JP6650841B2 - 基板昇降機構、基板載置台および基板処理装置 - Google Patents

基板昇降機構、基板載置台および基板処理装置 Download PDF

Info

Publication number
JP6650841B2
JP6650841B2 JP2016126599A JP2016126599A JP6650841B2 JP 6650841 B2 JP6650841 B2 JP 6650841B2 JP 2016126599 A JP2016126599 A JP 2016126599A JP 2016126599 A JP2016126599 A JP 2016126599A JP 6650841 B2 JP6650841 B2 JP 6650841B2
Authority
JP
Japan
Prior art keywords
substrate
mounting table
elevating
lifting
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016126599A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018006374A (ja
Inventor
伊藤　毅
毅 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2016126599A priority Critical patent/JP6650841B2/ja
Priority to KR1020170080365A priority patent/KR102002216B1/ko
Priority to CN201710499522.4A priority patent/CN107546171B/zh
Publication of JP2018006374A publication Critical patent/JP2018006374A/ja
Application granted granted Critical
Publication of JP6650841B2 publication Critical patent/JP6650841B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
JP2016126599A 2016-06-27 2016-06-27 基板昇降機構、基板載置台および基板処理装置 Active JP6650841B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2016126599A JP6650841B2 (ja) 2016-06-27 2016-06-27 基板昇降機構、基板載置台および基板処理装置
KR1020170080365A KR102002216B1 (ko) 2016-06-27 2017-06-26 기판 승강 기구, 기판 탑재대 및 기판 처리 장치
CN201710499522.4A CN107546171B (zh) 2016-06-27 2017-06-27 基板升降机构、基板载置台和基板处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016126599A JP6650841B2 (ja) 2016-06-27 2016-06-27 基板昇降機構、基板載置台および基板処理装置

Publications (2)

Publication Number Publication Date
JP2018006374A JP2018006374A (ja) 2018-01-11
JP6650841B2 true JP6650841B2 (ja) 2020-02-19

Family

ID=60949748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016126599A Active JP6650841B2 (ja) 2016-06-27 2016-06-27 基板昇降機構、基板載置台および基板処理装置

Country Status (3)

Country Link
JP (1) JP6650841B2 (ko)
KR (1) KR102002216B1 (ko)
CN (1) CN107546171B (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101987577B1 (ko) * 2018-01-24 2019-06-10 주식회사 기가레인 승강하는 유도부와 연동하는 배기조절부를 포함하는 기판 처리 장치
TW202013581A (zh) * 2018-05-23 2020-04-01 日商東京威力科創股份有限公司 電漿處理裝置
CN109192696B (zh) * 2018-08-10 2021-06-08 北京北方华创微电子装备有限公司 升降针系统、真空反应腔室以及半导体加工设备
JP7122907B2 (ja) * 2018-08-24 2022-08-22 東京エレクトロン株式会社 昇降装置、半導体製造装置の組立装置、半導体製造装置の組立方法
DE102018006903A1 (de) * 2018-08-30 2020-03-05 Vat Holding Ag Galvanisch getrennte Stifthubvorrichtung
CN109309041B (zh) * 2018-09-14 2020-12-11 惠科股份有限公司 基板处理装置及基板处理装置的调整方法
JP2020167288A (ja) * 2019-03-29 2020-10-08 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理装置のメンテナンス方法
DE102019006050A1 (de) * 2019-08-28 2021-03-04 Vat Holding Ag Stifthubvorrichtung mit Gleitführung
CN110610895A (zh) * 2019-09-29 2019-12-24 江苏鲁汶仪器有限公司 一种用于平台的弹簧顶针机构及真空等离子处理腔体
JP7446145B2 (ja) * 2020-04-07 2024-03-08 東京エレクトロン株式会社 基板処理装置
JP7450512B2 (ja) * 2020-10-07 2024-03-15 東京エレクトロン株式会社 基板処理方法及び基板処理装置
CN114496893B (zh) * 2020-10-23 2024-08-27 合肥欣奕华智能机器股份有限公司 一种基板夹紧装置及基板作业平台

