JP6727552B2 - プリント基板を用いた回路構成体 - Google Patents
プリント基板を用いた回路構成体 Download PDFInfo
- Publication number
- JP6727552B2 JP6727552B2 JP2016236152A JP2016236152A JP6727552B2 JP 6727552 B2 JP6727552 B2 JP 6727552B2 JP 2016236152 A JP2016236152 A JP 2016236152A JP 2016236152 A JP2016236152 A JP 2016236152A JP 6727552 B2 JP6727552 B2 JP 6727552B2
- Authority
- JP
- Japan
- Prior art keywords
- bus bar
- circuit
- connection
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003780 insertion Methods 0.000 claims description 17
- 230000037431 insertion Effects 0.000 claims description 17
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 description 11
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 8
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- 238000012790 confirmation Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10272—Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Connection Or Junction Boxes (AREA)
- Structure Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
Claims (3)
- 複数の回路パターンが設けられているプリント基板と、
前記プリント基板に載置された回路切替部品とを備え、
前記回路切替部品が、複数種類の接続バスバーと該複数種類の接続バスバーから選択された任意の接続バスバーを装着保持することが可能なバスバー支持台を有し、
前記複数の回路パターンのそれぞれの接続ポイントが、プリント基板に貫設されたスルーホールによって構成され、前記バスバー支持台の下方に配置されて該バスバー支持台の延出方向で相互に離隔して配列されている一方、
前記複数種類の接続バスバーは、前記接続ポイントに導通接続されるリード部の数と位置が異なることによって種類分けされており、
前記バスバー支持台に対する前記接続バスバーの装着態様を変更することで、複数種類の回路仕様が提供されるようになっており、
前記複数の回路パターンが3つ以上の前記回路パターンを含んでおり、前記バスバー支持台の下方に各前記回路パターンの前記接続ポイントが設けられている一方、前記バスバー支持台には、前記3つ以上の回路パターンの前記接続ポイントに対応する位置で3つ以上のリード部挿通孔が貫通形成されており、
前記バスバー支持台が、前記プリント基板に実装された電気部品に一体的に形成されている
プリント基板を用いた回路構成体。 - 前記電気部品が、電源供給用コネクタモジュールである請求項1に記載のプリント基板を用いた回路構成体。
- 前記リード部挿通孔の内面にリード部を間に保持する一対のバスバー押え突起が設けられている請求項1または請求項2に記載のプリント基板を用いた回路構成体。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016236152A JP6727552B2 (ja) | 2016-12-05 | 2016-12-05 | プリント基板を用いた回路構成体 |
US15/811,753 US10091882B2 (en) | 2016-12-05 | 2017-11-14 | Circuit structure using printed-circuit board |
CN201711136512.0A CN108156747B (zh) | 2016-12-05 | 2017-11-16 | 使用印刷基板的电路结构体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016236152A JP6727552B2 (ja) | 2016-12-05 | 2016-12-05 | プリント基板を用いた回路構成体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018093092A JP2018093092A (ja) | 2018-06-14 |
JP6727552B2 true JP6727552B2 (ja) | 2020-07-22 |
Family
ID=62243703
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016236152A Active JP6727552B2 (ja) | 2016-12-05 | 2016-12-05 | プリント基板を用いた回路構成体 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10091882B2 (ja) |
JP (1) | JP6727552B2 (ja) |
CN (1) | CN108156747B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7404309B2 (ja) * | 2021-07-14 | 2023-12-25 | 矢崎総業株式会社 | 通電制御装置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0183360U (ja) * | 1987-11-24 | 1989-06-02 | ||
JPH0670269U (ja) * | 1993-03-10 | 1994-09-30 | 矢崎総業株式会社 | 回路変更構造 |
JPH09135058A (ja) | 1995-11-08 | 1997-05-20 | Zojirushi Corp | プリント配線板 |
JP3125861B2 (ja) * | 1996-08-30 | 2001-01-22 | 矢崎総業株式会社 | 電気接続箱の回路切換機構 |
