JP6657506B2 - インダクタ素子及びその製造方法 - Google Patents
インダクタ素子及びその製造方法 Download PDFInfo
- Publication number
- JP6657506B2 JP6657506B2 JP2016018995A JP2016018995A JP6657506B2 JP 6657506 B2 JP6657506 B2 JP 6657506B2 JP 2016018995 A JP2016018995 A JP 2016018995A JP 2016018995 A JP2016018995 A JP 2016018995A JP 6657506 B2 JP6657506 B2 JP 6657506B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- insulating
- inductor element
- insulating layer
- coil pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 238000000034 method Methods 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 18
- 239000011810 insulating material Substances 0.000 claims description 13
- 239000003999 initiator Substances 0.000 claims description 9
- 239000000696 magnetic material Substances 0.000 claims description 9
- 238000000151 deposition Methods 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 150000002978 peroxides Chemical class 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims 2
- 239000010408 film Substances 0.000 description 31
- 229920000642 polymer Polymers 0.000 description 20
- 239000010949 copper Substances 0.000 description 8
- 239000000178 monomer Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 229910000859 α-Fe Inorganic materials 0.000 description 5
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 229920001477 hydrophilic polymer Polymers 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 229920001600 hydrophobic polymer Polymers 0.000 description 2
- 229910003471 inorganic composite material Inorganic materials 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000006247 magnetic powder Substances 0.000 description 2
- 230000005415 magnetization Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920001558 organosilicon polymer Polymers 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 230000003075 superhydrophobic effect Effects 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- MNZAKDODWSQONA-UHFFFAOYSA-N 1-dibutylphosphorylbutane Chemical compound CCCCP(=O)(CCCC)CCCC MNZAKDODWSQONA-UHFFFAOYSA-N 0.000 description 1
- JJRDRFZYKKFYMO-UHFFFAOYSA-N 2-methyl-2-(2-methylbutan-2-ylperoxy)butane Chemical compound CCC(C)(C)OOC(C)(C)CC JJRDRFZYKKFYMO-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/255—Magnetic cores made from particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Insulating Of Coils (AREA)
Description
先ず、本発明の一実施例に係るインダクタ素子について、図面を参照して具体的に説明する。
先ず、図4から図10は、本発明の一実施例に係るインダクタ素子の製造方法の工程断面図であり、図11は、本発明のインダクタ素子の製造方法に適用するicvd工程の蒸着原理を示す図である。
111 貫通孔
120 回路パターン
130 コイルパターン
140 第1絶縁膜
150 第2絶縁膜
160 磁性体
170 入出力パターン
180 外部端子
Claims (15)
- 絶縁層と、
前記絶縁層の両面に形成されたコイルパターンと、
前記コイルパターン上に互いに異なる絶縁物質で形成された二重絶縁膜と、
前記絶縁層、前記コイルパターン及び前記二重絶縁膜がモールディングされるように形成された磁性体と、を含み、
