JP2008238424A - Resin seal device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the occurrence of partial thermal expansion difference by leveling the partial deviation of heat produced in a movable platen to prevent the distortion of the movable platen. <P>SOLUTION: In this resin seal device 100 equipped with a main body 130, the up and down reciprocally movable platen 140 enclosed in the main body 130 and a resin seal unit 101 having a heater 115 for heating a resin, a plurality of the resin seal units 101 are adjacently arranged and provided with a hollow part 140A so as to extend from the bottom surface side of the movable platen 140 to the upper surface side thereof with a ball screw 150 for reciprocating movement arranged in the hollow part 140A and an air jet port 142 provided for circulating the air in the hollow part 140A. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a technical field of a compression type resin sealing apparatus that compresses and seals a substrate on which a semiconductor chip or the like is mounted with resin.

  Conventionally, a compression type resin sealing device described in Patent Document 1 is known. FIG. 4 shows a schematic configuration of the resin sealing device 1 described in Patent Document 1. The resin sealing device 1 includes a top plate 10 supported by four tie bars (columns) 20, and a movable plate that is disposed to face the top plate 10 and can move back and forth (reciprocate) with respect to the top plate 10. A platen 40 is provided. The movable platen 40 is included in the main body 30. An upper mold (not shown) with a built-in heater is suspended from the top plate 10, and a lower mold (not shown) with a built-in heater is placed on the movable platen 40. The four tie bars 20 are erected and fixed to the main body 30. A press mechanism is disposed in the main body 30 so that the movable platen 40 can be moved up and down (in the direction of the top plate 10). As a result, the upper die and the lower die are brought close to each other and the substrate on which the semiconductor chip or the like is mounted is clamped, and then compression sealing is performed with the resin.

JP 2002-103402 A

  The lower mold placed on the movable platen 40 is provided with a heater for melting and further thermosetting the resin. The heat of the heater gradually propagates to the movable platen 40 side and heats the movable platen 40. A press mechanism (pressurizing mechanism) disposed in the main body 30 is connected to the movable platen 40 in order to move the movable platen 40 forward and backward. As a result, the press mechanism itself generates heat due to repeated movements of the press mechanism, and the heat may propagate to the movable platen 40 side via the connecting portion with the movable platen 40. In this way, heat from the outside of the movable platen 40 is inevitably generated. Even if it is devised to prevent the propagation of heat, it cannot be completely prevented.

  Moreover, there exists a problem that the precision of resin sealing deteriorates by propagation (inflow) of this heat. Since the inflow of heat is concentrated at a portion close to the lower die to be placed or a connection portion with the press mechanism, the movable platen 40 is partially heated. As a result, a difference in the thermal expansion of the movable platen 40 occurs. , Distortion occurs. As a result, it becomes impossible to support the lower die to be placed horizontally (horizontally with respect to the upper die), and the upper die and the lower die are accurately brought into contact with each other to accurately place the substrate on which the semiconductor chip is mounted. It becomes impossible to clamp. Specifically, problems such as resin leakage or the inability to apply an appropriate pressure to the resin occur.

  In order to improve productivity in recent years, a resin sealing unit (a resin sealing unit including a main body, a movable platen included in the main body and capable of reciprocating up and down, and a heater for heating the resin has been developed. ) Are arranged adjacent to each other as a result. That is, it is considered that the heat is inevitably generated in the adjacent portion, and the partial thermal expansion difference of the movable platen due to the heat is promoted.

  The present invention has been made to solve such a problem, and by leveling the partial thermal deviation generated in the movable platen, it is possible to prevent the occurrence of a partial thermal expansion difference and to reduce the distortion of the movable platen. The challenge is to prevent it.

  The present invention is a resin sealing device comprising a resin sealing unit having a main body, a movable platen contained in the main body and capable of reciprocating up and down, and a heater for heating the resin. A plurality of stop units are arranged adjacent to each other, and extend from the bottom surface side to the top surface side of the movable platen to provide a hollow portion, and the press mechanism for the reciprocating motion is disposed in the hollow portion, and in the hollow portion The above-described problem is solved by providing a circulation mechanism for circulating air. By adopting such a configuration, it is possible to level the partial thermal deviation generated in the movable platen and eliminate the partial thermal expansion difference of the movable platen. In other words, the entire movable platen is thermally expanded evenly, and as a result, the movable platen is prevented from being distorted and the level of the lower mold to be placed is maintained.

  If the circulation mechanism is realized by the ejection of air into the hollow portion, the movable platen can be positively cooled along with the circulation of the air in the movable platen by the ejection of air.

  In addition, if the press mechanism is constituted by a ball screw, the circulation mechanism can also serve as cooling of the ball screw, and a ball screw whose temperature is severely limited at the time of use can be used appropriately. Can be improved.

