JP6759279B2 - 減圧乾燥装置および減圧乾燥方法 - Google Patents

減圧乾燥装置および減圧乾燥方法 Download PDF

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Publication number
JP6759279B2
JP6759279B2 JP2018104841A JP2018104841A JP6759279B2 JP 6759279 B2 JP6759279 B2 JP 6759279B2 JP 2018104841 A JP2018104841 A JP 2018104841A JP 2018104841 A JP2018104841 A JP 2018104841A JP 6759279 B2 JP6759279 B2 JP 6759279B2
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Prior art keywords
vacuum drying
substrate
exhaust port
drying device
accommodation space
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JP2018104841A
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English (en)
Japanese (ja)
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JP2019211109A (ja
Inventor
富藤　幸雄
幸雄 富藤
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Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2018104841A priority Critical patent/JP6759279B2/ja
Priority to TW108116955A priority patent/TWI742374B/zh
Priority to KR1020190062136A priority patent/KR102396229B1/ko
Priority to CN201910467958.4A priority patent/CN110548658B/zh
Publication of JP2019211109A publication Critical patent/JP2019211109A/ja
Application granted granted Critical
Publication of JP6759279B2 publication Critical patent/JP6759279B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0406—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Drying Of Solid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
  • Liquid Crystal (AREA)
  • Health & Medical Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molecular Biology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2018104841A 2018-05-31 2018-05-31 減圧乾燥装置および減圧乾燥方法 Active JP6759279B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018104841A JP6759279B2 (ja) 2018-05-31 2018-05-31 減圧乾燥装置および減圧乾燥方法
TW108116955A TWI742374B (zh) 2018-05-31 2019-05-16 減壓乾燥裝置及減壓乾燥方法
KR1020190062136A KR102396229B1 (ko) 2018-05-31 2019-05-27 감압 건조 장치 및 감압 건조 방법
CN201910467958.4A CN110548658B (zh) 2018-05-31 2019-05-31 减压干燥装置及减压干燥方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018104841A JP6759279B2 (ja) 2018-05-31 2018-05-31 減圧乾燥装置および減圧乾燥方法

Publications (2)

Publication Number Publication Date
JP2019211109A JP2019211109A (ja) 2019-12-12
JP6759279B2 true JP6759279B2 (ja) 2020-09-23

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JP2018104841A Active JP6759279B2 (ja) 2018-05-31 2018-05-31 減圧乾燥装置および減圧乾燥方法

Country Status (4)

Country Link
JP (1) JP6759279B2 (ko)
KR (1) KR102396229B1 (ko)
CN (1) CN110548658B (ko)
TW (1) TWI742374B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7511181B2 (ja) 2020-08-26 2024-07-05 パナソニックＩｐマネジメント株式会社 減圧乾燥装置および減圧乾燥方法
JP7309294B2 (ja) * 2020-11-30 2023-07-18 株式会社Ｓｃｒｅｅｎホールディングス 減圧乾燥装置
JP7555804B2 (ja) 2020-11-30 2024-09-25 株式会社Ｓｃｒｅｅｎホールディングス 減圧乾燥装置および減圧乾燥方法
JP7381526B2 (ja) * 2021-08-20 2023-11-15 株式会社Ｓｃｒｅｅｎホールディングス 減圧乾燥装置、減圧乾燥方法およびプログラム
CN115468389B (zh) * 2022-09-16 2023-08-01 江苏美客鼎嵘智能装备制造有限公司 显示器玻璃基板烘烤设备

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3631847B2 (ja) 1996-05-28 2005-03-23 大日本印刷株式会社 真空乾燥装置
JP4267809B2 (ja) * 1999-11-16 2009-05-27 東京エレクトロン株式会社 基板の処理装置及び処理方法
JP2002372368A (ja) * 2001-06-14 2002-12-26 Dainippon Printing Co Ltd 減圧乾燥装置
JP3920699B2 (ja) * 2001-09-19 2007-05-30 東京エレクトロン株式会社 減圧乾燥装置及び塗布膜形成方法
JP3784305B2 (ja) * 2001-11-20 2006-06-07 東京エレクトロン株式会社 減圧乾燥装置及び減圧乾燥方法
JP4331443B2 (ja) * 2002-07-09 2009-09-16 平田機工株式会社 基板処理装置
JP4244176B2 (ja) * 2002-10-25 2009-03-25 大日本スクリーン製造株式会社 基板処理装置
TWI231950B (en) * 2002-11-28 2005-05-01 Tokyo Electron Ltd Substrate processing apparatus and cleaning method
KR20050050818A (ko) * 2003-11-26 2005-06-01 삼성에스디아이 주식회사 스핀 코팅 방법 및 그에 적합한 장치
JP4312787B2 (ja) * 2006-11-15 2009-08-12 東京エレクトロン株式会社 減圧乾燥装置
KR101558596B1 (ko) * 2008-09-25 2015-10-07 도쿄엘렉트론가부시키가이샤 감압 건조 장치 및 감압 건조 방법
JP2011119534A (ja) * 2009-12-04 2011-06-16 Renesas Electronics Corp 熱処理装置及び熱処理方法
CN201815456U (zh) * 2010-10-09 2011-05-04 京东方科技集团股份有限公司 减压干燥室结构
JP5951444B2 (ja) * 2012-10-25 2016-07-13 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP6093172B2 (ja) * 2012-12-26 2017-03-08 株式会社Ｓｃｒｅｅｎホールディングス 減圧乾燥装置および減圧乾燥方法
JP6328434B2 (ja) * 2013-03-14 2018-05-23 東京エレクトロン株式会社 乾燥装置及び乾燥処理方法
JP6391362B2 (ja) * 2014-08-25 2018-09-19 株式会社Ｓｃｒｅｅｎホールディングス 減圧乾燥装置、基板処理装置および減圧乾燥方法
JP6740028B2 (ja) * 2015-07-29 2020-08-12 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
JP6872328B2 (ja) * 2016-09-06 2021-05-19 株式会社Ｓｃｒｅｅｎホールディングス 減圧乾燥装置、減圧乾燥システム、減圧乾燥方法
CN107042244A (zh) * 2017-05-27 2017-08-15 宁波奇尘电子科技有限公司 一种反向多角度吹扫干燥装置

Also Published As

Publication number Publication date
JP2019211109A (ja) 2019-12-12
KR20190136957A (ko) 2019-12-10
TWI742374B (zh) 2021-10-11
TW202004847A (zh) 2020-01-16
CN110548658B (zh) 2022-09-27
KR102396229B1 (ko) 2022-05-09
CN110548658A (zh) 2019-12-10

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