前記二重絶縁膜には前記コイルパターンの隣接したターンとターンとの間の離隔空間に対応する形態の溝が形成され、
前記溝は前記磁性体で充填される、インダクタ素子。 - 前記二重絶縁膜は、第1絶縁物質で形成された第1絶縁膜と、第2絶縁物質で形成された第2絶縁膜とを含む請求項1に記載のインダクタ素子。
- 前記第1絶縁膜は、前記第2絶縁膜よりも大きい密着強度を有する物質で形成される請求項2に記載のインダクタ素子。
- 前記第2絶縁膜は、前記第1絶縁膜よりも大きい破壊強度を有する物質で形成される請求項2または3に記載のインダクタ素子。
- 前記第1絶縁膜及び前記第2絶縁膜は、iCVD蒸着工法を用いて形成される請求項2から4のいずれか一項に記載のインダクタ素子。
- 前記絶縁層上にビアを含む回路パターンが、さらに形成される請求項1から5のいずれか一項に記載のインダクタ素子。
- 前記磁性体の外部面に前記コイルパターンに電気的に接続される一対の外部端子をさらに含む請求項1から6のいずれか一項に記載のインダクタ素子。
- 絶縁層の両面にコイルパターンを形成するステップと、
前記コイルパターン上に互いに異なる物質で二重絶縁膜を形成するステップと、
前記二重絶縁膜が形成されたものがモールディングされるように磁性体を形成するステップと、を含み、
前記二重絶縁膜には前記コイルパターンの隣接したターンとターンとの間の離隔空間に対応する形態の溝が形成され、
前記溝は前記磁性体で充填される、インダクタ素子の製造方法。 - 前記二重絶縁膜を形成するステップは、
第1絶縁物質で第1絶縁膜を形成するステップと、第2絶縁物質で第2絶縁膜を形成するステップとを含む請求項8に記載のインダクタ素子の製造方法。 - 前記第1絶縁膜は、前記第2絶縁膜よりも大きい密着強度を有する物質で形成される請求項9に記載のインダクタ素子の製造方法。
- 前記第2絶縁膜は、前記第1絶縁膜よりも大きい破壊強度を有する物質で形成される請求項9または10に記載のインダクタ素子の製造方法。
- 前記二重絶縁膜は、iCVD蒸着工法を用いて形成される請求項8から11のいずれか一項に記載のインダクタ素子の製造方法。
- 前記iCVD蒸着工法は、開始剤としてTBPO(Tert−Butyl Peroxide)またはTAPO(tert−aryl peroxide)の過酸化物(peroxide)を用いる請求項12に記載のインダクタ素子の製造方法。
- 前記絶縁層上に、ビアを含む回路パターンを形成するステップをさらに含む請求項8から13のいずれか一項に記載のインダクタ素子の製造方法。
- 前記磁性体の外部面に、前記コイルパターンに電気的に接続される一対の外部端子を形成するステップをさらに含む請求項8から14のいずれか一項に記載のインダクタ素子の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2015-0048218 | 2015-04-06 | ||
KR1020150048218A KR101693749B1 (ko) | 2015-04-06 | 2015-04-06 | 인덕터 소자 및 그 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016197712A JP2016197712A (ja) | 2016-11-24 |
JP6657506B2 true JP6657506B2 (ja) | 2020-03-04 |
Family
ID=57016195
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016018995A Active JP6657506B2 (ja) | 2015-04-06 | 2016-02-03 | インダクタ素子及びその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US20160293320A1 (ja) |
JP (1) | JP6657506B2 (ja) |
KR (1) | KR101693749B1 (ja) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11387033B2 (en) * | 2016-11-18 | 2022-07-12 | Hutchinson Technology Incorporated | High-aspect ratio electroplated structures and anisotropic electroplating processes |
US11521785B2 (en) | 2016-11-18 | 2022-12-06 | Hutchinson Technology Incorporated | High density coil design and process |
KR20180068570A (ko) * | 2016-12-14 | 2018-06-22 | 삼성전기주식회사 | 인덕터 |
KR101862503B1 (ko) * | 2017-01-06 | 2018-05-29 | 삼성전기주식회사 | 인덕터 및 그의 제조방법 |
KR101863280B1 (ko) | 2017-03-16 | 2018-05-31 | 삼성전기주식회사 | 코일부품 및 그 제조방법 |
KR102004807B1 (ko) | 2017-06-13 | 2019-10-08 | 삼성전기주식회사 | 코일 부품 |
KR101983192B1 (ko) | 2017-09-15 | 2019-05-28 | 삼성전기주식회사 | 코일 전자부품 |
KR101998269B1 (ko) * | 2017-09-26 | 2019-09-27 | 삼성전기주식회사 | 코일 부품 |
KR102029543B1 (ko) * | 2017-11-29 | 2019-10-07 | 삼성전기주식회사 | 코일 전자 부품 |
TWI798287B (zh) * | 2017-12-08 | 2023-04-11 | 日商日本電產理德股份有限公司 | Mi元件的製造方法及mi元件 |
KR102047595B1 (ko) * | 2017-12-11 | 2019-11-21 | 삼성전기주식회사 | 인덕터 및 그 제조방법 |
