JP6619014B2 - 検査接触装置 - Google Patents

検査接触装置 Download PDF

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Publication number
JP6619014B2
JP6619014B2 JP2017540958A JP2017540958A JP6619014B2 JP 6619014 B2 JP6619014 B2 JP 6619014B2 JP 2017540958 A JP2017540958 A JP 2017540958A JP 2017540958 A JP2017540958 A JP 2017540958A JP 6619014 B2 JP6619014 B2 JP 6619014B2
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JP
Japan
Prior art keywords
probe
hole
guide plate
intermediate plate
pin
Prior art date
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JP2017540958A
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English (en)
Japanese (ja)
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JP2017533446A (ja
Inventor
イル キム、
イル キム、
Original Assignee
イル キム、
イル キム、
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Priority claimed from KR1020150000357A external-priority patent/KR20160084014A/ko
Priority claimed from KR1020150003880A external-priority patent/KR101613810B1/ko
Priority claimed from KR1020150011727A external-priority patent/KR101662937B1/ko
Application filed by イル キム、, イル キム、 filed Critical イル キム、
Publication of JP2017533446A publication Critical patent/JP2017533446A/ja
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Publication of JP6619014B2 publication Critical patent/JP6619014B2/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2017540958A 2015-01-04 2015-12-24 検査接触装置 Active JP6619014B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
KR10-2015-0000357 2015-01-04
KR1020150000357A KR20160084014A (ko) 2015-01-04 2015-01-04 검사접촉장치
KR1020150003880A KR101613810B1 (ko) 2015-01-11 2015-01-11 검사접촉장치
KR10-2015-0003880 2015-01-11
KR1020150011727A KR101662937B1 (ko) 2015-01-25 2015-01-25 공간변형기능을 가진 검사접촉장치
KR10-2015-0011727 2015-01-25
PCT/KR2015/014262 WO2016108520A1 (ko) 2015-01-04 2015-12-24 검사접촉장치

Publications (2)

Publication Number Publication Date
JP2017533446A JP2017533446A (ja) 2017-11-09
JP6619014B2 true JP6619014B2 (ja) 2019-12-11

Family

ID=56284599

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017540958A Active JP6619014B2 (ja) 2015-01-04 2015-12-24 検査接触装置

Country Status (4)

Country Link
JP (1) JP6619014B2 (zh)
CN (1) CN107003335B (zh)
TW (1) TWI585416B (zh)
WO (1) WO2016108520A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6855185B2 (ja) * 2016-07-27 2021-04-07 株式会社日本マイクロニクス 電気的接続装置
JP2018179721A (ja) * 2017-04-12 2018-11-15 株式会社日本マイクロニクス 電気的接続装置
JP7148212B2 (ja) * 2017-04-27 2022-10-05 日本電産リード株式会社 検査治具、及び基板検査装置
TWI620938B (zh) * 2017-07-21 2018-04-11 中華精測科技股份有限公司 探針裝置
CN110568231A (zh) * 2018-06-06 2019-12-13 中华精测科技股份有限公司 探针卡装置及其立体式信号转接结构
TW202006366A (zh) * 2018-07-04 2020-02-01 旺矽科技股份有限公司 具有線型探針之探針頭
IT201800010071A1 (it) * 2018-11-06 2020-05-06 Technoprobe Spa Testa di misura a sonde verticali con migliorate proprietà di contatto con un dispositivo di test
IT201800021253A1 (it) * 2018-12-27 2020-06-27 Technoprobe Spa Testa di misura a sonde verticali avente un contatto perfezionato con un dispositivo da testare
TWI712802B (zh) * 2020-01-21 2020-12-11 中華精測科技股份有限公司 探針卡裝置及其類頸式探針
KR20210121553A (ko) * 2020-03-30 2021-10-08 (주)포인트엔지니어링 프로브 헤드 및 이를 포함하는 프로브 카드
CN111351970B (zh) * 2020-05-08 2022-05-10 沈阳圣仁电子科技有限公司 一种使多个探针具有均匀弹性的垂直探针卡
CN113707366B (zh) * 2020-05-20 2024-03-19 汉辰科技股份有限公司 馈通装置
CN113721051B (zh) * 2020-05-26 2023-12-01 旺矽科技股份有限公司 具有线型探针的探针头
JP7477393B2 (ja) 2020-08-03 2024-05-01 株式会社日本マイクロニクス 検査用接続装置
CN113030700B (zh) * 2021-03-04 2022-03-08 强一半导体（苏州）有限公司 一种晶圆级测试探针卡及晶圆级测试探针卡装配方法
EP4261547A1 (en) * 2022-04-12 2023-10-18 Microtest S.p.A. Testing head with vertical probes for a probe card and corresponding method of assembly

