JP6688025B2 - チップ抵抗器およびチップ抵抗器の製造方法 - Google Patents

チップ抵抗器およびチップ抵抗器の製造方法 Download PDF

Info

Publication number
JP6688025B2
JP6688025B2 JP2015167221A JP2015167221A JP6688025B2 JP 6688025 B2 JP6688025 B2 JP 6688025B2 JP 2015167221 A JP2015167221 A JP 2015167221A JP 2015167221 A JP2015167221 A JP 2015167221A JP 6688025 B2 JP6688025 B2 JP 6688025B2
Authority
JP
Japan
Prior art keywords
chip
resistor
insulating substrate
electrodes
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015167221A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017045861A (ja
Inventor
松本 健太郎
健太郎 松本
伊藤 隆志
隆志 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koa Corp
Original Assignee
Koa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koa Corp filed Critical Koa Corp
Priority to JP2015167221A priority Critical patent/JP6688025B2/ja
Priority to PCT/JP2016/073847 priority patent/WO2017033793A1/fr
Publication of JP2017045861A publication Critical patent/JP2017045861A/ja
Application granted granted Critical
Publication of JP6688025B2 publication Critical patent/JP6688025B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/02Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/034Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/14Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/142Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Details Of Resistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
JP2015167221A 2015-08-26 2015-08-26 チップ抵抗器およびチップ抵抗器の製造方法 Active JP6688025B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2015167221A JP6688025B2 (ja) 2015-08-26 2015-08-26 チップ抵抗器およびチップ抵抗器の製造方法
PCT/JP2016/073847 WO2017033793A1 (fr) 2015-08-26 2016-08-15 Résistance pavé et procédé de fabrication de résistance pavé

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015167221A JP6688025B2 (ja) 2015-08-26 2015-08-26 チップ抵抗器およびチップ抵抗器の製造方法

Publications (2)

Publication Number Publication Date
JP2017045861A JP2017045861A (ja) 2017-03-02
JP6688025B2 true JP6688025B2 (ja) 2020-04-28

Family

ID=58100131

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015167221A Active JP6688025B2 (ja) 2015-08-26 2015-08-26 チップ抵抗器およびチップ抵抗器の製造方法

Country Status (2)

Country Link
JP (1) JP6688025B2 (fr)
WO (1) WO2017033793A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115565742A (zh) * 2019-02-07 2023-01-03 罗姆股份有限公司 电阻器
JP2022189028A (ja) 2021-06-10 2022-12-22 Koa株式会社 チップ部品

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09330802A (ja) * 1996-06-07 1997-12-22 Matsushita Electric Ind Co Ltd 抵抗器およびその製造方法
JP3466411B2 (ja) * 1997-03-31 2003-11-10 太陽誘電株式会社 チップ抵抗器
JPH11283804A (ja) * 1998-03-31 1999-10-15 Murata Mfg Co Ltd 抵抗器
JP2011165752A (ja) * 2010-02-05 2011-08-25 Taiyosha Electric Co Ltd チップ抵抗器
JP6476417B2 (ja) * 2013-08-07 2019-03-06 パナソニックIpマネジメント株式会社 抵抗器の製造方法
JP6499007B2 (ja) * 2015-05-11 2019-04-10 Koa株式会社 チップ抵抗器

Also Published As

Publication number Publication date
WO2017033793A1 (fr) 2017-03-02
JP2017045861A (ja) 2017-03-02

Similar Documents

Publication Publication Date Title
CN101271750B (zh) 电子器件及其制造方法
JP5115968B2 (ja) チップ抵抗器の製造方法およびチップ抵抗器
JP2007073693A (ja) チップ抵抗器とのその製造方法
JP6181500B2 (ja) チップ抵抗器およびその製造方法
JP6688025B2 (ja) チップ抵抗器およびチップ抵抗器の製造方法
US20180090247A1 (en) Chip Resistor
US8854175B2 (en) Chip resistor device and method for fabricating the same
WO2016167182A1 (fr) Pavé résistif et son procédé de fabrication
WO2017057248A1 (fr) Pavé résistif
JP6629013B2 (ja) チップ抵抗器およびチップ抵抗器の製造方法
JP6170726B2 (ja) チップ抵抗器の製造方法
JP2017228701A (ja) チップ抵抗器およびチップ抵抗器の実装構造
JP6715002B2 (ja) チップ抵抗器の実装構造
JP2017059597A (ja) チップ抵抗器
JP6577315B2 (ja) チップ抵抗器の製造方法
JP6599759B2 (ja) チップ抵抗器
JP6159286B2 (ja) チップ抵抗器及びチップ抵抗器の製造方法
JP4504577B2 (ja) チップ形抵抗器の製造方法
JP2003272901A (ja) 厚膜抵抗器およびその製造方法
JP6695415B2 (ja) チップ抵抗器
KR101538416B1 (ko) 칩 저항기 및 그 제작 방법
JP6688035B2 (ja) チップ抵抗器
JP5166685B2 (ja) チップ抵抗器とのその製造方法
KR101544393B1 (ko) 칩 저항기 및 그 제작 방법
JP2022159807A (ja) チップ抵抗器

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180806

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190917

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20191113

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200331

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200403

R150 Certificate of patent or registration of utility model

Ref document number: 6688025

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250