JP2018522398A - 電子部品を成形するためのモジュールシステムおよびそのモジュールシステムを組み立てるためのパーツキット - Google Patents
電子部品を成形するためのモジュールシステムおよびそのモジュールシステムを組み立てるためのパーツキット Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/50—Removing moulded articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0084—General arrangement or lay-out of plants
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
- B29C2043/182—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated completely
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/03—Injection moulding apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3406—Components, e.g. resistors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
Abstract
【選択図】 図4
Description
Claims (18)
- 少なくとも3つの個別のシステムモジュールを有する、電子部品を成形するためのモジュールシステムであって、該システムモジュールが、
電子部品を成形するための少なくとも1つのプレスモジュール、
成形すべき前記電子部品をカセットからプレスモジュールに装入するための少なくとも1つのローダーモジュール、および
他のシステムモジュールの各々を少なくとも部分的に制御するように構成されたインテリジェント電子制御システムを含むサービスモジュールを含み、
前記システムモジュールは、隣接するシステムモジュールの相互整列および固定のための協働カップリングを備え、
このシステムモジュールの協働カップリングは、隣接するシステムモジュールを直列に整列し固定するように構成されており、
前記少なくとも1つのプレスモジュールの協働カップリングは、隣接するシステムモジュールの相互整列および固定のための基準点として機能する、モジュールシステム。 - 成形された電子部品をプレスから取り外してカセットへの導くための少なくとも1つのオフ・ローダーモジュールをさらに備え、該オフ・ローダーモジュールは、少なくとも一方の側に、このオフ・ローダーモジュールをプレスモジュールに相互整列し固定するためのカップリングを備える、請求項1に記載のモジュールシステム。
- 封入する材料をプレスモジュールに供給するための少なくとも1つの供給モジュールをさらに備える、請求項1または2に記載のモジュールシステム。
- 成形すべき電子部品を伴ったウエファーをFOUP支持体から隣接するモジュールに装入するためのFOUP・ローダーモジュールをさらに備える、請求項1から3のいずれか1項に記載のモジュールシステム。
- 電子部品を伴った成形されたウエファーを隣接するモジュールから取り出してFOUP・カセットへと導くためのFOUP・オフ・ローダーモジュールをさらに備える、請求項1から4のいずれか1項に記載のモジュールシステム。
- 前記ローダーモジュールが、少なくとも1つのプレスモジュールへと延在するように構成されたローダーヘッドを有する、請求項1から5のいずれか1項に記載のモジュールシステム。
- 各プレスモジュールが、両側に覆い可能な移動用開口を有するハウジングを備える、請求項1から6のいずれか1項に記載のモジュールシステム。
- 前記オフ・ローダーモジュールが、少なくとも1つのプレスモジュールへと延在するように構成されたクリーニングおよびオフ・ローダーヘッドを備えている、請求項2から7のいずれか1項に記載のモジュールシステム。
- 少なくとも2つのプレスモジュールを備える、請求項1から8のいずれか1項に記載のモジュールシステム。
- 前記プレスモジュールが協働するガイドパーツを備える、請求項9に記載のモジュールシステム。
- 前記供給モジュールが前記オフ・ローダーモジュールに一体化されている、請求項3から10のいずれか1項に記載のモジュールシステム。
- 前記プレスモジュール、前記サービスモジュール、前記ローダーモジュール、および前記オフ・ローダーモジュールが、それらが備えられている場合に限り、同じ幅を有する、請求項1から11のいずれか1項に記載のモジュールシステム。
- 前記プレスモジュール、前記ローダーモジュール、前記オフ・ローダーモジュール、前記供給モジュール、前記FOUP・ローダーモジュール、および前記FOUP・オフ・ローダーモジュールが、それらが備えられている場合に限り、前記サービスモジュールによって少なくとも部分的に制御される、請求項1から12のいずれか1項に記載のモジュールシステム。
- 前記プレスモジュールに設けられたカップリングがプレス構造の一体的部分である、請求項1から13のいずれか1項に記載のモジュールシステム。
- 前記カップリングが雄型および雌型カップリング要素を有する、請求項1から14のいずれか1項に記載のモジュールシステム。
- プレスモジュールが、両側に2つのカップリングを有し、その2つのカップリングが水平である、請求項1から15のいずれか1項に記載のモジュールシステム。
- 前記システムモジュールの全てのカップリングが1つの水平平面にある、請求項16に記載のモジュールシステム。
- 請求項1から17のいずれか1項に記載のモジュールシステムを組み立てるためのパーツキットであって、
電子部品を成形するための少なくとも1つのプレスモジュール、
成形すべき電子部品をカセットからプレスモジュールへ装入するための少なくとも1つのローダーモジュール、および
