JP6603991B2 - 温度センサ - Google Patents
温度センサ Download PDFInfo
- Publication number
- JP6603991B2 JP6603991B2 JP2015012947A JP2015012947A JP6603991B2 JP 6603991 B2 JP6603991 B2 JP 6603991B2 JP 2015012947 A JP2015012947 A JP 2015012947A JP 2015012947 A JP2015012947 A JP 2015012947A JP 6603991 B2 JP6603991 B2 JP 6603991B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- insulating film
- thermistor
- temperature sensor
- heat collecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000010408 film Substances 0.000 claims description 144
- 239000010409 thin film Substances 0.000 claims description 53
- 239000000463 material Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000009529 body temperature measurement Methods 0.000 description 13
- 230000001681 protective effect Effects 0.000 description 12
- 229920001721 polyimide Polymers 0.000 description 10
- 238000005259 measurement Methods 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 238000000059 patterning Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 230000004043 responsiveness Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229910004349 Ti-Al Inorganic materials 0.000 description 1
- 229910010037 TiAlN Inorganic materials 0.000 description 1
- 229910004692 Ti—Al Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Chemical group 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical group 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
Images
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Thermistors And Varistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015012947A JP6603991B2 (ja) | 2015-01-27 | 2015-01-27 | 温度センサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015012947A JP6603991B2 (ja) | 2015-01-27 | 2015-01-27 | 温度センサ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016138773A JP2016138773A (ja) | 2016-08-04 |
| JP2016138773A5 JP2016138773A5 (enrdf_load_stackoverflow) | 2018-02-01 |
| JP6603991B2 true JP6603991B2 (ja) | 2019-11-13 |
Family
ID=56559032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015012947A Active JP6603991B2 (ja) | 2015-01-27 | 2015-01-27 | 温度センサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6603991B2 (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7057937B2 (ja) * | 2018-01-12 | 2022-04-21 | 公立大学法人大阪 | フレキシブル温度センサ |
| WO2021020597A1 (ko) * | 2019-07-26 | 2021-02-04 | (주)인터플렉스 | 온도센서 및 이를 포함하는 발열구조물 |
| JP7716640B2 (ja) * | 2021-09-02 | 2025-08-01 | 三菱マテリアル株式会社 | 温度センサ |
| JP2024077876A (ja) | 2022-11-29 | 2024-06-10 | 三菱マテリアル株式会社 | 温度センサ |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3223716B2 (ja) * | 1994-08-30 | 2001-10-29 | 三菱マテリアル株式会社 | サーミスタセンサ |
| JPH08292102A (ja) * | 1995-04-20 | 1996-11-05 | Mitsubishi Materials Corp | 輻射センサ及びその製造方法 |
| JP4263274B2 (ja) * | 1998-09-01 | 2009-05-13 | 石塚電子株式会社 | 温度センサ |
| JP2000321149A (ja) * | 1999-05-10 | 2000-11-24 | Canon Inc | 温度検出ユニット |
| JP4633914B2 (ja) * | 2000-11-16 | 2011-02-16 | 株式会社芝浦電子 | 温度センサ |
| JP2008058370A (ja) * | 2006-08-29 | 2008-03-13 | Konica Minolta Business Technologies Inc | 温度検出装置、定着装置および画像形成装置 |
| JP5248360B2 (ja) * | 2009-02-10 | 2013-07-31 | 矢崎総業株式会社 | 温度検出用回路体構造 |
| JP5651930B2 (ja) * | 2009-06-02 | 2015-01-14 | 三菱マテリアル株式会社 | 温度センサ |
| JP5796718B2 (ja) * | 2012-03-29 | 2015-10-21 | 三菱マテリアル株式会社 | 温度センサ及びその製造方法 |
-
2015
- 2015-01-27 JP JP2015012947A patent/JP6603991B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016138773A (ja) | 2016-08-04 |
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