JP6704348B2 - 有機材料用の蒸発源 - Google Patents

有機材料用の蒸発源 Download PDF

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Publication number
JP6704348B2
JP6704348B2 JP2016557604A JP2016557604A JP6704348B2 JP 6704348 B2 JP6704348 B2 JP 6704348B2 JP 2016557604 A JP2016557604 A JP 2016557604A JP 2016557604 A JP2016557604 A JP 2016557604A JP 6704348 B2 JP6704348 B2 JP 6704348B2
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Japan
Prior art keywords
evaporation source
source array
substrate
evaporation
distribution
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JP2016557604A
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English (en)
Japanese (ja)
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JP2017509794A5 (enExample
JP2017509794A (ja
Inventor
ホセ マヌエル ディエゲス−カンポ，
ホセ マヌエル ディエゲス−カンポ，
シュテファン バンゲルト，
シュテファン バンゲルト，
アンドレアス ロップ，
アンドレアス ロップ，
ウーヴェ シュースラー，
ウーヴェ シュースラー，
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Applied Materials Inc
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Applied Materials Inc
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Publication of JP2017509794A5 publication Critical patent/JP2017509794A5/ja
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Publication of JP6704348B2 publication Critical patent/JP6704348B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
JP2016557604A 2014-03-21 2014-03-21 有機材料用の蒸発源 Active JP6704348B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2014/055744 WO2015139777A1 (en) 2014-03-21 2014-03-21 Evaporation source for organic material

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019137536A Division JP2019214791A (ja) 2019-07-26 2019-07-26 有機材料用の蒸発源

Publications (3)

Publication Number Publication Date
JP2017509794A JP2017509794A (ja) 2017-04-06
JP2017509794A5 JP2017509794A5 (enExample) 2017-05-25
JP6704348B2 true JP6704348B2 (ja) 2020-06-03

Family

ID=50382443

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016557604A Active JP6704348B2 (ja) 2014-03-21 2014-03-21 有機材料用の蒸発源

Country Status (7)

Country Link
US (1) US20170081755A1 (enExample)
EP (1) EP3119920A1 (enExample)
JP (1) JP6704348B2 (enExample)
KR (1) KR101997808B1 (enExample)
CN (1) CN106133184B (enExample)
TW (1) TWI640646B (enExample)
WO (1) WO2015139777A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102082192B1 (ko) * 2014-11-07 2020-02-27 어플라이드 머티어리얼스, 인코포레이티드 증발된 재료를 증착하기 위한 장치, 분배 파이프, 진공 증착 챔버, 및 증발된 재료를 증착하기 위한 방법
WO2017121491A1 (en) * 2016-01-15 2017-07-20 Applied Materials, Inc. Evaporation source, apparatus and method for depositing organic material
CN107592889A (zh) * 2016-05-10 2018-01-16 应用材料公司 用于沉积已蒸发材料的蒸发源与用于沉积已蒸发材料的方法
CN106595759B (zh) * 2016-12-07 2019-02-01 上海宇航系统工程研究所 一种低温推进剂贮存技术地面试验系统
JP2019503431A (ja) * 2016-12-12 2019-02-07 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板上に材料を堆積する装置、基板上に１つ以上の層を堆積するシステム、及び真空堆積システムをモニタする方法
CN106637091B (zh) * 2017-02-24 2019-08-30 旭科新能源股份有限公司 用于薄膜太阳能电池制造的高温蒸发炉
JP6602465B2 (ja) * 2017-02-24 2019-11-06 アプライド マテリアルズ インコーポレイテッド 基板キャリア及びマスクキャリアの位置決め装置、基板キャリア及びマスクキャリアの搬送システム、並びにそのための方法
JP6549314B2 (ja) * 2017-03-17 2019-07-24 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 堆積システム、堆積装置、及び堆積システムを操作する方法
CN109154063A (zh) * 2017-04-28 2019-01-04 应用材料公司 真空系统和用于在基板上沉积多个材料的方法
JP2019534938A (ja) * 2017-09-26 2019-12-05 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 材料堆積装置、真空堆積システム、及び真空堆積を行う方法
CN111344433A (zh) * 2017-11-16 2020-06-26 应用材料公司 冷却沉积源的方法、用于冷却沉积源的腔室和沉积系统
CN110621803B (zh) * 2018-04-18 2022-07-12 应用材料公司 用于沉积已蒸发材料于基板上的蒸发源、沉积设备、用于测量已蒸发材料的蒸汽压力的方法、及用于确定已蒸发材料的蒸发率的方法
KR20200138391A (ko) * 2018-06-15 2020-12-09 어플라이드 머티어리얼스, 인코포레이티드 증착 영역을 냉각시키기 위한 냉각 시스템, 증착 영역에서 재료를 증착하기 위한 어레인지먼트, 및 증착 영역에서 기판 상에 증착하는 방법
WO2020030252A1 (en) * 2018-08-07 2020-02-13 Applied Materials, Inc. Material deposition apparatus, vacuum deposition system and method of processing a large area substrate
US10566168B1 (en) * 2018-08-10 2020-02-18 John Bennett Low voltage electron transparent pellicle
CN108842134B (zh) * 2018-08-29 2024-01-16 郑州华晶新能源科技有限公司 一种油屏蔽挥发装置
KR20200040537A (ko) * 2018-10-10 2020-04-20 엘지디스플레이 주식회사 측향식 진공증착용 소스, 소스 어셈블리 및 이를 이용한 측향식 진공증착 장치
WO2020126041A1 (en) * 2018-12-21 2020-06-25 Applied Materials, Inc. Vapor deposition apparatus and method for coating a substrate in a vacuum chamber