他のシステムモジュールの各々を少なくとも部分的に制御するように構成されたインテリジェント電子制御システムを含むサービスモジュールを有してなり、
システムモジュールが隣接するシステムモジュールの相互整列および固定のための協働カップリングを備え、
システムモジュールのこの協働カップリングは隣接するシステムモジュールを直列に整列し固定するように構成されており、
前記少なくとも1つのプレスモジュールの協働カップリングが隣接するシステムモジュールの相互整列および固定のための基準点として機能する、パーツキット。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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NL2014802 | 2015-05-13 | ||
NL2014802A NL2014802B1 (en) | 2015-05-13 | 2015-05-13 | Modular system for moulding electronic components and kit-of-parts for assembling such a modular system. |
PCT/NL2016/050332 WO2016182438A1 (en) | 2015-05-13 | 2016-05-10 | Modular system for moulding electronic components and kit-of-parts for assembling such a modular system |
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JP2018522398A true JP2018522398A (ja) | 2018-08-09 |
JP6764421B2 JP6764421B2 (ja) | 2020-09-30 |
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US (1) | US10699924B2 (ja) |
JP (1) | JP6764421B2 (ja) |
KR (1) | KR102311267B1 (ja) |
CN (1) | CN107580542A (ja) |
MY (1) | MY185745A (ja) |
NL (1) | NL2014802B1 (ja) |
SG (1) | SG11201708799XA (ja) |
TW (1) | TWI603426B (ja) |
WO (1) | WO2016182438A1 (ja) |
Cited By (1)
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WO2023210129A1 (ja) * | 2022-04-28 | 2023-11-02 | 東洋製罐グループホールディングス株式会社 | 缶体製造システムおよび缶体製造方法 |
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DE102017109676A1 (de) | 2017-05-05 | 2018-11-08 | Atm Gmbh | Einbettpresse und Verschlusseinrichtung für eine Einbettpresse |
DE102017109677A1 (de) | 2017-05-05 | 2018-11-08 | Atm Gmbh | Einbettpresse, Absaugeinrichtung für eine Einbettpresse und modulares Einbettpressensystem |
NL2021552B1 (en) * | 2018-09-03 | 2020-04-30 | Besi Netherlands Bv | Method and device for selective separating electronic components from a frame with electronic components |
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US4872825A (en) * | 1984-05-23 | 1989-10-10 | Ross Milton I | Method and apparatus for making encapsulated electronic circuit devices |
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Also Published As
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US20180068874A1 (en) | 2018-03-08 |
NL2014802B1 (en) | 2016-12-30 |
TWI603426B (zh) | 2017-10-21 |
CN107580542A (zh) | 2018-01-12 |
KR20180006936A (ko) | 2018-01-19 |
TW201643988A (zh) | 2016-12-16 |
KR102311267B1 (ko) | 2021-10-13 |
JP6764421B2 (ja) | 2020-09-30 |
US10699924B2 (en) | 2020-06-30 |
SG11201708799XA (en) | 2017-11-29 |
MY185745A (en) | 2021-06-03 |
WO2016182438A1 (en) | 2016-11-17 |
NL2014802A (en) | 2016-11-24 |
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