JP6723765B2 - ウエハ処理装置およびウエハ処理装置用のシーリングリング - Google Patents
ウエハ処理装置およびウエハ処理装置用のシーリングリング Download PDFInfo
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- JP6723765B2 JP6723765B2 JP2016038695A JP2016038695A JP6723765B2 JP 6723765 B2 JP6723765 B2 JP 6723765B2 JP 2016038695 A JP2016038695 A JP 2016038695A JP 2016038695 A JP2016038695 A JP 2016038695A JP 6723765 B2 JP6723765 B2 JP 6723765B2
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/16—Sealings between relatively-moving surfaces
- F16J15/32—Sealings between relatively-moving surfaces with elastic sealings, e.g. O-rings
- F16J15/3204—Sealings between relatively-moving surfaces with elastic sealings, e.g. O-rings with at least one lip
- F16J15/3228—Sealings between relatively-moving surfaces with elastic sealings, e.g. O-rings with at least one lip formed by deforming a flat ring
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/16—Sealings between relatively-moving surfaces
- F16J15/32—Sealings between relatively-moving surfaces with elastic sealings, e.g. O-rings
- F16J15/3268—Mounting of sealing rings
- F16J15/3276—Mounting of sealing rings with additional static sealing between the sealing, or its casing or support, and the surface on which it is mounted
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/16—Sealings between relatively-moving surfaces
- F16J15/32—Sealings between relatively-moving surfaces with elastic sealings, e.g. O-rings
- F16J15/3248—Sealings between relatively-moving surfaces with elastic sealings, e.g. O-rings provided with casings or supports
- F16J15/3252—Sealings between relatively-moving surfaces with elastic sealings, e.g. O-rings provided with casings or supports with rigid casings or supports
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/16—Sealings between relatively-moving surfaces
- F16J15/32—Sealings between relatively-moving surfaces with elastic sealings, e.g. O-rings
- F16J15/3268—Mounting of sealing rings
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Gasket Seals (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
Claims (13)
- ウエハ処理装置(10)のカバーリング(16)に取り付けるためのシーリングリング(24)であって、環状キャリア(40)と環状キャリア(40)に取り外し可能で取り付けられたシーリングリップ(42)を有し、
前記シーリングリップ(42)が、キャリア(40)中の溝(50)に取り付けられ、
前記シーリングリップ(42)が、溝(50)から、キャリア(40)の上側の一部を越え、そして円錐状座面(54)の上を超え、その自由端がキャリア(40)の下側を超えてはみ出るまで延びているシーリングリング(24)。 - シーリングリップ(42)は、半径方向の外側にビード(52)を備え、前記ビードは溝(50)に取り付けられたことを特徴とする請求項1に記載のシーリングリング(24)。
- キャリア(40)の座面とシーリングリップ(42)との間の空間が、チャネル(60)の手段によって、シーリングリップ(42)の外側のキャリア(40)の上側のポイントまで解放されていることを特徴とする請求項1に記載のシーリングリング(24)。
- キャリア(40)は、シーリングリップ(42)の自由端の半径方向の外側に横たわるプレスリブ(56)を備えることを特徴とする請求項1〜3のいずれか一つに記載のシーリングリング(24)。
- キャリア(40)は、カバーリング(16)に向かって配置されたシール(48)を備えることを特徴とする請求項1〜4のいずれか一つに記載のシーリングリング(24)。
- ウエハ(14)のためのレセプタクル(12)と、レセプタクル(12)に配置されたカバーリング(16)と、その手段によりウエハ(14)がレセプタクル(12)にシールできる請求項1〜5のいずれか一つに記載のシーリングリング(24)とを有するウエハ処理装置(10)。
- カバーリング(16)は、カバーリング(16)上のシーリングリング(24)の座面に開けられた、解放チャネル(62)を備えることを特徴とする請求項6に記載のウエハ処理装置(10)。
- キャリア(40)は、カバーリング(16)にねじ止めされていることを特徴とする請求項6または7に記載のウエハ処理装置(10)。
- 真空チャンバ(18)は、カバーリング(16)と、レセプタクル(12)と、キャリア(40)との間でシールされることを特徴とする請求項6〜8のいずれか一つに記載のウエハ処理装置(10)。
- 特に請求項1〜5のいずれか一つに記載の、シーリングリング(24)の製造方法であって、
その上側に溝(50)と、上側から半径方向内側に向かって勾配を持つ座面が形成された環状キャリア(40)を提供する工程と、
ビード(52)が設けられたシーリングリップ(42)であって、ビード(52)の直径は、シーリングリップ(42)の初期状態では、溝(50)の直径よりも小さく形成されているシーリングリップ(42)を提供する工程と、