KR102505429B1 (ko) * | 2017-12-11 | 2023-03-03 | 삼성전기주식회사 | 코일 부품 |
KR102511868B1 (ko) * | 2017-12-20 | 2023-03-20 | 삼성전기주식회사 | 코일 전자부품 |
KR20190087829A (ko) * | 2018-01-17 | 2019-07-25 | 삼성전기주식회사 | 코일 부품 및 코일 부품의 제조 방법 |
WO2020003815A1 (ja) * | 2018-06-27 | 2020-01-02 | 日本電産リード株式会社 | Miセンサ、及び、miセンサの製造方法 |
KR102109636B1 (ko) * | 2018-07-19 | 2020-05-12 | 삼성전기주식회사 | 칩 인덕터 및 그 제조방법 |
KR102138886B1 (ko) | 2018-09-06 | 2020-07-28 | 삼성전기주식회사 | 코일 부품 |
KR102148832B1 (ko) * | 2018-10-12 | 2020-08-27 | 삼성전기주식회사 | 코일 부품 |
KR102658609B1 (ko) * | 2019-01-09 | 2024-04-19 | 삼성전기주식회사 | 코일 부품 |
JP7092070B2 (ja) * | 2019-03-04 | 2022-06-28 | 株式会社村田製作所 | 積層型コイル部品 |
KR102208281B1 (ko) * | 2019-05-15 | 2021-01-27 | 삼성전기주식회사 | 코일 부품 |
KR102679990B1 (ko) * | 2019-07-17 | 2024-07-02 | 삼성전기주식회사 | 코일 부품 |
KR102404315B1 (ko) * | 2020-05-08 | 2022-06-07 | 삼성전기주식회사 | 코일 부품 |
Family Cites Families (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5611613A (en) * | 1979-07-04 | 1981-02-05 | Matsushita Electric Ind Co Ltd | Thin film magnetic head |
JPH09270323A (ja) * | 1996-03-29 | 1997-10-14 | Toshiba Corp | 電子デバイス、電子デバイスの製造方法、および平面インダクタ |
US6207234B1 (en) * | 1998-06-24 | 2001-03-27 | Vishay Vitramon Incorporated | Via formation for multilayer inductive devices and other devices |
TW386279B (en) * | 1998-08-07 | 2000-04-01 | Winbond Electronics Corp | Inductor structure with air gap and method of manufacturing thereof |
US6466401B1 (en) * | 1999-06-02 | 2002-10-15 | Read-Rite Corporation | Thin film write head with interlaced coil winding and method of fabrication |
JP2002151332A (ja) * | 2000-11-15 | 2002-05-24 | Sony Corp | 薄膜コイル及びその形成方法、並びに薄膜磁気ヘッド、薄膜インダクタ、薄膜磁気センサ |
US6460974B1 (en) * | 2001-07-27 | 2002-10-08 | Hewlett-Packard Company | Micro-pump and method for generating fluid flow |
US6977796B2 (en) * | 2002-02-08 | 2005-12-20 | Headway Technologies, Inc. | Wiring pattern and method of manufacturing the same and thin film magnetic head and method of manufacturing the same |
US7060207B2 (en) * | 2003-09-30 | 2006-06-13 | Headway Technologies, Inc. | Thin film magnetic head and magnetic recording apparatus having a lowered coil resistance value, reduced generated heat, and high-frequency |
JP2005166874A (ja) * | 2003-12-02 | 2005-06-23 | Matsushita Electric Ind Co Ltd | コイル部品の製造方法 |
US7348671B2 (en) * | 2005-01-26 | 2008-03-25 | Micron Technology, Inc. | Vias having varying diameters and fills for use with a semiconductor device and methods of forming semiconductor device structures including same |
JP2006310716A (ja) * | 2005-03-31 | 2006-11-09 | Tdk Corp | 平面コイル素子 |
WO2007095393A2 (en) * | 2006-02-15 | 2007-08-23 | Massachusetts Institute Of Technology | Medical devices and coatings with non-leaching antimicrobial peptides |