  Moreover, it is good also as a structure which provides an opening in the adjacent surface of the said main body in the resin sealing unit arrange | positioned adjacently, and the air circulation also occurs between the said resin sealing units by the said circulation mechanism. If comprised in this way, it will become possible to achieve the heat | fever leveling as the whole some resin sealing unit.

  By applying the present invention, partial thermal expansion generated in the movable platen due to heat is eliminated, and the lower mold can be supported horizontally, so that the resin sealing accuracy can be maintained.

  Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a schematic front view (partially sectional view) of a resin sealing device 100 as an example of an embodiment of the present invention. FIG. 2 is a schematic side view of the resin sealing device 100.

  The resin sealing device 100 is configured to include a resin sealing unit 101 disposed on a base plate 170 and a pressing motor 160 for driving the resin sealing unit 101.

  The resin sealing unit 101 includes a main body 130 placed on a base plate 170, four tie bars (columns) 120 standing on the main body 130 (only two appear in FIG. 1), and the tie bars. Mainly composed of a top plate 110 supported by 120 and a movable platen 140 which is contained in the main body 130 and can be moved back and forth (reciprocated) toward the top plate 110 side. The top plate 110 and the tie bar 120 are connected and fixed by a tie bar fixing nut 111. An upper mold 112 is suspended from the top plate 110. On the other hand, a lower mold 114 is placed on the movable platen 140. The upper mold 112 and the lower mold 114 are provided with heaters 113 and 115 for melting and thermosetting the resin. The main body 130 and the movable platen 140 are slidably supported by a slide guide 116, and can be slid up and down by a press mechanism (described later).

  Further, the substantially rectangular movable platen 140 is provided with a hollow portion 140A so as to extend from the bottom surface side to the top surface side, and a ball screw 150 as a press mechanism is disposed in the hollow portion 140A. Has been. The ball screw 150 is connected to a shaft 151, and the shaft 151 is rotatably supported from the base plate 170 by a thrust bearing 118. In addition, the hollow portion 140 </ b> A of the movable platen 140 is provided with a spout (circulation mechanism) 142 so that air can be spouted from the spout 142.

  On the other hand, the press motor 160 is fixed to the base plate 170 in a state where the reduction gear 162 is connected. The output shaft 163 of the reduction gear 162 is provided with a pulley 164, and a timing belt 165 is connected to the pulley 164. Further, the above-described shaft 151 is also provided with a pulley 166, and similarly, a timing belt 165 is connected thereto. As a result, the rotation of the press motor 160 can be transmitted to the ball screw 150 via the timing belt 165 and the shaft 151 after being decelerated by the speed reducer 162.

  Further, as shown in FIG. 2, two resin sealing units 101 having a movable platen 140 and a ball screw (press mechanism: not shown in FIG. 2) enclosed in the main body 130 of the resin sealing device 100 are adjacent to each other. It is set as the arrangement. In the present embodiment, the base plates 170 of the respective resin sealing units 101 are connected and fixed by the connecting pins 180.

  In the resin sealing device 100, when the upper mold 112 and the lower mold 114 are brought into contact with and separated from each other at a predetermined timing, the operation of clamping the substrate on which the semiconductor chip is mounted and sealing with the resin is repeatedly performed. . At this time, the rotation of the press motor 160 is transmitted to the ball screw 150 via the speed reducer 162, the timing belt 165, and the shaft 151, and the action of the ball screw 150 causes the movable platen 140 to move to the top plate 110 side. The upper mold 112 and the lower mold 114 are brought into contact with and separated from each other by moving forward and backward. In addition, the heaters 113 and 115 provided in the molds 112 and 114 heat the molds 112 and 114 at a predetermined timing. Heat generated by the heater 115 built in the lower mold 114 is transmitted not only to the lower mold 114 but also to the movable platen 140 on which the lower mold 114 is placed. As a result, the upper surface of the movable platen 140 (the portion where the lower mold 114 is placed) becomes relatively hot compared to other portions. On the other hand, the ball screw 150 itself generates heat due to repeated press operations, and the heat propagates to the movable platen 140 via the connecting portion P between the ball screw 150 and the movable platen 140. Again, the connecting portion P of the movable platen 140 becomes relatively hot compared to other portions. As a result, the movable platen 140 is partially biased in heat and may be distorted due to a difference in thermal expansion.

  However, in the present embodiment, room-temperature air is ejected from the air outlet 142 into the hollow portion 140A of the movable platen 140 at a predetermined timing, and the air in the hollow portion 140A of the movable platen 140 is forcedly circulated. Therefore, this partial heat bias is leveled. As a result, the difference in partial thermal expansion due to the heat of the movable platen 140 can be eliminated. That is, the thermal expansion itself that occurs in the movable platen 140 is not prevented, but the entire movable platen 140 is uniformly thermally expanded to prevent the movable platen 140 from being distorted, and the lower mold 114 is placed. Can be kept level.