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0774231A (ja) * 1993-08-31 1995-03-17 Tokyo Electron Ltd 処理装置及びその使用方法
JP4060941B2 (ja) 1998-05-26 2008-03-12 東京エレクトロン株式会社 プラズマ処理方法
JP4244555B2 (ja) * 2002-02-25 2009-03-25 東京エレクトロン株式会社 被処理体の支持機構
JP4354243B2 (ja) * 2003-04-21 2009-10-28 東京エレクトロン株式会社 被処理体の昇降機構及び処理装置
JP5025609B2 (ja) * 2003-09-04 2012-09-12 株式会社日立ハイテクノロジーズ 真空処理装置
JP4052472B2 (ja) * 2004-01-29 2008-02-27 三菱重工業株式会社 プラズマ処理装置及びそのメンテナンス方法
US20060281310A1 (en) * 2005-06-08 2006-12-14 Applied Materials, Inc. Rotating substrate support and methods of use
JP4836512B2 (ja) * 2005-07-29 2011-12-14 東京エレクトロン株式会社 基板昇降装置および基板処理装置
CN100477147C (zh) * 2006-03-16 2009-04-08 东京毅力科创株式会社 基板载置台及基板处理装置
JP4597894B2 (ja) 2006-03-31 2010-12-15 東京エレクトロン株式会社 基板載置台および基板処理装置
JP5141707B2 (ja) * 2010-03-24 2013-02-13 株式会社安川電機 被処理体の支持機構、支持方法およびそれを備えた搬送システム
KR101287831B1 (ko) * 2010-10-26 2013-07-18 주성엔지니어링(주) 기판 승강 장치
KR102092150B1 (ko) * 2013-08-30 2020-03-23 세메스 주식회사 기판처리장치 및 방법
JP6596362B2 (ja) * 2015-12-02 2019-10-23 東京エレクトロン株式会社 減圧された空間において被加工物を処理する処理装置

Also Published As

Publication number Publication date
CN107546171A (zh) 2018-01-05
JP2018006374A (ja) 2018-01-11
KR20180001495A (ko) 2018-01-04
CN107546171B (zh) 2021-01-19
KR102002216B1 (ko) 2019-07-19

Similar Documents

Publication Publication Date Title
JP6650841B2 (ja) 基板昇降機構、基板載置台および基板処理装置
KR100993441B1 (ko) 기판 탑재 기구, 기판 주고받음 방법, 기판 처리 장치 및 컴퓨터 판독 가능한 기억 매체
JP4597894B2 (ja) 基板載置台および基板処理装置
JP6369054B2 (ja) 基板載置装置及び基板処理装置
KR101035249B1 (ko) 기판 탑재대 및 기판 처리 장치
JP2008270721A (ja) 基板載置台及び基板処理装置
KR101760982B1 (ko) 기판 처리 방법 및 기판 처리 장치
CN111710641B (zh) 基片升降机构、基片支承器和基片处理装置
JP5141520B2 (ja) プラズマ処理装置
TWI785032B (zh) 基板處理裝置
KR101063127B1 (ko) 기판 처리 장치
JP6524536B2 (ja) プラズマ処理装置およびプラズマ処理方法
CN108878245B (zh) 闸阀装置和基板处理系统
KR20070011904A (ko) 리프트 핀 어셈블리 및 플라즈마 처리 장치
KR101256485B1 (ko) 기판처리장치의 공정챔버
JP7437985B2 (ja) 基板処理装置および基板処理方法
JPWO2005055298A1 (ja) プラズマ処理装置及びマルチチャンバシステム
JP2023012321A (ja) 部品の予熱処理方法、および基板処理装置
JP2023117038A (ja) 基板支持方法及び基板処理装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190228

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20191016

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20191029

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20191211

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20191224

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200121

R150 Certificate of patent or registration of utility model

Ref document number: 6650841

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250