JP6608130B2 - 計測装置、リソグラフィ装置、及び物品の製造方法 - Google Patents
計測装置、リソグラフィ装置、及び物品の製造方法 Download PDFInfo
- Publication number
- JP6608130B2 JP6608130B2 JP2014226407A JP2014226407A JP6608130B2 JP 6608130 B2 JP6608130 B2 JP 6608130B2 JP 2014226407 A JP2014226407 A JP 2014226407A JP 2014226407 A JP2014226407 A JP 2014226407A JP 6608130 B2 JP6608130 B2 JP 6608130B2
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- JP
- Japan
- Prior art keywords
- mark
- substrate
- processing
- alignment
- alignment mark
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/0008—Industrial image inspection checking presence/absence
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/10—Segmentation; Edge detection
- G06T7/13—Edge detection
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
- G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
- G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/20—Image preprocessing
- G06V10/24—Aligning, centring, orientation detection or correction of the image
- G06V10/245—Aligning, centring, orientation detection or correction of the image by locating a pattern; Special marks for positioning
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/40—Extraction of image or video features
- G06V10/44—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V20/00—Scenes; Scene-specific elements
- G06V20/60—Type of objects
- G06V20/69—Microscopic objects, e.g. biological cells or cellular parts
- G06V20/693—Acquisition
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Multimedia (AREA)
- Quality & Reliability (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Biomedical Technology (AREA)
- General Health & Medical Sciences (AREA)
- Molecular Biology (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Signal Processing (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014226407A JP6608130B2 (ja) | 2014-11-06 | 2014-11-06 | 計測装置、リソグラフィ装置、及び物品の製造方法 |
| US14/923,695 US9984453B2 (en) | 2014-11-06 | 2015-10-27 | Measurement apparatus, lithography apparatus, and method of manufacturing article |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014226407A JP6608130B2 (ja) | 2014-11-06 | 2014-11-06 | 計測装置、リソグラフィ装置、及び物品の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016090444A JP2016090444A (ja) | 2016-05-23 |
| JP2016090444A5 JP2016090444A5 (enExample) | 2017-12-14 |
| JP6608130B2 true JP6608130B2 (ja) | 2019-11-20 |
Family
ID=55912151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014226407A Active JP6608130B2 (ja) | 2014-11-06 | 2014-11-06 | 計測装置、リソグラフィ装置、及び物品の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9984453B2 (enExample) |
| JP (1) | JP6608130B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108509913B (zh) * | 2018-03-30 | 2021-03-02 | 世纪美映影院技术服务(北京)有限公司 | 一种室内人数统计方法 |
| EP3667423B1 (en) * | 2018-11-30 | 2024-04-03 | Canon Kabushiki Kaisha | Lithography apparatus, determination method, and method of manufacturing an article |
| JP7353916B2 (ja) * | 2019-10-25 | 2023-10-02 | キヤノン株式会社 | 計測装置、リソグラフィ装置、及び物品の製造方法 |
| JP7461240B2 (ja) | 2020-07-22 | 2024-04-03 | 株式会社Screenホールディングス | 位置検出装置、描画システムおよび位置検出方法 |
| JP7786821B2 (ja) * | 2021-12-10 | 2025-12-16 | キヤノン株式会社 | 計測装置、リソグラフィ装置、および物品製造方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2745764B2 (ja) * | 1990-03-08 | 1998-04-28 | 松下電器産業株式会社 | 位置認識装置 |
| JP3399681B2 (ja) * | 1995-01-31 | 2003-04-21 | 松下電器産業株式会社 | 画像認識方法 |
| JPH08234226A (ja) * | 1995-02-28 | 1996-09-13 | Toshiba Corp | 液晶基板製造用画像処理装置 |
| JPH1022201A (ja) * | 1996-07-04 | 1998-01-23 | Nikon Corp | アライメントマーク検出装置 |
| JP2000260699A (ja) | 1999-03-09 | 2000-09-22 | Canon Inc | 位置検出装置及び該位置検出装置を用いた半導体露光装置 |
| AU5703900A (en) * | 1999-06-29 | 2001-01-31 | Nikon Corporation | Method and apparatus for detecting mark, exposure method and apparatus, and production method for device and device |
| JP2001274058A (ja) * | 2000-03-24 | 2001-10-05 | Nikon Corp | マーク検出方法、並びに露光方法及び露光装置 |
| US6891627B1 (en) * | 2000-09-20 | 2005-05-10 | Kla-Tencor Technologies Corp. | Methods and systems for determining a critical dimension and overlay of a specimen |
| DE10047211B4 (de) * | 2000-09-23 | 2007-03-22 | Leica Microsystems Semiconductor Gmbh | Verfahren und Vorrichtung zur Positionsbestimmung einer Kante eines Strukturelementes auf einem Substrat |
| JP2005116580A (ja) * | 2003-10-03 | 2005-04-28 | Nikon Corp | 位置検出装置及び方法、露光装置及び方法、並びにデバイス製造方法 |
| JP2005302970A (ja) * | 2004-04-09 | 2005-10-27 | Nikon Corp | レシピ作成方法、位置検出装置、および、位置ずれ検出装置 |
| JPWO2008139955A1 (ja) * | 2007-05-07 | 2010-08-05 | 株式会社目白プレシジョン | 投影露光方法、アライメント方法及び投影露光装置 |
| JP5691264B2 (ja) * | 2010-06-30 | 2015-04-01 | 凸版印刷株式会社 | 露光装置 |
| JP2012238650A (ja) * | 2011-05-10 | 2012-12-06 | Shibaura Mechatronics Corp | 位置合わせマークの位置認識装置及び位置認識方法、電子部品の実装装置 |
| JP2013007913A (ja) * | 2011-06-24 | 2013-01-10 | Hitachi High-Technologies Corp | Fpdモジュール組立装置及び表示基板の搬送方法 |
-
2014
- 2014-11-06 JP JP2014226407A patent/JP6608130B2/ja active Active
-
2015
- 2015-10-27 US US14/923,695 patent/US9984453B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016090444A (ja) | 2016-05-23 |
| US20160131982A1 (en) | 2016-05-12 |
| US9984453B2 (en) | 2018-05-29 |
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