JP6652124B2 - パターン形成方法 - Google Patents

パターン形成方法 Download PDF

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Publication number
JP6652124B2
JP6652124B2 JP2017503701A JP2017503701A JP6652124B2 JP 6652124 B2 JP6652124 B2 JP 6652124B2 JP 2017503701 A JP2017503701 A JP 2017503701A JP 2017503701 A JP2017503701 A JP 2017503701A JP 6652124 B2 JP6652124 B2 JP 6652124B2
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Japan
Prior art keywords
droplet
pattern
linear liquid
substrate
liquid
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JP2017503701A
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English (en)
Japanese (ja)
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JPWO2016140284A1 (ja
Inventor
直人 新妻
直人 新妻
大屋　秀信
秀信 大屋
正好 山内
正好 山内
小俣　猛憲
猛憲 小俣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta Inc
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Konica Minolta Inc
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Publication date
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Publication of JPWO2016140284A1 publication Critical patent/JPWO2016140284A1/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
JP2017503701A 2015-03-02 2016-03-02 パターン形成方法 Active JP6652124B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015040138 2015-03-02
JP2015040138 2015-03-02
PCT/JP2016/056489 WO2016140284A1 (ja) 2015-03-02 2016-03-02 パターン形成方法、透明導電膜付き基材、デバイス及び電子機器

Publications (2)

Publication Number Publication Date
JPWO2016140284A1 JPWO2016140284A1 (ja) 2017-12-14
JP6652124B2 true JP6652124B2 (ja) 2020-02-19

Family

ID=56848190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017503701A Active JP6652124B2 (ja) 2015-03-02 2016-03-02 パターン形成方法

Country Status (4)

Country Link
JP (1) JP6652124B2 (ko)
KR (1) KR102003625B1 (ko)
CN (1) CN107249759B (ko)
WO (1) WO2016140284A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6406078B2 (ja) * 2015-03-14 2018-10-17 コニカミノルタ株式会社 パターン形成装置及びパターン形成方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3580308B2 (ja) * 2002-04-19 2004-10-20 セイコーエプソン株式会社 デバイスの製造方法、デバイス及び電子機器
CN100409042C (zh) * 2002-04-19 2008-08-06 精工爱普生株式会社 器件的制造方法、器件以及电子机器
JP2004160449A (ja) * 2002-10-24 2004-06-10 Seiko Epson Corp デバイス製造装置及びデバイスの製造方法、電子機器
JP3966293B2 (ja) * 2003-03-11 2007-08-29 セイコーエプソン株式会社 パターンの形成方法及びデバイスの製造方法
US7296866B2 (en) * 2003-09-18 2007-11-20 Sony Corporation Ejection control device, liquid-ejecting apparatus, ejection control method, recording medium, and program
JP4325343B2 (ja) 2003-09-25 2009-09-02 セイコーエプソン株式会社 膜形成方法およびデバイス製造方法
JP4293043B2 (ja) * 2004-04-19 2009-07-08 セイコーエプソン株式会社 液滴吐出装置を用いた描画方法および液滴吐出装置、並びに電気光学装置の製造方法
JP4293042B2 (ja) * 2004-04-19 2009-07-08 セイコーエプソン株式会社 液滴吐出装置を用いた描画方法および液滴吐出装置、並びに電気光学装置の製造方法
JP4777078B2 (ja) * 2005-01-28 2011-09-21 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4501792B2 (ja) * 2005-06-23 2010-07-14 セイコーエプソン株式会社 成膜方法
JP4458075B2 (ja) * 2005-08-26 2010-04-28 セイコーエプソン株式会社 層形成方法、アクティブマトリクス基板の製造方法、および多層配線基板の製造方法
JP2009267206A (ja) * 2008-04-28 2009-11-12 Konica Minolta Holdings Inc 配線パターン形成方法
KR20120104565A (ko) 2009-11-02 2012-09-21 이슘 리서치 디벨롭먼트 컴퍼니 오브 더 히브루 유니버시티 오브 예루살렘, 엘티디. 광전자 소자 및 전자 소자용 전도성 투명 코팅제
JP6160040B2 (ja) 2012-08-20 2017-07-12 コニカミノルタ株式会社 導電性材料を含む平行線パターンの形成方法及び透明導電膜付き基材の形成方法
CN104584142B (zh) 2012-08-20 2018-04-03 柯尼卡美能达株式会社 包含导电性材料的平行线图案、平行线图案形成方法、带透明导电膜的基材、器件以及电子设备
JP6268769B2 (ja) * 2013-06-26 2018-01-31 コニカミノルタ株式会社 導電性細線の形成方法並びにこれに用いられる線及び基材
WO2015005457A1 (ja) * 2013-07-10 2015-01-15 コニカミノルタ株式会社 塗膜形成方法、透明導電膜付き基材、デバイス及び電子機器
WO2015111731A1 (ja) * 2014-01-24 2015-07-30 コニカミノルタ株式会社 パターン形成方法、透明導電膜付き基材、デバイス及び電子機器
JP6331457B2 (ja) * 2014-02-20 2018-05-30 コニカミノルタ株式会社 塗膜形成方法、透明導電膜付き基材、デバイス及び電子機器
KR101779738B1 (ko) * 2014-06-25 2017-09-18 코니카 미놀타 가부시키가이샤 패턴 형성 방법, 투명 도전막을 구비한 기재, 디바이스 및 전자 기기

Also Published As

Publication number Publication date
JPWO2016140284A1 (ja) 2017-12-14
WO2016140284A1 (ja) 2016-09-09
KR102003625B1 (ko) 2019-07-24
CN107249759B (zh) 2020-06-26
KR20170110111A (ko) 2017-10-10
CN107249759A (zh) 2017-10-13

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