JP6753390B2 - ワイヤソー装置およびウェーハの製造方法 - Google Patents
ワイヤソー装置およびウェーハの製造方法 Download PDFInfo
- Publication number
- JP6753390B2 JP6753390B2 JP2017247854A JP2017247854A JP6753390B2 JP 6753390 B2 JP6753390 B2 JP 6753390B2 JP 2017247854 A JP2017247854 A JP 2017247854A JP 2017247854 A JP2017247854 A JP 2017247854A JP 6753390 B2 JP6753390 B2 JP 6753390B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- work
- cutting
- warp
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 238000005520 cutting process Methods 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 12
- 239000002002 slurry Substances 0.000 claims description 11
- 239000002826 coolant Substances 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 29
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 102100032912 CD44 antigen Human genes 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 108010069264 keratinocyte CD44 Proteins 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
5…ビーム、 6…ワークプレート、 7…ワーク保持部、 8…ノズル
9…スラリ、 10…ワーク送り機構、 11…平行度調整機構、
12…前面ブロック、 13…外輪リング、 14…内輪リング
15…調整ボルト、 W…ワーク。
Claims (3)
- 複数のワイヤガイドと、前記複数のワイヤガイドに巻回され軸方向に往復走行するワイヤによって形成されたワイヤ列と、前記ワイヤにクーラント又はスラリを供給するノズルと、ビームを介してワークが接着されたワークプレートを吊り下げ保持するワーク保持部と、前記ワークを前記ワイヤ列に押圧するワーク送り機構を具備するワイヤソー装置であって、
前記ワイヤ列を形成する前記複数のワイヤガイドの軸の平行度を調整する調整ボルトを含む機構を具備し、切断後のワークのワイヤ走行方向のワープを制御可能なものであることを特徴とするワイヤソー装置。 - 請求項1に記載のワイヤソー装置を用いて、前記ワイヤ列を形成する前記複数のワイヤガイドの軸の平行度を調整して、ワークを切断することで、切断後のワークのワイヤ走行方向のワープを制御することを特徴とするウェーハの製造方法。
- 複数のワイヤガイドに巻回された軸方向に往復走行するワイヤによってワイヤ列を形成し、前記ワイヤにクーラント又はスラリをノズルから供給しつつ、ワーク送り機構によりワーク保持部に保持されたワークを前記ワイヤ列に押圧することで、前記ワークを切断してウェーハを製造する方法であって、
前記ワイヤ列を形成する前記複数のワイヤガイドの軸の平行度を調整して、前記ワークを切断することで、切断後のワークのワイヤ走行方向のワープを制御することを特徴とするウェーハの製造方法。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017247854A JP6753390B2 (ja) | 2017-12-25 | 2017-12-25 | ワイヤソー装置およびウェーハの製造方法 |
SG11202005230TA SG11202005230TA (en) | 2017-12-25 | 2018-11-01 | Wire saw apparatus and method for manufacturing wafer |
US16/957,787 US11584037B2 (en) | 2017-12-25 | 2018-11-01 | Wire saw apparatus and method for manufacturing wafer |
CN201880077941.1A CN111418045B (zh) | 2017-12-25 | 2018-11-01 | 线锯装置及晶圆的制造方法 |
PCT/JP2018/040633 WO2019130806A1 (ja) | 2017-12-25 | 2018-11-01 | ワイヤソー装置およびウェーハの製造方法 |
KR1020207018338A KR102560447B1 (ko) | 2017-12-25 | 2018-11-01 | 와이어소 장치 및 웨이퍼의 제조방법 |
DE112018006043.8T DE112018006043T5 (de) | 2017-12-25 | 2018-11-01 | Drahtsägevorrichtung und Verfahren zur Herstellung von Wafern |
TW107139749A TWI812652B (zh) | 2017-12-25 | 2018-11-09 | 線鋸裝置及晶圓的製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017247854A JP6753390B2 (ja) | 2017-12-25 | 2017-12-25 | ワイヤソー装置およびウェーハの製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2019114690A JP2019114690A (ja) | 2019-07-11 |
JP2019114690A5 JP2019114690A5 (ja) | 2020-07-16 |
JP6753390B2 true JP6753390B2 (ja) | 2020-09-09 |
Family
ID=67066994
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017247854A Active JP6753390B2 (ja) | 2017-12-25 | 2017-12-25 | ワイヤソー装置およびウェーハの製造方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US11584037B2 (ja) |
JP (1) | JP6753390B2 (ja) |
KR (1) | KR102560447B1 (ja) |
CN (1) | CN111418045B (ja) |
DE (1) | DE112018006043T5 (ja) |
SG (1) | SG11202005230TA (ja) |
TW (1) | TWI812652B (ja) |
