SG11202005230TA - Wire saw apparatus and method for manufacturing wafer - Google Patents
Wire saw apparatus and method for manufacturing waferInfo
- Publication number
- SG11202005230TA SG11202005230TA SG11202005230TA SG11202005230TA SG11202005230TA SG 11202005230T A SG11202005230T A SG 11202005230TA SG 11202005230T A SG11202005230T A SG 11202005230TA SG 11202005230T A SG11202005230T A SG 11202005230TA SG 11202005230T A SG11202005230T A SG 11202005230TA
- Authority
- SG
- Singapore
- Prior art keywords
- wire saw
- saw apparatus
- manufacturing wafer
- wafer
- manufacturing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017247854A JP6753390B2 (en) | 2017-12-25 | 2017-12-25 | Wire saw equipment and wafer manufacturing method |
PCT/JP2018/040633 WO2019130806A1 (en) | 2017-12-25 | 2018-11-01 | Wire saw device and wafer manufacturing method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202005230TA true SG11202005230TA (en) | 2020-07-29 |
Family
ID=67066994
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202005230TA SG11202005230TA (en) | 2017-12-25 | 2018-11-01 | Wire saw apparatus and method for manufacturing wafer |
Country Status (8)
Country | Link |
---|---|
US (1) | US11584037B2 (en) |
JP (1) | JP6753390B2 (en) |
KR (1) | KR102560447B1 (en) |
CN (1) | CN111418045B (en) |
DE (1) | DE112018006043T5 (en) |
SG (1) | SG11202005230TA (en) |
TW (1) | TWI812652B (en) |
WO (1) | WO2019130806A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018221922A1 (en) * | 2018-12-17 | 2020-06-18 | Siltronic Ag | Method for producing semiconductor wafers using a wire saw, wire saw and semiconductor wafer made of single-crystal silicon |
EP4029670A1 (en) | 2021-01-15 | 2022-07-20 | Lapmaster Wolters GmbH | Device and method for cutting a solid substrate |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2967896B2 (en) | 1993-06-18 | 1999-10-25 | 信越化学工業株式会社 | Wafer manufacturing method |
JPH09192940A (en) | 1996-01-22 | 1997-07-29 | Koganei Corp | Workpiece conveying device |
JP2000108012A (en) | 1998-10-02 | 2000-04-18 | Ebara Corp | Wire saw |
DE10122628B4 (en) * | 2001-05-10 | 2007-10-11 | Siltronic Ag | Method for separating slices from a workpiece |
JP4816511B2 (en) * | 2007-03-06 | 2011-11-16 | 信越半導体株式会社 | Cutting method and wire saw device |
JP2009029078A (en) | 2007-07-30 | 2009-02-12 | Toyo Advanced Technologies Co Ltd | Wire saw device |
JP2010110866A (en) | 2008-11-07 | 2010-05-20 | Kanai Hiroaki | Wire saw machine |
US20130139801A1 (en) | 2011-12-01 | 2013-06-06 | Memc Electronic Materials, Spa | Methods For Controlling Displacement Of Bearings In A Wire Saw |
US20130139800A1 (en) | 2011-12-02 | 2013-06-06 | Memc Electronic Materials, Spa | Methods For Controlling Surface Profiles Of Wafers Sliced In A Wire Saw |
US20130144421A1 (en) | 2011-12-01 | 2013-06-06 | Memc Electronic Materials, Spa | Systems For Controlling Temperature Of Bearings In A Wire Saw |
US20130144420A1 (en) | 2011-12-01 | 2013-06-06 | Memc Electronic Materials, Spa | Systems For Controlling Surface Profiles Of Wafers Sliced In A Wire Saw |
TWI567812B (en) | 2011-12-01 | 2017-01-21 | Memc電子材料公司 | Systems and methods for controlling surface profiles of wafers sliced in a wire saw |
JP2014133272A (en) | 2013-01-09 | 2014-07-24 | Komatsu Ntc Ltd | Machining wire tool holder |
KR20150099656A (en) | 2014-02-21 | 2015-09-01 | 웅진에너지 주식회사 | A adjusting apparatus for guide roller |
JP2016135529A (en) | 2015-01-23 | 2016-07-28 | 信越半導体株式会社 | Method for cutting work-piece |
DE102018221922A1 (en) * | 2018-12-17 | 2020-06-18 | Siltronic Ag | Method for producing semiconductor wafers using a wire saw, wire saw and semiconductor wafer made of single-crystal silicon |
WO2021013238A1 (en) * | 2019-07-24 | 2021-01-28 | 徐州鑫晶半导体科技有限公司 | Method for cutting silicon rod and diamond multi-wire cutting device |
TWI786740B (en) * | 2020-07-27 | 2022-12-11 | 環球晶圓股份有限公司 | Crystal ingot cutting device and crystal ingot cutting method |
-
2017
- 2017-12-25 JP JP2017247854A patent/JP6753390B2/en active Active
-
2018
- 2018-11-01 WO PCT/JP2018/040633 patent/WO2019130806A1/en active Application Filing
- 2018-11-01 KR KR1020207018338A patent/KR102560447B1/en active IP Right Grant
- 2018-11-01 DE DE112018006043.8T patent/DE112018006043T5/en active Pending
- 2018-11-01 CN CN201880077941.1A patent/CN111418045B/en active Active
- 2018-11-01 US US16/957,787 patent/US11584037B2/en active Active
- 2018-11-01 SG SG11202005230TA patent/SG11202005230TA/en unknown
- 2018-11-09 TW TW107139749A patent/TWI812652B/en active
Also Published As
Publication number | Publication date |
---|---|
KR102560447B1 (en) | 2023-07-27 |
US20210362373A1 (en) | 2021-11-25 |
TW201927472A (en) | 2019-07-16 |
US11584037B2 (en) | 2023-02-21 |
TWI812652B (en) | 2023-08-21 |
JP2019114690A (en) | 2019-07-11 |
DE112018006043T5 (en) | 2020-11-12 |
CN111418045B (en) | 2023-08-15 |
WO2019130806A1 (en) | 2019-07-04 |
JP6753390B2 (en) | 2020-09-09 |
KR20200100085A (en) | 2020-08-25 |
CN111418045A (en) | 2020-07-14 |
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