JP6603538B2 - リードフレーム及びその製造方法 - Google Patents

リードフレーム及びその製造方法 Download PDF

Info

Publication number
JP6603538B2
JP6603538B2 JP2015209349A JP2015209349A JP6603538B2 JP 6603538 B2 JP6603538 B2 JP 6603538B2 JP 2015209349 A JP2015209349 A JP 2015209349A JP 2015209349 A JP2015209349 A JP 2015209349A JP 6603538 B2 JP6603538 B2 JP 6603538B2
Authority
JP
Japan
Prior art keywords
outer frame
lead
frame portion
region
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015209349A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017084880A (ja
JP2017084880A5 (enExample
Inventor
真太郎 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2015209349A priority Critical patent/JP6603538B2/ja
Priority to US15/275,560 priority patent/US9793194B2/en
Priority to TW105132522A priority patent/TWI705543B/zh
Priority to CN201610883704.7A priority patent/CN106981470A/zh
Publication of JP2017084880A publication Critical patent/JP2017084880A/ja
Publication of JP2017084880A5 publication Critical patent/JP2017084880A5/ja
Application granted granted Critical
Publication of JP6603538B2 publication Critical patent/JP6603538B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/042—Etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/413—Insulating or insulated substrates serving as die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/438—Shapes or dispositions of side rails, e.g. having holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/142—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations exposing the passive side of the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
JP2015209349A 2015-10-23 2015-10-23 リードフレーム及びその製造方法 Active JP6603538B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015209349A JP6603538B2 (ja) 2015-10-23 2015-10-23 リードフレーム及びその製造方法
US15/275,560 US9793194B2 (en) 2015-10-23 2016-09-26 Leadframe
TW105132522A TWI705543B (zh) 2015-10-23 2016-10-07 引線架及其製造方法
CN201610883704.7A CN106981470A (zh) 2015-10-23 2016-10-10 引线架及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015209349A JP6603538B2 (ja) 2015-10-23 2015-10-23 リードフレーム及びその製造方法

Publications (3)

Publication Number Publication Date
JP2017084880A JP2017084880A (ja) 2017-05-18
JP2017084880A5 JP2017084880A5 (enExample) 2018-10-11
JP6603538B2 true JP6603538B2 (ja) 2019-11-06

Family

ID=58558967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015209349A Active JP6603538B2 (ja) 2015-10-23 2015-10-23 リードフレーム及びその製造方法

Country Status (4)