US7518481B2 (en) | 2006-06-30 | 2009-04-14 | Intel Corporation | Slotted magnetic material for integrated circuit inductors |
KR101105651B1 (ko) * | 2007-12-07 | 2012-01-18 | 가부시키가이샤 무라타 세이사쿠쇼 | 적층형 전자 부품 |
KR20110102314A (ko) * | 2008-12-11 | 2011-09-16 | 카네카 코포레이션 | 의료용 튜브 |
JP5131260B2 (ja) * | 2009-09-29 | 2013-01-30 | 株式会社村田製作所 | 積層型コイル装置 |
EP2493987B1 (en) * | 2009-10-28 | 2014-07-09 | Basf Se | Pigments with improved sparkling effect |
US8638268B2 (en) * | 2010-09-30 | 2014-01-28 | Murata Manufacturing Co., Ltd. | Coil antenna and antenna structure |
KR101434351B1 (ko) * | 2010-10-21 | 2014-08-26 | 티디케이가부시기가이샤 | 코일 부품 및 그 제조 방법 |
JP5381956B2 (ja) * | 2010-10-21 | 2014-01-08 | Tdk株式会社 | コイル部品 |
US8552829B2 (en) * | 2010-11-19 | 2013-10-08 | Infineon Technologies Austria Ag | Transformer device and method for manufacturing a transformer device |
US8601673B2 (en) * | 2010-11-25 | 2013-12-10 | Cyntec Co., Ltd. | Method of producing an inductor with a high inductance |
JP2013024660A (ja) * | 2011-07-19 | 2013-02-04 | Sony Corp | 生物試料接触用電極及びその製造方法並びに電気測定装置 |
GB2493029B (en) * | 2011-07-22 | 2013-10-23 | Mikko Pekka Vainiala | Method and apparatus for impulse response measurement and simulation |
CN103814419B (zh) * | 2011-09-15 | 2017-12-08 | 松下知识产权经营株式会社 | 共模噪声滤波器以及其制造方法 |
US20130106552A1 (en) * | 2011-11-02 | 2013-05-02 | International Business Machines Corporation | Inductor with multiple polymeric layers |
KR20130058340A (ko) * | 2011-11-25 | 2013-06-04 | 삼성전기주식회사 | 인덕터 및 그 제조 방법 |
KR20130063363A (ko) * | 2011-12-06 | 2013-06-14 | 삼성전기주식회사 | 커먼 모드 노이즈 필터 |
JP2013131578A (ja) * | 2011-12-20 | 2013-07-04 | Taiyo Yuden Co Ltd | 積層コモンモードチョークコイル |
KR20130077177A (ko) * | 2011-12-29 | 2013-07-09 | 삼성전기주식회사 | 파워 인덕터 및 그 제조방법 |
JP6060508B2 (ja) * | 2012-03-26 | 2017-01-18 | Tdk株式会社 | 平面コイル素子およびその製造方法 |
KR20140023141A (ko) * | 2012-08-17 | 2014-02-26 | 삼성전기주식회사 | 인덕터 및 인덕터 제조방법 |
KR20140024139A (ko) * | 2012-08-20 | 2014-02-28 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조 방법 |
JP2014154813A (ja) * | 2013-02-13 | 2014-08-25 | Ibiden Co Ltd | プリント配線板 |
JP5900373B2 (ja) * | 2013-02-15 | 2016-04-06 | 株式会社村田製作所 | 電子部品 |
KR101503144B1 (ko) * | 2013-07-29 | 2015-03-16 | 삼성전기주식회사 | 박막 인덕터 소자 및 이의 제조방법 |
KR101462806B1 (ko) * | 2013-10-11 | 2014-11-20 | 삼성전기주식회사 | 인덕터 및 그 제조 방법 |
JP6000314B2 (ja) * | 2013-10-22 | 2016-09-28 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | チップ電子部品及びその製造方法 |
KR101565703B1 (ko) * | 2013-10-22 | 2015-11-03 | 삼성전기주식회사 | 칩 전자부품 및 그 제조방법 |
KR101474166B1 (ko) * | 2013-11-04 | 2014-12-17 | 삼성전기주식회사 | 칩 전자부품 및 그 제조방법 |
KR101942725B1 (ko) * | 2014-03-07 | 2019-01-28 | 삼성전기 주식회사 | 칩 전자부품 및 그 제조방법 |
KR102080660B1 (ko) * | 2014-03-18 | 2020-04-14 | 삼성전기주식회사 | 칩 전자부품 및 그 제조방법 |
