TWI640646B - 蒸發源陣列 - Google Patents
蒸發源陣列 Download PDFInfo
- Publication number
- TWI640646B TWI640646B TW104108945A TW104108945A TWI640646B TW I640646 B TWI640646 B TW I640646B TW 104108945 A TW104108945 A TW 104108945A TW 104108945 A TW104108945 A TW 104108945A TW I640646 B TWI640646 B TW I640646B
- Authority
- TW
- Taiwan
- Prior art keywords
- evaporation source
- evaporation
- substrate
- distribution
- source array
- Prior art date
Links
- 238000001704 evaporation Methods 0.000 title claims abstract description 241
- 230000008020 evaporation Effects 0.000 title claims abstract description 240
- 239000000758 substrate Substances 0.000 claims abstract description 230
- 238000009826 distribution Methods 0.000 claims abstract description 194
- 239000011368 organic material Substances 0.000 claims abstract description 81
- 238000001816 cooling Methods 0.000 claims abstract description 51
- 239000012530 fluid Substances 0.000 claims abstract description 8
- 238000004891 communication Methods 0.000 claims abstract description 7
- 238000000151 deposition Methods 0.000 claims description 117
- 230000008021 deposition Effects 0.000 claims description 110
- 238000010438 heat treatment Methods 0.000 claims description 42
- 239000010936 titanium Substances 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 239000010453 quartz Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 61
- 238000012546 transfer Methods 0.000 description 51
- 239000000463 material Substances 0.000 description 44
- 239000010410 layer Substances 0.000 description 41
- 238000004140 cleaning Methods 0.000 description 27
- 230000002829 reductive effect Effects 0.000 description 22
- 239000011521 glass Substances 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 15
- 238000012545 processing Methods 0.000 description 15
- 238000012423 maintenance Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 11
- 230000005855 radiation Effects 0.000 description 11
- 239000010409 thin film Substances 0.000 description 11
- 239000011796 hollow space material Substances 0.000 description 10
- 238000007689 inspection Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 7
- 238000004806 packaging method and process Methods 0.000 description 6
- 238000005192 partition Methods 0.000 description 6
- 239000007921 spray Substances 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- 230000006872 improvement Effects 0.000 description 5
- -1 ferrous metals Chemical class 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 230000000873 masking effect Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 239000003570 air Substances 0.000 description 3
- 238000003491 array Methods 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 239000012809 cooling fluid Substances 0.000 description 3
- 238000005137 deposition process Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 239000005361 soda-lime glass Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000010549 co-Evaporation Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009461 vacuum packaging Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ??PCT/EP2014/055744 | 2014-03-21 | ||
| PCT/EP2014/055744 WO2015139777A1 (en) | 2014-03-21 | 2014-03-21 | Evaporation source for organic material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201604302A TW201604302A (zh) | 2016-02-01 |
| TWI640646B true TWI640646B (zh) | 2018-11-11 |
Family
ID=50382443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104108945A TWI640646B (zh) | 2014-03-21 | 2015-03-20 | 蒸發源陣列 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20170081755A1 (enExample) |
| EP (1) | EP3119920A1 (enExample) |
| JP (1) | JP6704348B2 (enExample) |
| KR (1) | KR101997808B1 (enExample) |
| CN (1) | CN106133184B (enExample) |
| TW (1) | TWI640646B (enExample) |
| WO (1) | WO2015139777A1 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102082192B1 (ko) * | 2014-11-07 | 2020-02-27 | 어플라이드 머티어리얼스, 인코포레이티드 | 증발된 재료를 증착하기 위한 장치, 분배 파이프, 진공 증착 챔버, 및 증발된 재료를 증착하기 위한 방법 |
| WO2017121491A1 (en) * | 2016-01-15 | 2017-07-20 | Applied Materials, Inc. | Evaporation source, apparatus and method for depositing organic material |
| CN107592889A (zh) * | 2016-05-10 | 2018-01-16 | 应用材料公司 | 用于沉积已蒸发材料的蒸发源与用于沉积已蒸发材料的方法 |
| CN106595759B (zh) * | 2016-12-07 | 2019-02-01 | 上海宇航系统工程研究所 | 一种低温推进剂贮存技术地面试验系统 |
| JP2019503431A (ja) * | 2016-12-12 | 2019-02-07 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 基板上に材料を堆積する装置、基板上に１つ以上の層を堆積するシステム、及び真空堆積システムをモニタする方法 |
| CN106637091B (zh) * | 2017-02-24 | 2019-08-30 | 旭科新能源股份有限公司 | 用于薄膜太阳能电池制造的高温蒸发炉 |
