KR101997808B1 - 유기 재료를 위한 증발 소스 - Google Patents

유기 재료를 위한 증발 소스 Download PDF

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Publication number
KR101997808B1
KR101997808B1 KR1020167029510A KR20167029510A KR101997808B1 KR 101997808 B1 KR101997808 B1 KR 101997808B1 KR 1020167029510 A KR1020167029510 A KR 1020167029510A KR 20167029510 A KR20167029510 A KR 20167029510A KR 101997808 B1 KR101997808 B1 KR 101997808B1
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South Korea
Prior art keywords
substrate
evaporation source
depositing
organic materials
evaporation
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Korean (ko)
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KR20160135355A (ko
Inventor
요제 마누엘 디에게스-캠포
슈테판 반게르트
안드레아스 로프
우베 쉬슬러
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어플라이드 머티어리얼스, 인코포레이티드
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H01L51/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020167029510A 2014-03-21 2014-03-21 유기 재료를 위한 증발 소스 Active KR101997808B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2014/055744 WO2015139777A1 (en) 2014-03-21 2014-03-21 Evaporation source for organic material

Publications (2)

Publication Number Publication Date
KR20160135355A KR20160135355A (ko) 2016-11-25
KR101997808B1 true KR101997808B1 (ko) 2019-07-08

Family

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Application Number Title Priority Date Filing Date
KR1020167029510A Active KR101997808B1 (ko) 2014-03-21 2014-03-21 유기 재료를 위한 증발 소스

Country Status (7)

Country Link
US (1) US20170081755A1 (enExample)
EP (1) EP3119920A1 (enExample)
JP (1) JP6704348B2 (enExample)
KR (1) KR101997808B1 (enExample)
CN (1) CN106133184B (enExample)
TW (1) TWI640646B (enExample)
WO (1) WO2015139777A1 (enExample)

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KR102082192B1 (ko) * 2014-11-07 2020-02-27 어플라이드 머티어리얼스, 인코포레이티드 증발된 재료를 증착하기 위한 장치, 분배 파이프, 진공 증착 챔버, 및 증발된 재료를 증착하기 위한 방법
WO2017121491A1 (en) * 2016-01-15 2017-07-20 Applied Materials, Inc. Evaporation source, apparatus and method for depositing organic material
CN107592889A (zh) * 2016-05-10 2018-01-16 应用材料公司 用于沉积已蒸发材料的蒸发源与用于沉积已蒸发材料的方法
CN106595759B (zh) * 2016-12-07 2019-02-01 上海宇航系统工程研究所 一种低温推进剂贮存技术地面试验系统
JP2019503431A (ja) * 2016-12-12 2019-02-07 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板上に材料を堆積する装置、基板上に１つ以上の層を堆積するシステム、及び真空堆積システムをモニタする方法
CN106637091B (zh) * 2017-02-24 2019-08-30 旭科新能源股份有限公司 用于薄膜太阳能电池制造的高温蒸发炉
JP6602465B2 (ja) * 2017-02-24 2019-11-06 アプライド マテリアルズ インコーポレイテッド 基板キャリア及びマスクキャリアの位置決め装置、基板キャリア及びマスクキャリアの搬送システム、並びにそのための方法
JP6549314B2 (ja) * 2017-03-17 2019-07-24 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 堆積システム、堆積装置、及び堆積システムを操作する方法
CN109154063A (zh) * 2017-04-28 2019-01-04 应用材料公司 真空系统和用于在基板上沉积多个材料的方法
JP2019534938A (ja) * 2017-09-26 2019-12-05 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 材料堆積装置、真空堆積システム、及び真空堆積を行う方法
CN111344433A (zh) * 2017-11-16 2020-06-26 应用材料公司 冷却沉积源的方法、用于冷却沉积源的腔室和沉积系统
CN110621803B (zh) * 2018-04-18 2022-07-12 应用材料公司 用于沉积已蒸发材料于基板上的蒸发源、沉积设备、用于测量已蒸发材料的蒸汽压力的方法、及用于确定已蒸发材料的蒸发率的方法
KR20200138391A (ko) * 2018-06-15 2020-12-09 어플라이드 머티어리얼스, 인코포레이티드 증착 영역을 냉각시키기 위한 냉각 시스템, 증착 영역에서 재료를 증착하기 위한 어레인지먼트, 및 증착 영역에서 기판 상에 증착하는 방법
WO2020030252A1 (en) * 2018-08-07 2020-02-13 Applied Materials, Inc. Material deposition apparatus, vacuum deposition system and method of processing a large area substrate
US10566168B1 (en) * 2018-08-10 2020-02-18 John Bennett Low voltage electron transparent pellicle
CN108842134B (zh) * 2018-08-29 2024-01-16 郑州华晶新能源科技有限公司 一种油屏蔽挥发装置
KR20200040537A (ko) * 2018-10-10 2020-04-20 엘지디스플레이 주식회사 측향식 진공증착용 소스, 소스 어셈블리 및 이를 이용한 측향식 진공증착 장치
WO2020126041A1 (en) * 2018-12-21 2020-06-25 Applied Materials, Inc. Vapor deposition apparatus and method for coating a substrate in a vacuum chamber

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Also Published As

Publication number Publication date
EP3119920A1 (en) 2017-01-25
CN106133184A (zh) 2016-11-16
US20170081755A1 (en) 2017-03-23
TWI640646B (zh) 2018-11-11
CN106133184B (zh) 2020-03-17
JP6704348B2 (ja) 2020-06-03
KR20160135355A (ko) 2016-11-25
TW201604302A (zh) 2016-02-01
JP2017509794A (ja) 2017-04-06
WO2015139777A1 (en) 2015-09-24

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