Country Link
US (1) US9793194B2 (enExample)
JP (1) JP6603538B2 (enExample)
CN (1) CN106981470A (enExample)
TW (1) TWI705543B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013215246A1 (de) * 2013-08-02 2015-02-05 Robert Bosch Gmbh Elektronikmodul mit Leiterplatten und anspritzbarem Kunststoff-Dichtring, insbesondere für ein Kfz-Getriebesteuergerät, und Verfahren zum Fertigen desselben
US10083888B2 (en) * 2015-11-19 2018-09-25 Advanced Semiconductor Engineering, Inc. Semiconductor device package
JP6798670B2 (ja) * 2017-02-08 2020-12-09 大口マテリアル株式会社 リードフレーム及びその製造方法
JP7182374B2 (ja) * 2017-05-15 2022-12-02 新光電気工業株式会社 リードフレーム及びその製造方法
JP2019083295A (ja) * 2017-10-31 2019-05-30 トヨタ自動車株式会社 半導体装置
DE102018130936B4 (de) * 2018-12-05 2022-08-11 Infineon Technologies Ag Halbleitergehäuse, Metallblech zur Anwendung in einem Halbleitergehäuse und Verfahren zum Herstellen eines Halbleitergehäuses
US11073572B2 (en) * 2019-01-17 2021-07-27 Infineon Technologies Ag Current sensor device with a routable molded lead frame
CN112750796A (zh) * 2019-10-30 2021-05-04 新光电气工业株式会社 半导体装置以及半导体装置的制造方法
JP7509584B2 (ja) 2020-06-12 2024-07-02 長華科技股▲ふん▼有限公司 リードフレーム
JP7506564B2 (ja) 2020-09-10 2024-06-26 新光電気工業株式会社 リードフレーム、半導体装置及びリードフレームの製造方法
US11715678B2 (en) * 2020-12-31 2023-08-01 Texas Instruments Incorporated Roughened conductive components
WO2022188071A1 (en) * 2021-03-10 2022-09-15 Innoscience (suzhou) Semiconductor Co., Ltd. Iii-nitride-based semiconductor packaged structure and method for manufacturing thereof
WO2023033126A1 (ja) 2021-09-03 2023-03-09 大日本印刷株式会社 リードフレーム及びその製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH079961B2 (ja) * 1988-05-25 1995-02-01 三菱電機株式会社 樹脂封止形半導体装置
JPH0621315A (ja) * 1992-07-02 1994-01-28 Seiko Epson Corp 半導体装置用リードフレーム及び、それを用いた半導体装置
JPH06260580A (ja) * 1993-03-09 1994-09-16 Hitachi Ltd リードフレームおよび前記リードフレームを使用した半導体装置
TW445601B (en) * 2000-01-17 2001-07-11 Chipmos Technologies Inc Die-embedded ball grid array packaging structure with leadframe
KR100369393B1 (ko) * 2001-03-27 2003-02-05 앰코 테크놀로지 코리아 주식회사 리드프레임 및 이를 이용한 반도체패키지와 그 제조 방법
TWI249833B (en) * 2004-10-06 2006-02-21 Airoha Tech Corp Active device base, leadframe utilizing the base, and fabrication method of the leadframe
JP4329678B2 (ja) * 2004-11-11 2009-09-09 株式会社デンソー 半導体装置に用いるリードフレームの製造方法
JP4857594B2 (ja) * 2005-04-26 2012-01-18 大日本印刷株式会社 回路部材、及び回路部材の製造方法
US20090146280A1 (en) * 2005-11-28 2009-06-11 Dai Nippon Printing Co., Ltd. Circuit member, manufacturing method of the circuit member, and semiconductor device including the circuit member
US7683463B2 (en) * 2007-04-19 2010-03-23 Fairchild Semiconductor Corporation Etched leadframe structure including recesses
TW200849521A (en) * 2007-06-06 2008-12-16 Advanced Semiconductor Eng Leadframe with die pad and leads corresponding there to
JP2010087129A (ja) * 2008-09-30 2010-04-15 Sanyo Electric Co Ltd 回路装置およびその製造方法
US8133759B2 (en) * 2009-04-28 2012-03-13 Macronix International Co., Ltd. Leadframe
TWI419289B (zh) * 2009-05-27 2013-12-11 Ｌｇ伊諾特股份有限公司 導線架及其製造方法
CN102237280A (zh) * 2010-04-23 2011-11-09 飞思卡尔半导体公司 包括锯切分割的组装半导体器件的方法
JP5613463B2 (ja) * 2010-06-03 2014-10-22 ルネサスエレクトロニクス株式会社 半導体装置及びその製造方法
JP6028454B2 (ja) 2012-08-24 2016-11-16 大日本印刷株式会社 半導体装置製造用リードフレーム及び半導体装置の製造方法
US20140346656A1 (en) * 2013-05-27 2014-11-27 Texas Instruments Incorporated Multilevel Leadframe

Also Published As

Publication number Publication date
TW201715679A (zh) 2017-05-01
JP2017084880A (ja) 2017-05-18
US20170117210A1 (en) 2017-04-27
CN106981470A (zh) 2017-07-25
TWI705543B (zh) 2020-09-21
US9793194B2 (en) 2017-10-17

Similar Documents

Publication Publication Date Title
JP6603538B2 (ja) リードフレーム及びその製造方法
JP6650723B2 (ja) リードフレーム及びその製造方法、半導体装置
US6674154B2 (en) Lead frame with multiple rows of external terminals
US6710430B2 (en) Resin-encapsulated semiconductor device and method for manufacturing the same
JP5613463B2 (ja) 半導体装置及びその製造方法
JP6576796B2 (ja) リードフレーム及びその製造方法、半導体装置
JP6357371B2 (ja) リードフレーム、半導体装置及びリードフレームの製造方法
JP6608672B2 (ja) 半導体装置及びその製造方法、リードフレーム及びその製造方法
JP6603169B2 (ja) 半導体装置の製造方法および半導体装置
TWI820314B (zh) 半導體元件搭載用基板
JP6774531B2 (ja) リードフレーム及びその製造方法
US8829685B2 (en) Circuit device having funnel shaped lead and method for manufacturing the same
JP2008113021A (ja) 半導体装置の製造方法
US12040260B2 (en) Electronic package with surface contact wire extensions
JP6083740B2 (ja) 半導体素子搭載用リードフレームの製造方法
JP2010010634A (ja) リードフレーム及び半導体装置の製造方法
JP2002026192A (ja) リードフレーム

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180820

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180820

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20190510

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190521

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190704

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20191001

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20191011

R150 Certificate of patent or registration of utility model

Ref document number: 6603538

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150