US6353190B1 (en) * | 1998-10-09 | 2002-03-05 | Sumitomo Wiring Systems, Ltd. | Lattice-shaped circuit board |
JP2000182682A (ja) * | 1998-12-18 | 2000-06-30 | Sumitomo Wiring Syst Ltd | 電気接続箱 |
JP2001042763A (ja) * | 1999-07-28 | 2001-02-16 | Hachiken Denshi:Kk | 電子教材 |
JP3679362B2 (ja) * | 2000-12-27 | 2005-08-03 | 矢崎総業株式会社 | リレー、リレーユニット及び電気接続箱 |
JP2002218630A (ja) * | 2001-01-24 | 2002-08-02 | Oki Electric Ind Co Ltd | 電源分配バー |
JP4765849B2 (ja) * | 2006-09-06 | 2011-09-07 | 住友電装株式会社 | 回路材および該回路材を収容した車載用の電気接続箱 |
JP5347545B2 (ja) * | 2009-02-12 | 2013-11-20 | 住友電装株式会社 | 電気接続箱 |
JP2011066083A (ja) * | 2009-09-15 | 2011-03-31 | Sumitomo Wiring Syst Ltd | プリント配線基板 |
JP5488449B2 (ja) * | 2010-12-23 | 2014-05-14 | 住友電装株式会社 | ジャンパ線付プリント基板 |
CN202998649U (zh) * | 2012-12-25 | 2013-06-12 | 启碁科技股份有限公司 | 电路板结构及低噪声降频器 |
JP2014128073A (ja) * | 2012-12-25 | 2014-07-07 | Sumitomo Wiring Syst Ltd | 電気接続箱 |
JP6015940B2 (ja) * | 2013-01-17 | 2016-10-26 | 住友電装株式会社 | プリント基板積層体を備えた電気接続箱 |
JP2015065395A (ja) * | 2013-08-28 | 2015-04-09 | 矢崎総業株式会社 | ジャンパモジュール搭載回路基板および回路基板組立体 |
-
2016
- 2016-12-05 JP JP2016236152A patent/JP6727552B2/ja active Active
-
2017
- 2017-11-14 US US15/811,753 patent/US10091882B2/en active Active
- 2017-11-16 CN CN201711136512.0A patent/CN108156747B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
US20180160537A1 (en) | 2018-06-07 |
CN108156747B (zh) | 2020-09-18 |
US10091882B2 (en) | 2018-10-02 |
CN108156747A (zh) | 2018-06-12 |
JP2018093092A (ja) | 2018-06-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA2709788C (en) | Junction block | |
JP4172334B2 (ja) | 電気接続箱 | |
JP4241729B2 (ja) | 電気接続箱および該電気接続箱の組立方法 | |
US20080105460A1 (en) | Printed circuit board having fuse housings and electric junction box for vehicle | |
JP4082285B2 (ja) | プリント基板の接続構造 | |
JP2005304105A (ja) | 電気接続箱 | |
CN103227368A (zh) | 工业自动化技术的输入/输出组件 | |
WO2011065461A1 (ja) | 回路構成体及び電気接続箱 | |
JP6727552B2 (ja) | プリント基板を用いた回路構成体 | |
JP2009153321A (ja) | バスバー相互の保持構造とそれを備えた回路基板組立体 | |
JP5605635B2 (ja) | 回路構成体及び電気接続箱 | |
JP4728776B2 (ja) | バスバー付き回路基板 | |
JP2007317990A (ja) | フレキシブルプリント配線板 | |
JP2006313690A (ja) | オンボードコネクタ | |
JP4355678B2 (ja) | 電気接続箱 | |
JP4286772B2 (ja) | ジャンクションブロック | |
JP4674930B2 (ja) | 電気接続箱 | |
JP2011181468A (ja) | バスバー付基板用端子 | |
JP5573543B2 (ja) | 回路構成体及び電気接続箱 | |
JP3914192B2 (ja) | ジョイントコネクタ | |
JP5859762B2 (ja) | バスバーと基板の接続構造、及び電気接続箱 | |
JP2007244038A (ja) | ジャンクションボックス | |
JP5831330B2 (ja) | 電気接続箱 | |
JP6024039B2 (ja) | 回路構成体および電気接続箱 | |
JP5841761B2 (ja) | 電気接続箱 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190325 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20200124 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200221 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200416 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200601 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200614 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6727552 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |