JP6646778B1 - 導電性ボール搭載装置 - Google Patents
導電性ボール搭載装置 Download PDFInfo
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- 239000000758 substrate Substances 0.000 claims abstract description 73
- 230000004907 flux Effects 0.000 claims abstract description 8
- 238000000926 separation method Methods 0.000 claims description 15
- 238000007689 inspection Methods 0.000 claims description 14
- 239000012780 transparent material Substances 0.000 claims description 8
- 239000011148 porous material Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 13
- 238000010586 diagram Methods 0.000 abstract description 8
- 230000007547 defect Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000009466 transformation Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
10 基板
11 パッド
100 マスク
101 載置孔
200 支持プレート
210 第1吸着部材
201 発光部
300 載置部
400、410 保持部
411 第2吸着部材
500 移送ユニット
510 支持プレート移送部
520 基板移送部
530 保持部移送部
600 検査カメラ
Claims (13)
- 導電性ボールが搭載されるように設けられた多数の載置孔を備えるマスクと;
前記マスクの下面に接触して前記各載置孔の下部を塞いだ状態で前記マスクの変形を防止するように前記マスクを支持する支持プレートと;
前記マスクが前記支持プレートによって支持された状態で前記マスクの載置孔に前記導電性ボールを搭載する載置部と;
前記マスクの上面に接触して、前記マスクの各載置孔に搭載された導電性ボールが、前記載置孔に搭載された状態を維持するようにする保持部と;
前記保持部が、前記マスクの載置孔に導電性ボールが搭載された状態を維持した状態で、前記マスク、前記支持プレート、およびフラックスが塗布された基板のうちの少なくとも一つを移送して、前記マスクの下側に前記基板を配置させる移送ユニットと;
前記載置部、前記保持部および前記移送ユニットの作動を制御する制御部と;を含むことを特徴とする、導電性ボール搭載装置。 - 前記保持部は、静電気力によって、前記載置孔に搭載された状態の導電性ボールをクランプする静電チャックを備え、
前記制御部は、前記基板が前記マスクの下側に配置されると、前記保持部の静電チャックの作動を中止させて、前記載置孔に搭載された導電性ボールが前記基板に落ちるようにする、請求項1に記載の導電性ボール搭載装置。 - 前記保持部は、真空吸着によって、前記載置孔に搭載された状態の導電性ボールをクランプする多孔性材質の第2吸着部材を備え、
前記制御部は、前記基板が前記マスクの下側に配置されると、前記保持部の第2吸着部材の作動を中止させて、前記載置孔に搭載された導電性ボールが前記基板に落ちるようにする、請求項1に記載の導電性ボール搭載装置。 - 前記支持プレートは、前記載置孔に搭載された状態の導電性ボールを前記マスクの下面に接触した状態で吸着する多孔性材質の第1吸着部材を備え、
前記制御部は、前記保持部が前記マスクの上面に接触して作動する時またはその前に前記第1吸着部材の作動を中止させる、請求項1乃至3のいずれか一項に記載の導電性ボール搭載装置。 - 前記支持プレートの第1吸着部材は透明材質で形成される、請求項4に記載の導電性ボール搭載装置。
- 前記支持プレートは、前記マスクの下面に接触して前記マスクの載置孔に光を伝達することができる発光部を含む、請求項5に記載の導電性ボール搭載装置。
- 前記マスクの載置孔に前記導電性ボールがマウントされた状態を検査することができるように、前記マスクの上側から前記マスクを撮影する検査カメラ;をさらに含み、
前記制御部は、前記検査カメラで撮影した映像を用いて、前記マスクの載置孔に前記導電性ボールが搭載された状態を検査する、請求項6に記載の導電性ボール搭載装置。 - 前記保持部は、前記載置孔に搭載された前記導電性ボールが前記保持部に接触した状態となるように作動し、
前記制御部が前記保持部の作動を中止させたとき、前記導電性ボールが前記基板に落ちるように前記保持部から前記導電性ボールを分離する分離ユニット;をさらに含む、請求項1乃至3のいずれか一項に記載の導電性ボール搭載装置。 - 前記分離ユニットは、前記マスクと前記保持部との間に圧縮空気を噴射して前記導電性ボールを前記保持部から分離する、請求項8に記載の導電性ボール搭載装置。
- 前記分離ユニットは、前記マスクと前記保持部を水平方向に相手移動させて前記導電性ボールを前記保持部から分離する、請求項8に記載の導電性ボール搭載装置。
- 前記移送ユニットは、前記マスクに対して前記支持プレートを移送する支持プレート移送部と、前記マスクに対して前記基板を移送する基板移送部と、前記マスクに対して前記保持部を移送する保持部移送部とを備える、請求項1乃至3のいずれか一項に記載の導電性ボール搭載装置。
- 前記支持プレートは少なくとも一部分が透明材質で形成される、請求項1乃至3のいずれか一項に記載の導電性ボール搭載装置。
- 前記載置部は、チャンバーの内部に配置された多数の導電性ボールに圧縮空気を噴射して前記マスクの載置孔に前記導電性ボールを搭載させるサイクロンヘッドである、請求項1乃至3のいずれか一項に記載の導電性ボール搭載装置。
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KR1020180135515A KR102078935B1 (ko) | 2018-11-07 | 2018-11-07 | 도전성 볼 탑재 장치 |
KR10-2018-0135515 | 2018-11-07 |
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JP6646778B1 true JP6646778B1 (ja) | 2020-02-14 |
JP2020077835A JP2020077835A (ja) | 2020-05-21 |
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US (1) | US10804239B2 (ja) |
JP (1) | JP6646778B1 (ja) |
KR (1) | KR102078935B1 (ja) |
CN (1) | CN111162024B (ja) |
TW (1) | TWI702706B (ja) |
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US11247285B1 (en) * | 2020-04-03 | 2022-02-15 | Seagate Technology Llc | Fluidization of agglomerated solder microspheres |
KR20220005724A (ko) * | 2020-07-07 | 2022-01-14 | 주식회사 프로텍 | 가압식 구리 필러 기판 본딩 방법 |
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JPH088523A (ja) * | 1994-06-20 | 1996-01-12 | Mitsubishi Electric Corp | 整列装置 |
US20020106832A1 (en) * | 1996-11-26 | 2002-08-08 | Gregory B. Hotchkiss | Method and apparatus for attaching solder members to a substrate |
US5816481A (en) * | 1997-01-24 | 1998-10-06 | Unisys Corporation | Pin block method of dispensing solder flux onto the I/O pads of an integrated circuit package |
US5839191A (en) * | 1997-01-24 | 1998-11-24 | Unisys Corporation | Vibrating template method of placing solder balls on the I/O pads of an integrated circuit package |
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