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100477546B1 (ko) * 2002-07-24 2005-03-18 주식회사 소로나 유기물질 증착방법 및 이를 적용한 장치
JP2005002450A (ja) * 2003-06-13 2005-01-06 Pioneer Electronic Corp 蒸着方法、蒸着ヘッド、及び有機エレクトロルミネッセンス表示パネルの製造装置
EP1505167B1 (en) * 2003-08-04 2014-09-17 LG Display Co., Ltd. Evaporation source
JP4557170B2 (ja) * 2004-11-26 2010-10-06 三星モバイルディスプレイ株式會社 蒸発源
EP1752555A1 (de) * 2005-07-28 2007-02-14 Applied Materials GmbH & Co. KG Verdampfervorrichtung
PL1752554T3 (pl) * 2005-07-28 2008-03-31 Applied Mat Gmbh & Co Kg Urządzenie do naparowywania
JP5183310B2 (ja) * 2008-06-12 2013-04-17 日立造船株式会社 蒸着装置
KR20090130559A (ko) * 2008-06-16 2009-12-24 삼성모바일디스플레이주식회사 이송 장치 및 이를 구비하는 유기물 증착 장치
EP2204467B1 (en) * 2008-12-23 2014-05-07 Applied Materials, Inc. Method and apparatus for depositing mixed layers
DE102010041376A1 (de) * 2009-09-25 2011-04-07 Von Ardenne Anlagentechnik Gmbh Verdampfereinrichtung für eine Beschichtungsanlage und Verfahren zur Koverdampfung von mindestens zwei Substanzen
KR101708420B1 (ko) * 2010-09-15 2017-02-21 삼성디스플레이 주식회사 기판 증착 시스템 및 이를 이용한 증착 방법
EP2508645B1 (en) * 2011-04-06 2015-02-25 Applied Materials, Inc. Evaporation system with measurement unit
KR101288307B1 (ko) * 2011-05-31 2013-07-22 주성엔지니어링(주) 증발 증착 장치 및 증발 증착 방법
JP2013211137A (ja) * 2012-03-30 2013-10-10 Samsung Display Co Ltd 真空蒸着方法及びその装置
EP3102715A1 (en) * 2014-02-04 2016-12-14 Applied Materials, Inc. Evaporation source for organic material, apparatus having an evaporation source for organic material, system having an evaporation deposition apparatus with an evaporation source for organic materials, and method for operating an evaporation source for organic material

Also Published As

Publication number Publication date
EP3119920A1 (en) 2017-01-25
CN106133184A (zh) 2016-11-16
US20170081755A1 (en) 2017-03-23
TWI640646B (zh) 2018-11-11
CN106133184B (zh) 2020-03-17
KR101997808B1 (ko) 2019-07-08
KR20160135355A (ko) 2016-11-25
TW201604302A (zh) 2016-02-01
JP2017509794A (ja) 2017-04-06
WO2015139777A1 (en) 2015-09-24

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