JP6665161B2 - リワーク性湿気硬化型ホットメルト接着剤組成物、これを使用する方法およびこれを含む物品 - Google Patents

リワーク性湿気硬化型ホットメルト接着剤組成物、これを使用する方法およびこれを含む物品 Download PDF

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JP6665161B2
JP6665161B2 JP2017507732A JP2017507732A JP6665161B2 JP 6665161 B2 JP6665161 B2 JP 6665161B2 JP 2017507732 A JP2017507732 A JP 2017507732A JP 2017507732 A JP2017507732 A JP 2017507732A JP 6665161 B2 JP6665161 B2 JP 6665161B2
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polyester polyol
crystalline polyester
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スディプト・ダス
ヘンリー・ピー・マイヤー
アンソニー・ジェイ・オストルンド
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エイチ.ビー.フラー カンパニー
エイチ.ビー.フラー カンパニー
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • C09J175/06Polyurethanes from polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/10Removing layers, or parts of layers, mechanically or chemically
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006Delaminating
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08Processes
    • C08G18/10Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C08G18/12Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08Processes
    • C08G18/16Catalysts
    • C08G18/18Catalysts containing secondary or tertiary amines or salts thereof
    • C08G18/20Heterocyclic amines; Salts thereof
    • C08G18/2081Heterocyclic amines; Salts thereof containing at least two non-condensed heterocyclic rings
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    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40High-molecular-weight compounds
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    • C08G18/00Polymeric products of isocyanates or isothiocyanates
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    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40High-molecular-weight compounds
    • C08G18/4009Two or more macromolecular compounds not provided for in one single group of groups C08G18/42 - C08G18/64
    • C08G18/4018Mixtures of compounds of group C08G18/42 with compounds of group C08G18/48
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    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40High-molecular-weight compounds
    • C08G18/42Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/4202Two or more polyesters of different physical or chemical nature
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    • C08G18/42Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/4205Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups
    • C08G18/4208Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups
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    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40High-molecular-weight compounds
    • C08G18/42Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/4236Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups
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    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40High-molecular-weight compounds
    • C08G18/42Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/4266Polycondensates having carboxylic or carbonic ester groups in the main chain prepared from hydroxycarboxylic acids and/or lactones
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    • C08G18/00Polymeric products of isocyanates or isothiocyanates
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    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0017Casings, cabinets or drawers for electric apparatus with operator interface units
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
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    • C08G2170/20Compositions for hot melt adhesives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polyurethanes Or Polyureas (AREA)
JP2017507732A 2014-08-15 2015-08-14 リワーク性湿気硬化型ホットメルト接着剤組成物、これを使用する方法およびこれを含む物品 Active JP6665161B2 (ja)

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US201462037817P 2014-08-15 2014-08-15
US62/037,817 2014-08-15
US201462049489P 2014-09-12 2014-09-12
US62/049,489 2014-09-12
PCT/US2015/045250 WO2016025821A1 (en) 2014-08-15 2015-08-14 Re-workable moisture curable hot melt adhesive composition methods of using the same, and articles including the same

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JP2017532632A5 JP2017532632A5 (enExample) 2018-09-20
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US (2) US10011749B2 (enExample)
EP (1) EP3180376A1 (enExample)
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CN (1) CN105593329B (enExample)
TW (1) TWI700349B (enExample)
WO (1) WO2016025821A1 (enExample)

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JP2021161432A (ja) * 2020-03-31 2021-10-11 積水フーラー株式会社 湿気硬化型ホットメルト接着剤
CN112029019B (zh) * 2020-08-27 2022-12-02 青岛昊鑫新能源科技有限公司 一种碳纳米管分散剂及其制备方法
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JP7735662B2 (ja) * 2021-01-26 2025-09-09 Dic株式会社 湿気硬化型ポリウレタンホットメルト樹脂組成物、湿気硬化型ポリウレタンホットメルト接着剤、硬化物及び積層体
CN114989765B (zh) * 2021-03-01 2024-02-20 深圳科创新源新材料股份有限公司 一种热塑性底部填充材料及其制备方法和应用
WO2023019562A1 (en) * 2021-08-20 2023-02-23 Dow Global Technologies Llc High green strength reactive hot melt adhesives
CN113831830B (zh) * 2021-09-28 2023-04-07 江苏图研新材料科技有限公司 一种高阻隔聚氨酯自修复组合物及其制备方法
KR20240134292A (ko) * 2021-11-11 2024-09-09 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 접착제 시스템
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WO2013016133A2 (en) 2011-07-22 2013-01-31 H.B. Fuller Company A one-component, dual-cure adhesive for use on electronics
CN103717688A (zh) * 2011-07-22 2014-04-09 H.B.富勒公司 在电子器件上使用的反应性热熔粘合剂
CN104144996B (zh) * 2011-10-24 2016-10-12 3M创新有限公司 微结构化光学透明的粘合剂
CN103289631B (zh) * 2013-06-21 2014-12-10 上海智冠高分子材料有限公司 一种反应型聚氨酯热熔胶组合物的制备方法及其应用
WO2015016029A1 (ja) 2013-07-31 2015-02-05 Dic株式会社 湿気硬化型ホットメルトウレタン組成物及び接着剤
WO2015056478A1 (ja) 2013-10-15 2015-04-23 Dic株式会社 樹脂組成物
WO2016025821A1 (en) * 2014-08-15 2016-02-18 H.B. Fuller Company Re-workable moisture curable hot melt adhesive composition methods of using the same, and articles including the same
WO2016138445A1 (en) * 2015-02-27 2016-09-01 H.B. Fuller Company Oily chemical resistant moisture curable hot melt adhesive compositions and articles including the same

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CN105593329B (zh) 2020-01-24
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