オフ・ローダーモジュール(42)が、それらが備えられている場合に限り、前記サービスモジュール(31)によって少なくとも部分的に制御される、請求項1に記載のモジュールシステム(30)。 - 前記協働カップリング(8)が雄型および雌型カップリング要素を有する、請求項1から13のいずれか1項に記載のモジュールシステム(30)。
- 前記プレスモジュール(33、34)が、両側に2つの前記協働カップリング(8)を有し、その2つの前記協働カップリング(8)が水平である、請求項1から14のいずれか1項に記載のモジュールシステム(30)。
- 前記システムモジュールの全ての前記協働カップリング(8)が1つの水平平面にある、請求項15に記載のモジュールシステム(30)。
- 請求項1から16のいずれか1項に記載のモジュールシステム(30)を組み立てるためのパーツキットであって、
インテリジェント電子制御システムを含む前記サービスモジュール(31)と、
電子部品を成形するためのプレス構造を有する前記少なくとも1つのプレスモジュール(33、34)と、
成形すべき電子部品をカセットから前記少なくとも1つのプレスモジュール(33、34)に装入するための前記少なくとも1つのローダーモジュール(32)と、を有し、
前記少なくとも1つのプレスモジュール(33、34)および前記少なくとも1つのローダーモジュール(32)を横方向に直列に整列して相互に連結固定するための協働カップリング(8)を備え、
前記インテリジェント電子制御システムは前記少なくとも1つのプレスモジュール(33、34)および前記少なくとも1つのローダーモジュール(32)の各々を少なくとも部分的に制御するように構成されており、
前記少なくとも1つのプレスモジュール(33、34)の前記協働カップリング(8)が前記プレス構造に一体的に設けられていることを特徴とするパーツキット(1)。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL2014802 | 2015-05-13 | ||
NL2014802A NL2014802B1 (en) | 2015-05-13 | 2015-05-13 | Modular system for moulding electronic components and kit-of-parts for assembling such a modular system. |
PCT/NL2016/050332 WO2016182438A1 (en) | 2015-05-13 | 2016-05-10 | Modular system for moulding electronic components and kit-of-parts for assembling such a modular system |
Publications (2)
Publication Number | Publication Date |
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JP2018522398A JP2018522398A (ja) | 2018-08-09 |
JP6764421B2 true JP6764421B2 (ja) | 2020-09-30 |
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JP2017559108A Active JP6764421B2 (ja) | 2015-05-13 | 2016-05-10 | 電子部品を成形するためのモジュールシステムおよびそのモジュールシステムを組み立てるためのパーツキット |
Country Status (9)
Country | Link |
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US (1) | US10699924B2 (ja) |
JP (1) | JP6764421B2 (ja) |
KR (1) | KR102311267B1 (ja) |
CN (1) | CN107580542A (ja) |
MY (1) | MY185745A (ja) |
NL (1) | NL2014802B1 (ja) |
SG (1) | SG11201708799XA (ja) |
TW (1) | TWI603426B (ja) |
WO (1) | WO2016182438A1 (ja) |
Families Citing this family (4)
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DE102017109677A1 (de) | 2017-05-05 | 2018-11-08 | Atm Gmbh | Einbettpresse, Absaugeinrichtung für eine Einbettpresse und modulares Einbettpressensystem |
DE102017109676A1 (de) | 2017-05-05 | 2018-11-08 | Atm Gmbh | Einbettpresse und Verschlusseinrichtung für eine Einbettpresse |
NL2021552B1 (en) * | 2018-09-03 | 2020-04-30 | Besi Netherlands Bv | Method and device for selective separating electronic components from a frame with electronic components |
JP2023163407A (ja) * | 2022-04-28 | 2023-11-10 | 東洋製罐グループホールディングス株式会社 | 缶体製造システムおよび缶体製造方法 |
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-
2015
- 2015-05-13 NL NL2014802A patent/NL2014802B1/en active
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2016
- 2016-05-10 WO PCT/NL2016/050332 patent/WO2016182438A1/en active Application Filing
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- 2016-05-10 MY MYPI2017704036A patent/MY185745A/en unknown
- 2016-05-10 CN CN201680027106.8A patent/CN107580542A/zh active Pending
- 2016-05-10 JP JP2017559108A patent/JP6764421B2/ja active Active
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- 2016-05-12 TW TW105114754A patent/TWI603426B/zh active
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NL2014802A (en) | 2016-11-24 |
US10699924B2 (en) | 2020-06-30 |
WO2016182438A1 (en) | 2016-11-17 |
TWI603426B (zh) | 2017-10-21 |
MY185745A (en) | 2021-06-03 |
JP2018522398A (ja) | 2018-08-09 |
CN107580542A (zh) | 2018-01-12 |
KR20180006936A (ko) | 2018-01-19 |
KR102311267B1 (ko) | 2021-10-13 |
SG11201708799XA (en) | 2017-11-29 |
TW201643988A (zh) | 2016-12-16 |
US20180068874A1 (en) | 2018-03-08 |
NL2014802B1 (en) | 2016-12-30 |
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