シーリングリップ(42)は座面に沿って延び、そしてその自由端はキャリア(40)の下側を超えて延びるように、溝(50)にシーリングリップ(42)を取り付ける工程と、によって行われる製造方法。 - シーリングリップ(42)が、キャリアに載せられた後に、所定のサイズに切られることを特徴とする請求項10に記載の方法。
- キャリア(40)から見て外方に向くシーリングリップ(42)端面(64)が、キャリア(40)の上側に対して垂直または円錐状に延びるように、シーリングリップ(42)の自由端が切られることを特徴とする請求項11に記載の方法。
- シーリングリング(24)が、請求項6にかかるウエハ処理装置に搭載されている請求項11に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL2014625A NL2014625B1 (en) | 2015-04-13 | 2015-04-13 | Wafer treating device and sealing ring for a wafer treating device. |
NL2014625 | 2015-04-13 |
Publications (2)
Publication Number | Publication Date |
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JP2016200277A JP2016200277A (ja) | 2016-12-01 |
JP6723765B2 true JP6723765B2 (ja) | 2020-07-15 |
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Application Number | Title | Priority Date | Filing Date |
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JP2016038695A Active JP6723765B2 (ja) | 2015-04-13 | 2016-03-01 | ウエハ処理装置およびウエハ処理装置用のシーリングリング |
Country Status (8)
Country | Link |
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US (1) | US10295063B2 (ja) |
JP (1) | JP6723765B2 (ja) |
KR (1) | KR102100535B1 (ja) |
CN (1) | CN106057705B (ja) |
AT (1) | AT517055B1 (ja) |
DE (1) | DE102016106289B4 (ja) |
NL (1) | NL2014625B1 (ja) |
TW (1) | TWI662208B (ja) |
Families Citing this family (13)
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NL2014625B1 (en) * | 2015-04-13 | 2017-01-06 | Suss Microtec Lithography Gmbh | Wafer treating device and sealing ring for a wafer treating device. |
JP6611565B2 (ja) * | 2015-11-02 | 2019-11-27 | 東京エレクトロン株式会社 | 洗浄装置、剥離システム、洗浄方法、剥離方法、プログラム、および情報記憶媒体 |
NL2018243B1 (en) * | 2017-01-27 | 2018-08-07 | Suss Microtec Lithography Gmbh | Suction apparatus for an end effector, end effector for holding substrates and method of producing an end effector |
CN110246784B (zh) * | 2019-06-19 | 2021-05-07 | 西安奕斯伟硅片技术有限公司 | 一种支撑结构和具有其的热处理装置 |
CN110552041B (zh) * | 2019-09-16 | 2021-02-19 | 歌尔股份有限公司 | 金属材料的表面处理方法 |
KR20210082294A (ko) * | 2019-12-24 | 2021-07-05 | 주식회사 제우스 | 틸팅 제어 장치 |
US11791192B2 (en) * | 2020-01-19 | 2023-10-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Workpiece holder, wafer chuck, wafer holding method |
KR20220026623A (ko) * | 2020-08-25 | 2022-03-07 | 주식회사 제우스 | 기판처리장치 및 기판처리방법 |
TWI821679B (zh) | 2020-08-25 | 2023-11-11 | 南韓商杰宜斯科技有限公司 | 基板處理裝置及基板處理方法 |
KR20220135184A (ko) | 2021-03-26 | 2022-10-06 | 주식회사 제우스 | 기판처리장치 및 이의 제어방법 |
TWI831174B (zh) * | 2021-04-21 | 2024-02-01 | 南韓商杰宜斯科技有限公司 | 基板清洗裝置及其控制方法 |
KR20230025614A (ko) * | 2021-08-13 | 2023-02-22 | 주식회사 제우스 | 기판처리방법 |
KR20230025233A (ko) | 2021-08-13 | 2023-02-21 | 주식회사 제우스 | 기판처리방법 |
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KR102100535B1 (ko) | 2020-04-14 |
AT517055A3 (de) | 2018-07-15 |
CN106057705B (zh) | 2021-04-30 |
US20160300751A1 (en) | 2016-10-13 |
AT517055A2 (de) | 2016-10-15 |
CN106057705A (zh) | 2016-10-26 |
US10295063B2 (en) | 2019-05-21 |
AT517055B1 (de) | 2019-03-15 |
NL2014625B1 (en) | 2017-01-06 |
NL2014625A (en) | 2016-10-14 |
KR20160122067A (ko) | 2016-10-21 |
TW201708748A (zh) | 2017-03-01 |
TWI662208B (zh) | 2019-06-11 |
DE102016106289A1 (de) | 2016-10-13 |
JP2016200277A (ja) | 2016-12-01 |
DE102016106289B4 (de) | 2020-03-19 |
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