SG11201708799XA - Modular system for moulding electronic components and kit-of-parts for assembling such a modular system - Google Patents

Modular system for moulding electronic components and kit-of-parts for assembling such a modular system

Info

Publication number
SG11201708799XA
SG11201708799XA SG11201708799XA SG11201708799XA SG11201708799XA SG 11201708799X A SG11201708799X A SG 11201708799XA SG 11201708799X A SG11201708799X A SG 11201708799XA SG 11201708799X A SG11201708799X A SG 11201708799XA SG 11201708799X A SG11201708799X A SG 11201708799XA
Authority
SG
Singapore
Prior art keywords
modular system
kit
assembling
parts
electronic components
Prior art date
Application number
SG11201708799XA
Inventor
Johannes Lambertus Gerardus Maria Venrooij
Jeroen Kleijburg
Original Assignee
Besi Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Netherlands Bv filed Critical Besi Netherlands Bv
Publication of SG11201708799XA publication Critical patent/SG11201708799XA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/50—Removing moulded articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0084—General arrangement or lay-out of plants
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B29C2043/182—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated completely
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
SG11201708799XA 2015-05-13 2016-05-10 Modular system for moulding electronic components and kit-of-parts for assembling such a modular system SG11201708799XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL2014802A NL2014802B1 (en) 2015-05-13 2015-05-13 Modular system for moulding electronic components and kit-of-parts for assembling such a modular system.
PCT/NL2016/050332 WO2016182438A1 (en) 2015-05-13 2016-05-10 Modular system for moulding electronic components and kit-of-parts for assembling such a modular system

Publications (1)

Publication Number Publication Date
SG11201708799XA true SG11201708799XA (en) 2017-11-29

Family

ID=53610943

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201708799XA SG11201708799XA (en) 2015-05-13 2016-05-10 Modular system for moulding electronic components and kit-of-parts for assembling such a modular system

Country Status (9)

Country Link
US (1) US10699924B2 (en)
JP (1) JP6764421B2 (en)
KR (1) KR102311267B1 (en)
CN (1) CN107580542A (en)
MY (1) MY185745A (en)
NL (1) NL2014802B1 (en)
SG (1) SG11201708799XA (en)
TW (1) TWI603426B (en)
WO (1) WO2016182438A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017109676A1 (en) 2017-05-05 2018-11-08 Atm Gmbh Embedding press and closing device for an embedding press
DE102017109677A1 (en) * 2017-05-05 2018-11-08 Atm Gmbh Embedding press, suction device for an embedding press and modular embedding press system
NL2021552B1 (en) * 2018-09-03 2020-04-30 Besi Netherlands Bv Method and device for selective separating electronic components from a frame with electronic components
JP2023163407A (en) * 2022-04-28 2023-11-10 東洋製罐グループホールディングス株式会社 Can body production system and method for producing can body

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4872825A (en) * 1984-05-23 1989-10-10 Ross Milton I Method and apparatus for making encapsulated electronic circuit devices
JPH01144636A (en) * 1987-11-17 1989-06-06 Mitsubishi Electric Corp Manufacturing apparatus for semiconductor
JP2932136B2 (en) * 1993-07-22 1999-08-09 トーワ株式会社 Method and apparatus for resin sealing molding of electronic parts
NL9401930A (en) 1994-11-18 1996-07-01 Fico Bv Modular enclosure.
US5813902A (en) * 1997-04-14 1998-09-29 Minnesota Mining And Manufacturing Company Optical fiber end-face preparation and connector assembly
KR100264239B1 (en) * 1998-04-28 2000-09-01 최재준 Lead frame molding system and its molding method
KR20000009145A (en) * 1998-07-16 2000-02-15 곽노권 Automatic moulding apparatus for semiconductor package
US6178361B1 (en) * 1998-11-20 2001-01-23 Karl Suss America, Inc. Automatic modular wafer substrate handling device
US6240398B1 (en) * 1999-01-07 2001-05-29 Lucent Technologies Inc. Product classification process for optical subassemblies
NL1014472C2 (en) * 2000-02-23 2001-08-24 Fico Bv Device, assembly and method for processing electronic components.
KR100357789B1 (en) * 2000-09-20 2002-10-25 마이크로시스텍 주식회사 An auto molding device of lead-frame
US6722033B2 (en) * 2001-10-08 2004-04-20 Newport Corporation Pallet assembly for assembling a fiber optic module that includes a housing
KR100490175B1 (en) * 2002-07-04 2005-05-17 주성엔지니어링(주) Controller module of apparatus for fabricating semiconductor
US20040194803A1 (en) * 2003-04-04 2004-10-07 Asm Technology Singapore Pte Ltd Cleaning of an electronic device
JP4791851B2 (en) * 2006-02-24 2011-10-12 Ｔｏｗａ株式会社 Resin sealing molding equipment for electronic parts
JP2007251094A (en) * 2006-03-20 2007-09-27 Towa Corp Resin sealing molding device of semiconductor chip
JP2008238424A (en) * 2007-03-26 2008-10-09 Sumitomo Heavy Ind Ltd Resin seal device
US8419404B2 (en) * 2010-02-05 2013-04-16 Asm Technology Singapore Pte Ltd Modular molding assembly for electronic devices
JP5970680B2 (en) * 2012-11-19 2016-08-17 アピックヤマダ株式会社 Resin molded product manufacturing method and resin removing device
TW201441734A (en) * 2013-04-19 2014-11-01 Hon Hai Prec Ind Co Ltd Backlight module assembly system and method of assembling backlight module
JP6137679B2 (en) * 2013-05-13 2017-05-31 アピックヤマダ株式会社 Resin molding apparatus and resin molding method
US9343678B2 (en) * 2014-01-21 2016-05-17 Kateeva, Inc. Apparatus and techniques for electronic device encapsulation

Also Published As

Publication number Publication date
JP2018522398A (en) 2018-08-09
KR20180006936A (en) 2018-01-19
MY185745A (en) 2021-06-03
TWI603426B (en) 2017-10-21
NL2014802B1 (en) 2016-12-30
KR102311267B1 (en) 2021-10-13
TW201643988A (en) 2016-12-16
JP6764421B2 (en) 2020-09-30
NL2014802A (en) 2016-11-24
WO2016182438A1 (en) 2016-11-17
CN107580542A (en) 2018-01-12
US10699924B2 (en) 2020-06-30
US20180068874A1 (en) 2018-03-08

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