WO (1) | WO2019130806A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018221922A1 (de) * | 2018-12-17 | 2020-06-18 | Siltronic Ag | Verfahren zur Herstellung von Halbleiterscheiben mittels einer Drahtsäge, Drahtsäge und Halbleiterscheibe aus einkristallinem Silizium |
EP4029670A1 (en) | 2021-01-15 | 2022-07-20 | Lapmaster Wolters GmbH | Device and method for cutting a solid substrate |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2967896B2 (ja) | 1993-06-18 | 1999-10-25 | 信越化学工業株式会社 | ウエーハの製造方法 |
JPH09192940A (ja) | 1996-01-22 | 1997-07-29 | Koganei Corp | ワーク搬送装置 |
JP2000108012A (ja) | 1998-10-02 | 2000-04-18 | Ebara Corp | ワイヤソー |
DE10122628B4 (de) * | 2001-05-10 | 2007-10-11 | Siltronic Ag | Verfahren zum Abtrennen von Scheiben von einem Werkstück |
JP4816511B2 (ja) * | 2007-03-06 | 2011-11-16 | 信越半導体株式会社 | 切断方法およびワイヤソー装置 |
JP2009029078A (ja) | 2007-07-30 | 2009-02-12 | Toyo Advanced Technologies Co Ltd | ワイヤーソー装置 |
JP2010110866A (ja) | 2008-11-07 | 2010-05-20 | Kanai Hiroaki | ワイヤーソーマシン |
US20130144421A1 (en) | 2011-12-01 | 2013-06-06 | Memc Electronic Materials, Spa | Systems For Controlling Temperature Of Bearings In A Wire Saw |
KR20140100549A (ko) | 2011-12-01 | 2014-08-14 | 엠이엠씨 일렉트로닉 머티리얼스 쏘시에떼 퍼 아찌오니 | 와이어 소우에서 슬라이싱된 웨이퍼들의 표면 프로파일들을 제어하기 위한 시스템들 및 방법들 |
US20130144420A1 (en) | 2011-12-01 | 2013-06-06 | Memc Electronic Materials, Spa | Systems For Controlling Surface Profiles Of Wafers Sliced In A Wire Saw |
US20130139801A1 (en) | 2011-12-01 | 2013-06-06 | Memc Electronic Materials, Spa | Methods For Controlling Displacement Of Bearings In A Wire Saw |
US20130139800A1 (en) | 2011-12-02 | 2013-06-06 | Memc Electronic Materials, Spa | Methods For Controlling Surface Profiles Of Wafers Sliced In A Wire Saw |
JP2014133272A (ja) | 2013-01-09 | 2014-07-24 | Komatsu Ntc Ltd | 加工用ワイヤ工具ホルダ |
KR20150099656A (ko) | 2014-02-21 | 2015-09-01 | 웅진에너지 주식회사 | 와이어 쏘 장치용 가이드 롤러 평행도 조정장치 |
JP2016135529A (ja) | 2015-01-23 | 2016-07-28 | 信越半導体株式会社 | ワークの切断方法 |
DE102018221922A1 (de) * | 2018-12-17 | 2020-06-18 | Siltronic Ag | Verfahren zur Herstellung von Halbleiterscheiben mittels einer Drahtsäge, Drahtsäge und Halbleiterscheibe aus einkristallinem Silizium |
TWI786740B (zh) * | 2020-07-27 | 2022-12-11 | 環球晶圓股份有限公司 | 晶碇切割裝置及晶碇切割方法 |
-
2017
- 2017-12-25 JP JP2017247854A patent/JP6753390B2/ja active Active
-
2018
- 2018-11-01 WO PCT/JP2018/040633 patent/WO2019130806A1/ja active Application Filing
- 2018-11-01 KR KR1020207018338A patent/KR102560447B1/ko active IP Right Grant
- 2018-11-01 DE DE112018006043.8T patent/DE112018006043T5/de active Pending
- 2018-11-01 SG SG11202005230TA patent/SG11202005230TA/en unknown
- 2018-11-01 US US16/957,787 patent/US11584037B2/en active Active
- 2018-11-01 CN CN201880077941.1A patent/CN111418045B/zh active Active
- 2018-11-09 TW TW107139749A patent/TWI812652B/zh active
Also Published As
Publication number | Publication date |
---|---|
US11584037B2 (en) | 2023-02-21 |
DE112018006043T5 (de) | 2020-11-12 |
US20210362373A1 (en) | 2021-11-25 |
WO2019130806A1 (ja) | 2019-07-04 |
TWI812652B (zh) | 2023-08-21 |
TW201927472A (zh) | 2019-07-16 |
KR20200100085A (ko) | 2020-08-25 |
CN111418045B (zh) | 2023-08-15 |
JP2019114690A (ja) | 2019-07-11 |
SG11202005230TA (en) | 2020-07-29 |
KR102560447B1 (ko) | 2023-07-27 |
CN111418045A (zh) | 2020-07-14 |
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