JP6628010B2 - 封止用樹脂組成物および半導体装置 - Google Patents

封止用樹脂組成物および半導体装置 Download PDF

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Publication number
JP6628010B2
JP6628010B2 JP2019525037A JP2019525037A JP6628010B2 JP 6628010 B2 JP6628010 B2 JP 6628010B2 JP 2019525037 A JP2019525037 A JP 2019525037A JP 2019525037 A JP2019525037 A JP 2019525037A JP 6628010 B2 JP6628010 B2 JP 6628010B2
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Prior art keywords
resin composition
sealing
sealing resin
mass
content
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JP2019525037A
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Japanese (ja)
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JPWO2019078024A1 (ja
Inventor
洋史 黒田
洋史 黒田
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2019525037A 2017-10-16 2018-10-04 封止用樹脂組成物および半導体装置 Expired - Fee Related JP6628010B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017200110 2017-10-16
JP2017200110 2017-10-16
PCT/JP2018/037240 WO2019078024A1 (ja) 2017-10-16 2018-10-04 封止用樹脂組成物および半導体装置

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JPWO2019078024A1 JPWO2019078024A1 (ja) 2019-11-14
JP6628010B2 true JP6628010B2 (ja) 2020-01-08

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JP2019525037A Expired - Fee Related JP6628010B2 (ja) 2017-10-16 2018-10-04 封止用樹脂組成物および半導体装置

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Country Link
JP (1) JP6628010B2 (zh)
KR (1) KR102166183B1 (zh)
CN (1) CN111247206A (zh)
TW (1) TW201927895A (zh)
WO (1) WO2019078024A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7170240B2 (ja) * 2018-07-27 2022-11-14 パナソニックＩｐマネジメント株式会社 半導体封止用樹脂組成物、半導体装置、及び半導体装置の製造方法
JP7302300B2 (ja) * 2019-06-03 2023-07-04 住友ベークライト株式会社 封止樹脂組成物およびアルミニウム電解コンデンサ

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5959769A (ja) * 1982-09-29 1984-04-05 Meisei Chiyaachiru Kk 構造用接着剤
JPH0472360A (ja) * 1990-07-11 1992-03-06 Sumitomo Chem Co Ltd 半導体封止用熱硬化性樹脂組成物
JP2000007894A (ja) * 1998-06-24 2000-01-11 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2000169676A (ja) * 1998-12-03 2000-06-20 Sumitomo Bakelite Co Ltd エポキシ樹脂成形材料の製造方法及び半導体装置
JP2003337129A (ja) * 2002-05-17 2003-11-28 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物の選定方法及び該組成物中のカーボンブラック粗粒分の検出方法
JP5509514B2 (ja) 2005-11-21 2014-06-04 日立化成株式会社 封止用エポキシ樹脂成形材料及び電子部品装置
US20100222487A1 (en) * 2006-03-08 2010-09-02 Denki Kagaku Kogyo Kabushiki Kaisha Inorganic hollow powder, process for producing the inorganic hollow powder, and composition comprising the inorganic hollow powder
JP5275297B2 (ja) * 2010-07-28 2013-08-28 信越化学工業株式会社 液状エポキシ樹脂組成物及び該液状エポキシ樹脂組成物を硬化させた硬化物で封止された半導体装置
JP2012082281A (ja) * 2010-10-08 2012-04-26 Shin-Etsu Chemical Co Ltd 液状エポキシ樹脂組成物及び半導体装置
KR20120078174A (ko) * 2010-12-31 2012-07-10 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자
JP6066865B2 (ja) * 2013-08-15 2017-01-25 信越化学工業株式会社 高誘電率エポキシ樹脂組成物および半導体装置
JP6090614B2 (ja) * 2014-01-08 2017-03-08 信越化学工業株式会社 半導体封止用液状エポキシ樹脂組成物及び樹脂封止半導体装置
JP2017179185A (ja) * 2016-03-31 2017-10-05 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物および半導体装置
JP6724854B2 (ja) * 2017-04-26 2020-07-15 信越化学工業株式会社 熱硬化性エポキシ樹脂組成物
JP6772946B2 (ja) * 2017-04-26 2020-10-21 信越化学工業株式会社 低温硬化型液状エポキシ樹脂組成物

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Publication number Publication date
WO2019078024A1 (ja) 2019-04-25
KR102166183B1 (ko) 2020-10-15
CN111247206A (zh) 2020-06-05
TW201927895A (zh) 2019-07-16
JPWO2019078024A1 (ja) 2019-11-14
KR20200058566A (ko) 2020-05-27

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