JP6611555B2 - プリント回路板及び電子機器 - Google Patents

プリント回路板及び電子機器 Download PDF

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Publication number
JP6611555B2
JP6611555B2 JP2015204852A JP2015204852A JP6611555B2 JP 6611555 B2 JP6611555 B2 JP 6611555B2 JP 2015204852 A JP2015204852 A JP 2015204852A JP 2015204852 A JP2015204852 A JP 2015204852A JP 6611555 B2 JP6611555 B2 JP 6611555B2
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Japan
Prior art keywords
power supply
ground
pattern
semiconductor device
terminal
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Expired - Fee Related
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JP2015204852A
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English (en)
Japanese (ja)
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JP2017076754A5 (enrdf_load_stackoverflow
JP2017076754A (ja
Inventor
貴志 沼生
浩之 山口
展輝 山下
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Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2015204852A priority Critical patent/JP6611555B2/ja
Priority to US14/944,540 priority patent/US9894751B2/en
Publication of JP2017076754A publication Critical patent/JP2017076754A/ja
Publication of JP2017076754A5 publication Critical patent/JP2017076754A5/ja
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Publication of JP6611555B2 publication Critical patent/JP6611555B2/ja
Expired - Fee Related legal-status Critical Current
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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
JP2015204852A 2014-11-20 2015-10-16 プリント回路板及び電子機器 Expired - Fee Related JP6611555B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2015204852A JP6611555B2 (ja) 2015-10-16 2015-10-16 プリント回路板及び電子機器
US14/944,540 US9894751B2 (en) 2014-11-20 2015-11-18 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015204852A JP6611555B2 (ja) 2015-10-16 2015-10-16 プリント回路板及び電子機器

Publications (3)

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JP2017076754A JP2017076754A (ja) 2017-04-20
JP2017076754A5 JP2017076754A5 (enrdf_load_stackoverflow) 2018-11-22
JP6611555B2 true JP6611555B2 (ja) 2019-11-27

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ID=58551560

Family Applications (1)

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JP2015204852A Expired - Fee Related JP6611555B2 (ja) 2014-11-20 2015-10-16 プリント回路板及び電子機器

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JP (1) JP6611555B2 (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6817906B2 (ja) * 2017-07-27 2021-01-20 京セラ株式会社 配線基板
JP7014486B2 (ja) * 2018-01-25 2022-02-01 株式会社デンソーテン 配線パターン構造及び電子機器
KR102262073B1 (ko) * 2018-07-26 2021-06-08 교세라 가부시키가이샤 배선 기판
JP7017995B2 (ja) * 2018-07-26 2022-02-09 京セラ株式会社 配線基板
WO2020165953A1 (ja) * 2019-02-12 2020-08-20 三菱電機株式会社 多層プリント基板
KR102302499B1 (ko) * 2020-12-03 2021-09-16 주식회사 기가레인 전원 전송 라인을 포함하는 연성회로기판

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6387845U (enrdf_load_stackoverflow) * 1986-11-26 1988-06-08
JP4657640B2 (ja) * 2004-07-21 2011-03-23 株式会社日立製作所 半導体装置
JP2006186286A (ja) * 2004-12-28 2006-07-13 Nec Toppan Circuit Solutions Inc 電子装置及び印刷配線板
JP6385074B2 (ja) * 2014-03-03 2018-09-05 キヤノン株式会社 プリント回路板及び電子機器

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JP2017076754A (ja) 2017-04-20

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