KR20160102657A (ko) * | 2015-02-23 | 2016-08-31 | 삼성전기주식회사 | 칩 전자부품 및 그 제조방법 |
JP6716867B2 (ja) * | 2015-06-30 | 2020-07-01 | Tdk株式会社 | コイル部品およびその製造方法 |
KR101792388B1 (ko) * | 2016-01-28 | 2017-11-01 | 삼성전기주식회사 | 코일 부품 및 그 제조 방법 |
KR102450603B1 (ko) * | 2016-06-24 | 2022-10-07 | 삼성전기주식회사 | 박막 인덕터 및 그 제조방법 |
RU2735946C1 (ru) * | 2020-03-26 | 2020-11-11 | Михаил Леонидович Струпинский | Нагревательное устройство |
-
2015
- 2015-04-06 KR KR1020150048218A patent/KR101693749B1/ko active IP Right Grant
-
2016
- 2016-01-22 US US15/003,925 patent/US20160293320A1/en not_active Abandoned
- 2016-02-03 JP JP2016018995A patent/JP6657506B2/ja active Active
-
2018
- 2018-12-27 US US16/233,178 patent/US11769622B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20160293320A1 (en) | 2016-10-06 |
US11769622B2 (en) | 2023-09-26 |
JP2016197712A (ja) | 2016-11-24 |
US20190139696A1 (en) | 2019-05-09 |
KR20160119491A (ko) | 2016-10-14 |
KR101693749B1 (ko) | 2017-01-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6657506B2 (ja) | インダクタ素子及びその製造方法 | |
US9883592B2 (en) | Wiring board and method for manufacturing the same | |
KR101165116B1 (ko) | 소형 회로와 유도 소자 및 그 생산 방법 | |
KR101255953B1 (ko) | 적층형 공진 코일의 제조 방법 | |
US9119322B2 (en) | Wiring board and method for manufacturing the same | |
TWI466146B (zh) | 共模濾波器及其製造方法 | |
US10304620B2 (en) | Thin film type inductor and method of manufacturing the same | |
US10312007B2 (en) | Inductor formed in substrate | |
KR101862409B1 (ko) | 칩 인덕터 및 칩 인덕터 제조방법 | |
JP2007519219A (ja) | プリント回路基板製造用の軟磁性材料 | |
JP6504565B2 (ja) | コイル内蔵集積回路基板及びその製造方法 | |
US8729405B2 (en) | Wiring board and method for manufacturing the same | |
US20120314389A1 (en) | Wiring board and method for manufacturing same | |
JP6795137B2 (ja) | 電子素子内蔵型印刷回路基板の製造方法 | |
KR102064041B1 (ko) | 코일 부품 | |
JP2010087030A (ja) | コイル部品の製造方法およびコイル部品 | |
JP2013080846A (ja) | 配線板及びその製造方法 | |
KR20160004157A (ko) | 칩 내장형 기판 및 이의 제조 방법 | |
JP2004319875A (ja) | インダクタ内蔵型多層基板およびその製造方法 | |
TWI836197B (zh) | 建構螺線管電感器的方法及以其建構的螺線管電感器 | |
KR101912284B1 (ko) | 인덕터 제조방법 및 인덕터 | |
CN111244063B (zh) | 部件承载件及制造部件承载件的方法 | |
CN113133178B (zh) | 具有中心承载件和两个相反的层堆叠体的布置结构、部件承载件及制造方法 | |
JP2007184631A (ja) | 受動素子を備えた配線板の製造方法 | |
CN115376776A (zh) | 磁性嵌体、制造方法、部件承载件和调节电感的方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190129 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20191001 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190927 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20191219 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200107 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200110 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6657506 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |