JP6742796B2 - 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 - Google Patents

硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 Download PDF

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Publication number
JP6742796B2
JP6742796B2 JP2016090155A JP2016090155A JP6742796B2 JP 6742796 B2 JP6742796 B2 JP 6742796B2 JP 2016090155 A JP2016090155 A JP 2016090155A JP 2016090155 A JP2016090155 A JP 2016090155A JP 6742796 B2 JP6742796 B2 JP 6742796B2
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Prior art keywords
resin composition
curable resin
resin
carboxyl group
epoxy resin
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JP2016090155A
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English (en)
Japanese (ja)
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JP2017025290A (ja
Inventor
晋一朗 福田
晋一朗 福田
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Taiyo Ink Manufacturing Co Ltd
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Taiyo Ink Manufacturing Co Ltd
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Publication date
Application filed by Taiyo Ink Manufacturing Co Ltd filed Critical Taiyo Ink Manufacturing Co Ltd
Priority to TW105116454A priority Critical patent/TWI704174B/zh
Priority to KR1020160090494A priority patent/KR102588995B1/ko
Priority to CN201610576040.XA priority patent/CN106200266B/zh
Publication of JP2017025290A publication Critical patent/JP2017025290A/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Materials For Photolithography (AREA)
JP2016090155A 2015-07-21 2016-04-28 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 Active JP6742796B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW105116454A TWI704174B (zh) 2015-07-21 2016-05-26 硬化性樹脂組成物、乾膜、硬化物以及印刷配線板
KR1020160090494A KR102588995B1 (ko) 2015-07-21 2016-07-18 경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판
CN201610576040.XA CN106200266B (zh) 2015-07-21 2016-07-21 固化性树脂组合物、干膜、固化物及印刷电路板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015144277 2015-07-21
JP2015144277 2015-07-21

Publications (2)

Publication Number Publication Date
JP2017025290A JP2017025290A (ja) 2017-02-02
JP6742796B2 true JP6742796B2 (ja) 2020-08-19

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ID=57945460

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JP2016090155A Active JP6742796B2 (ja) 2015-07-21 2016-04-28 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

Country Status (3)

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JP (1) JP6742796B2 (ko)
KR (1) KR102588995B1 (ko)
TW (1) TWI704174B (ko)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002338787A (ja) * 2001-05-15 2002-11-27 Kawamura Inst Of Chem Res エポキシ樹脂組成物及びその硬化物
JP2004277458A (ja) * 2003-03-12 2004-10-07 Nagase Chemtex Corp １液型エポキシ樹脂組成物およびそれを用いた１液型エポキシ樹脂系接着剤
JP4449402B2 (ja) 2003-08-25 2010-04-14 日立化成工業株式会社 永久レジスト用感光性樹脂組成物、永久レジスト用感光性フィルム、レジストパターンの形成方法及びプリント配線板
JP2008039926A (ja) * 2006-08-02 2008-02-21 Toyo Ink Mfg Co Ltd 感光性熱硬化性樹脂組成物
JP5588646B2 (ja) 2009-09-15 2014-09-10 太陽ホールディングス株式会社 熱硬化性樹脂組成物及びドライフィルム
WO2012105558A1 (ja) * 2011-02-01 2012-08-09 Dic株式会社 熱硬化型樹脂組成物、その硬化物およびプリント配線板用層間接着フィルム
WO2012151171A1 (en) * 2011-05-02 2012-11-08 Dow Global Technologies Llc Trimethyl borate in epoxy resins
JP6026095B2 (ja) * 2011-10-31 2016-11-16 太陽インキ製造株式会社 熱硬化性樹脂組成物及びその硬化物、並びにそれを用いたプリント配線板
JP5514356B2 (ja) * 2012-09-28 2014-06-04 太陽インキ製造株式会社 光硬化性樹脂組成物、プリント配線板、及び光硬化性樹脂組成物の製造方法
JP6010483B2 (ja) * 2013-02-28 2016-10-19 株式会社カネカ 感光性樹脂組成物作製キット及びその利用
JP5758463B2 (ja) * 2013-03-26 2015-08-05 太陽インキ製造株式会社 エポキシ樹脂組成物、穴埋め充填用組成物およびこれらを用いたプリント配線板
JP5723958B1 (ja) * 2013-12-02 2015-05-27 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

Also Published As

Publication number Publication date
KR20170012050A (ko) 2017-02-02
TW201708403A (zh) 2017-03-01
JP2017025290A (ja) 2017-02-02
KR102588995B1 (ko) 2023-10-13
TWI704174B (zh) 2020-09-11

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