Family Cites Families (26)

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US4837507A (en) * 1984-06-08 1989-06-06 American Telephone And Telegraph Company At&T Technologies, Inc. High frequency in-circuit test fixture
US4622514A (en) * 1984-06-15 1986-11-11 Ibm Multiple mode buckling beam probe assembly
US4963822A (en) * 1988-06-01 1990-10-16 Manfred Prokopp Method of testing circuit boards and the like
DE3909284A1 (de) * 1989-03-21 1990-09-27 Nixdorf Computer Ag Steckkontaktanordnung
JP2972595B2 (ja) * 1996-09-25 1999-11-08 日本電気ファクトリエンジニアリング株式会社 プローブカード
US5945836A (en) * 1996-10-29 1999-08-31 Hewlett-Packard Company Loaded-board, guided-probe test fixture
EP0915344B1 (de) * 1997-11-05 2004-02-25 Feinmetall GmbH Prüfkopf für Mikrostrukturen mit Schnittstelle
JP2002202337A (ja) * 2001-01-04 2002-07-19 Takashi Nansai ファインピッチ基板検査用治具
JP2004347427A (ja) * 2003-05-21 2004-12-09 Innotech Corp プローブカード装置及びその製造方法
JP2005055368A (ja) * 2003-08-06 2005-03-03 Nidec-Read Corp 基板検査用治具及びこれを用いた基板検査装置
JP2005055343A (ja) * 2003-08-06 2005-03-03 Tokyo Cathode Laboratory Co Ltd フラットパネルディスプレイ検査用プローブ装置
TW200636250A (en) * 2003-10-13 2006-10-16 Technoprobe Spa Contact probe for a testing head having vertical probes for semiconductor integrated electronic devices
CN100343968C (zh) * 2004-04-09 2007-10-17 矽统科技股份有限公司 测试装置的探测头
DE102006005522A1 (de) * 2006-02-07 2007-08-16 Feinmetall Gmbh Elektrische Kontaktiervorrichtung sowie elektrisches Kontaktierverfahren
KR101306654B1 (ko) * 2006-12-11 2013-09-10 (주) 미코에스앤피 프로브 모듈 및 그 제조 방법, 상기 프로브 모듈을 갖는프로브 카드 및 그 제조 방법
KR20080100601A (ko) * 2007-05-14 2008-11-19 정영석 반도체 소자 테스트용 프로브 카드
JP4965341B2 (ja) * 2007-05-31 2012-07-04 日置電機株式会社 プローブユニットおよび回路基板検査装置
JP5222038B2 (ja) * 2008-06-20 2013-06-26 東京エレクトロン株式会社 プローブ装置
JP2010281583A (ja) * 2009-06-02 2010-12-16 Nidec-Read Corp 検査用治具
JP5323741B2 (ja) * 2010-02-19 2013-10-23 日置電機株式会社 プローブユニットおよび回路基板検査装置
JP5530312B2 (ja) * 2010-09-03 2014-06-25 株式会社エンプラス 電気部品用ソケット
KR101187421B1 (ko) * 2010-09-27 2012-10-02 주식회사 알에스에프 니들모듈 및 이를 포함하는 프로브카드
ITMI20110615A1 (it) * 2011-04-12 2012-10-13 Technoprobe Spa Testa di misura per un apparecchiatura di test di dispositivi elettronici
US8723538B2 (en) * 2011-06-17 2014-05-13 Taiwan Semiconductor Manufacturing Company, Ltd. Probe head formation methods employing guide plate raising assembly mechanism
KR101199016B1 (ko) * 2011-06-29 2012-11-08 주식회사 엔아이씨테크 엘이디 검사용 프로브 카드
KR101299715B1 (ko) * 2012-06-22 2013-08-28 디플러스(주) 양방향 좌굴핀을 이용한 검사용 소켓

Also Published As

Publication number Publication date
JP2017533446A (ja) 2017-11-09
CN107003335A (zh) 2017-08-01
WO2016108520A1 (ko) 2016-07-07
CN107003335B (zh) 2020-05-22
TW201629498A (zh) 2016-08-16
TWI585416B (zh) 2017-06-01

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