JP6742796B2 - 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 - Google Patents
硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 Download PDFInfo
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- JP6742796B2 JP6742796B2 JP2016090155A JP2016090155A JP6742796B2 JP 6742796 B2 JP6742796 B2 JP 6742796B2 JP 2016090155 A JP2016090155 A JP 2016090155A JP 2016090155 A JP2016090155 A JP 2016090155A JP 6742796 B2 JP6742796 B2 JP 6742796B2
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- JP
- Japan
- Prior art keywords
- resin composition
- curable resin
- resin
- carboxyl group
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Materials For Photolithography (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105116454A TWI704174B (zh) | 2015-07-21 | 2016-05-26 | 硬化性樹脂組成物、乾膜、硬化物以及印刷配線板 |
KR1020160090494A KR102588995B1 (ko) | 2015-07-21 | 2016-07-18 | 경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판 |
CN201610576040.XA CN106200266B (zh) | 2015-07-21 | 2016-07-21 | 固化性树脂组合物、干膜、固化物及印刷电路板 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015144277 | 2015-07-21 | ||
JP2015144277 | 2015-07-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017025290A JP2017025290A (ja) | 2017-02-02 |
JP6742796B2 true JP6742796B2 (ja) | 2020-08-19 |
Family
ID=57945460
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016090155A Active JP6742796B2 (ja) | 2015-07-21 | 2016-04-28 | 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6742796B2 (ko) |
KR (1) | KR102588995B1 (ko) |
TW (1) | TWI704174B (ko) |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002338787A (ja) * | 2001-05-15 | 2002-11-27 | Kawamura Inst Of Chem Res | エポキシ樹脂組成物及びその硬化物 |
JP2004277458A (ja) * | 2003-03-12 | 2004-10-07 | Nagase Chemtex Corp | 1液型エポキシ樹脂組成物およびそれを用いた1液型エポキシ樹脂系接着剤 |
JP4449402B2 (ja) | 2003-08-25 | 2010-04-14 | 日立化成工業株式会社 | 永久レジスト用感光性樹脂組成物、永久レジスト用感光性フィルム、レジストパターンの形成方法及びプリント配線板 |
JP2008039926A (ja) * | 2006-08-02 | 2008-02-21 | Toyo Ink Mfg Co Ltd | 感光性熱硬化性樹脂組成物 |
JP5588646B2 (ja) | 2009-09-15 | 2014-09-10 | 太陽ホールディングス株式会社 | 熱硬化性樹脂組成物及びドライフィルム |
WO2012105558A1 (ja) * | 2011-02-01 | 2012-08-09 | Dic株式会社 | 熱硬化型樹脂組成物、その硬化物およびプリント配線板用層間接着フィルム |
WO2012151171A1 (en) * | 2011-05-02 | 2012-11-08 | Dow Global Technologies Llc | Trimethyl borate in epoxy resins |
JP6026095B2 (ja) * | 2011-10-31 | 2016-11-16 | 太陽インキ製造株式会社 | 熱硬化性樹脂組成物及びその硬化物、並びにそれを用いたプリント配線板 |
JP5514356B2 (ja) * | 2012-09-28 | 2014-06-04 | 太陽インキ製造株式会社 | 光硬化性樹脂組成物、プリント配線板、及び光硬化性樹脂組成物の製造方法 |
JP6010483B2 (ja) * | 2013-02-28 | 2016-10-19 | 株式会社カネカ | 感光性樹脂組成物作製キット及びその利用 |
JP5758463B2 (ja) * | 2013-03-26 | 2015-08-05 | 太陽インキ製造株式会社 | エポキシ樹脂組成物、穴埋め充填用組成物およびこれらを用いたプリント配線板 |
JP5723958B1 (ja) * | 2013-12-02 | 2015-05-27 | 太陽インキ製造株式会社 | 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
-
2016
- 2016-04-28 JP JP2016090155A patent/JP6742796B2/ja active Active
- 2016-05-26 TW TW105116454A patent/TWI704174B/zh active
- 2016-07-18 KR KR1020160090494A patent/KR102588995B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20170012050A (ko) | 2017-02-02 |
TW201708403A (zh) | 2017-03-01 |
JP2017025290A (ja) | 2017-02-02 |
KR102588995B1 (ko) | 2023-10-13 |
TWI704174B (zh) | 2020-09-11 |
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