| JP6602465B2 (ja) * | 2017-02-24 | 2019-11-06 | アプライド マテリアルズ インコーポレイテッド | 基板キャリア及びマスクキャリアの位置決め装置、基板キャリア及びマスクキャリアの搬送システム、並びにそのための方法 |
| JP6549314B2 (ja) * | 2017-03-17 | 2019-07-24 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 堆積システム、堆積装置、及び堆積システムを操作する方法 |
| CN109154063A (zh) * | 2017-04-28 | 2019-01-04 | 应用材料公司 | 真空系统和用于在基板上沉积多个材料的方法 |
| JP2019534938A (ja) * | 2017-09-26 | 2019-12-05 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 材料堆積装置、真空堆積システム、及び真空堆積を行う方法 |
| CN111344433A (zh) * | 2017-11-16 | 2020-06-26 | 应用材料公司 | 冷却沉积源的方法、用于冷却沉积源的腔室和沉积系统 |
| CN110621803B (zh) * | 2018-04-18 | 2022-07-12 | 应用材料公司 | 用于沉积已蒸发材料于基板上的蒸发源、沉积设备、用于测量已蒸发材料的蒸汽压力的方法、及用于确定已蒸发材料的蒸发率的方法 |
| KR20200138391A (ko) * | 2018-06-15 | 2020-12-09 | 어플라이드 머티어리얼스, 인코포레이티드 | 증착 영역을 냉각시키기 위한 냉각 시스템, 증착 영역에서 재료를 증착하기 위한 어레인지먼트, 및 증착 영역에서 기판 상에 증착하는 방법 |
| WO2020030252A1 (en) * | 2018-08-07 | 2020-02-13 | Applied Materials, Inc. | Material deposition apparatus, vacuum deposition system and method of processing a large area substrate |
| US10566168B1 (en) * | 2018-08-10 | 2020-02-18 | John Bennett | Low voltage electron transparent pellicle |
| CN108842134B (zh) * | 2018-08-29 | 2024-01-16 | 郑州华晶新能源科技有限公司 | 一种油屏蔽挥发装置 |
| KR20200040537A (ko) * | 2018-10-10 | 2020-04-20 | 엘지디스플레이 주식회사 | 측향식 진공증착용 소스, 소스 어셈블리 및 이를 이용한 측향식 진공증착 장치 |
| WO2020126041A1 (en) * | 2018-12-21 | 2020-06-25 | Applied Materials, Inc. | Vapor deposition apparatus and method for coating a substrate in a vacuum chamber |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070022955A1 (en) * | 2005-07-28 | 2007-02-01 | Marcus Bender | Vapor deposition device |
| EP2204467A1 (en) * | 2008-12-23 | 2010-07-07 | Applied Materials, Inc. | Method and apparatus for depositing mixed layers |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100477546B1 (ko) * | 2002-07-24 | 2005-03-18 | 주식회사 소로나 | 유기물질 증착방법 및 이를 적용한 장치 |
| JP2005002450A (ja) * | 2003-06-13 | 2005-01-06 | Pioneer Electronic Corp | 蒸着方法、蒸着ヘッド、及び有機エレクトロルミネッセンス表示パネルの製造装置 |
| EP1505167B1 (en) * | 2003-08-04 | 2014-09-17 | LG Display Co., Ltd. | Evaporation source |
| JP4557170B2 (ja) * | 2004-11-26 | 2010-10-06 | 三星モバイルディスプレイ株式會社 | 蒸発源 |
| EP1752555A1 (de) * | 2005-07-28 | 2007-02-14 | Applied Materials GmbH & Co. KG | Verdampfervorrichtung |
| JP5183310B2 (ja) * | 2008-06-12 | 2013-04-17 | 日立造船株式会社 | 蒸着装置 |
| KR20090130559A (ko) * | 2008-06-16 | 2009-12-24 | 삼성모바일디스플레이주식회사 | 이송 장치 및 이를 구비하는 유기물 증착 장치 |
| DE102010041376A1 (de) * | 2009-09-25 | 2011-04-07 | Von Ardenne Anlagentechnik Gmbh | Verdampfereinrichtung für eine Beschichtungsanlage und Verfahren zur Koverdampfung von mindestens zwei Substanzen |
| KR101708420B1 (ko) * | 2010-09-15 | 2017-02-21 | 삼성디스플레이 주식회사 | 기판 증착 시스템 및 이를 이용한 증착 방법 |
| EP2508645B1 (en) * | 2011-04-06 | 2015-02-25 | Applied Materials, Inc. | Evaporation system with measurement unit |
| KR101288307B1 (ko) * | 2011-05-31 | 2013-07-22 | 주성엔지니어링(주) | 증발 증착 장치 및 증발 증착 방법 |
| JP2013211137A (ja) * | 2012-03-30 | 2013-10-10 | Samsung Display Co Ltd | 真空蒸着方法及びその装置 |
| EP3102715A1 (en) * | 2014-02-04 | 2016-12-14 | Applied Materials, Inc. | Evaporation source for organic material, apparatus having an evaporation source for organic material, system having an evaporation deposition apparatus with an evaporation source for organic materials, and method for operating an evaporation source for organic material |
-
2014
- 2014-03-21 EP EP14712648.6A patent/EP3119920A1/en not_active Withdrawn
- 2014-03-21 CN CN201480077386.4A patent/CN106133184B/zh active Active
- 2014-03-21 KR KR1020167029510A patent/KR101997808B1/ko active Active
- 2014-03-21 JP JP2016557604A patent/JP6704348B2/ja active Active
- 2014-03-21 US US15/126,568 patent/US20170081755A1/en not_active Abandoned
- 2014-03-21 WO PCT/EP2014/055744 patent/WO2015139777A1/en not_active Ceased
-
2015
- 2015-03-20 TW TW104108945A patent/TWI640646B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070022955A1 (en) * | 2005-07-28 | 2007-02-01 | Marcus Bender | Vapor deposition device |
| EP2204467A1 (en) * | 2008-12-23 | 2010-07-07 | Applied Materials, Inc. | Method and apparatus for depositing mixed layers |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3119920A1 (en) | 2017-01-25 |
| CN106133184A (zh) | 2016-11-16 |
| US20170081755A1 (en) | 2017-03-23 |
| CN106133184B (zh) | 2020-03-17 |
| KR101997808B1 (ko) | 2019-07-08 |
| JP6704348B2 (ja) | 2020-06-03 |
| KR20160135355A (ko) | 2016-11-25 |
| TW201604302A (zh) | 2016-02-01 |
| JP2017509794A (ja) | 2017-04-06 |
| WO2015139777A1 (en) | 2015-09-24 |
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