  Although not shown in the present embodiment, a configuration in which, for example, a “pleat shape” protrusion is provided on the surface of the hollow portion 140A as needed to more actively promote heat circulation may be employed. The number of air jets 142 is two in this embodiment, but may be one or three or more depending on the type of resin sealing device, the installation environment, and the like. Further, the flow direction of air may be adjusted to positively form an air flow such as a tornado in the hollow portion 140A. Furthermore, it is possible to adopt a configuration in which the direction of the jet nozzle 142 changes at a predetermined timing.

  Further, in the present embodiment, the air ejected from the ejection port 142 is air at normal temperature. As a result, the portion where the air ejected from the ejection port 142 first contacts is not excessively cooled, and partial distortion of the movable platen 140 due to excessive cooling can be prevented. . Of course, the temperature of the air does not have to be room temperature, and partial overcooling may be more actively prevented by using air heated to a room temperature, for example.

  Further, in the present embodiment, a ball screw 150 is employed as a press mechanism. In general, a ball screw has a temperature limit in use, and it is disadvantageous in terms of accuracy and life when used in a situation where the temperature limit is exceeded. However, the ball screw 150 can be positively cooled by the air ejected from the ejection port 142. That is, the circulation mechanism can also function as a cooling mechanism for the press mechanism. As a result, it is possible to use the ball screw 150 within the temperature limit, and it is possible to improve the accuracy and life of the press mechanism. Further, since it is not necessary to cool the ball screw itself by providing a through-hole through which a cooling medium passes, the configuration of the ball screw itself can be simplified.

  Further, when four resin sealing units 101 are arranged adjacent to each other as shown in FIG. 3, the resin sealing unit 101 disposed at both ends and the resin sealing unit 101 disposed inside are movable platens. Differences may also occur in the heat bias generated at 140. In such a case, it is possible to level the thermal expansion of the movable platen 140 in each resin sealing unit 101 by adjusting the temperature and amount of air ejected into the hollow portion 140A of each movable platen 140. ing. Further, an opening is provided in the adjacent surface of the main body 130 in the resin sealing unit 101 arranged adjacently (not shown in FIG. 3), so that air circulates between the resin sealing units 101 by the circulation mechanism. If comprised, air can move through the said opening. As a result, it is possible to achieve heat leveling as a whole between the resin sealing units 101. Moreover, depending on the case, it is not necessary to provide the spout 142 as a circulation mechanism in all the resin sealing units 101, and cost reduction can be implement | achieved.

  In addition, the number of adjacent arrangements of the resin sealing units 101 is not limited to the two-arrangement and the four-arrangement described above, and may be three-arrangement or five or more. Further, it is not an essential component that the resin sealing units 101 are connected by the connecting pins 180. As long as a plurality of units are arranged adjacent to each other so as to promote partial heat deviation of the movable platen, mechanical connection is unnecessary.

  The present invention is suitable as a resin sealing device that compresses and seals a substrate on which a semiconductor chip is mounted with resin.

Schematic front view (partially sectional view) of a resin sealing device 100 as an example of an embodiment of the present invention Schematic side view of the resin sealing device 100 Schematic side view of a resin sealing device 200 in which four rows of resin sealing units are arranged Schematic configuration diagram of resin sealing device described in Patent Document 1

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Resin sealing device 101 ... Resin sealing unit 110 ... Top plate 111 ... Tie bar fixing nut 112 ... Upper mold 113, 115 ... Heater 114 ... Lower mold 116 ... Slide guide 118 ... Thrust bearing 120 ... Tie bar 130 ... Main body 140 ... Movable platen 140A ... hollow part 142 ... spout 150 ... ball screw 160 ... press motor 162 ... reduction gear 164 ... timing belt 166 ... pulley 170 ... base plate 180 ... connecting pin 190 ... lower die drive mechanism

Claims (4)

A resin sealing device comprising a main body, a movable platen contained in the main body and capable of reciprocating up and down, and a resin sealing unit having a heater for heating the resin,
A plurality of the resin sealing units are arranged adjacent to each other,
A hollow portion is provided extending from the bottom surface side to the top surface side of the movable platen, and the press mechanism for the reciprocating motion is disposed in the hollow portion,
A resin sealing device comprising a circulation mechanism for circulating the air in the hollow portion. In claim 1,
The said sealing mechanism is implement | achieved by the ejection of the air with respect to the said hollow part. Resin sealing device characterized by the above-mentioned. In claim 1 or 2,
The resin sealing device, wherein the press mechanism is a ball screw. In claims 1 to 3,
An opening is provided on the adjacent surface of the main body in the resin sealing unit arranged adjacently,
The resin sealing device, wherein the circulation mechanism causes air to circulate between the resin sealing units.

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