JP6598144B2 - 多層印刷回路基板の絶縁組成物 - Google Patents
多層印刷回路基板の絶縁組成物 Download PDFInfo
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- JP6598144B2 JP6598144B2 JP2013078274A JP2013078274A JP6598144B2 JP 6598144 B2 JP6598144 B2 JP 6598144B2 JP 2013078274 A JP2013078274 A JP 2013078274A JP 2013078274 A JP2013078274 A JP 2013078274A JP 6598144 B2 JP6598144 B2 JP 6598144B2
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- resin
- epoxy resin
- multilayer printed
- weight
- printed wiring
- Prior art date
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- 0 CC#CCCCC=*ClC Chemical compound CC#CCCCC=*ClC 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/56—Insulating bodies
- H01B17/62—Insulating-layers or insulating-films on metal bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/446—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylacetals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
<比較例1>
<比較例2>
<実施例1>
<実施例2>
<実験例1>:物性測定
<実施例3>
<実験例2>:物性測定
Claims (8)
- 多層プリント配線板の層間絶縁組成物であって、
ナフタレン変形エポキシ樹脂、クレゾールノボラック型エポキシ樹脂及びゴム変性エポキシ樹脂を含むエポキシ系樹脂と、
ポリビニルアセタール樹脂と、
硬化剤と、
無機充填剤と
を含み、
前記エポキシ系樹脂は、前記エポキシ系樹脂の100重量%を基準にして、
ナフタレン変形エポキシ樹脂30〜50重量%と、
クレゾールノボラック型エポキシ樹脂30〜50重量%と、
ゴム変性エポキシ樹脂10〜30重量%と
を含み、
前記ポリビニルアセタール樹脂は、前記多層プリント配線板の銅(Cu)とのキレート結合が可能な作用基を有し、
前記キレート結合が可能な作用基は、カルボキシル基と、カルボニル基及びエーテル基から選ばれるいずれか一つであり、
前記ポリビニルアセタール樹脂の重量平均分子量は、100,000以上であり、
前記キレート結合が可能な作用基は、前記ポリビニルアセタール樹脂内に0.1〜2mol%で含まれ、
前記無機充填剤は、エポキシ系樹脂と硬化剤樹脂とを合わせた含量100重量%を基準で30〜80重量%で含まれる、
多層プリント配線板の層間絶縁組成物。 - 前記ナフタレン変形エポキシ樹脂は、平均エポキシ当量が100〜500であり、
前記クレゾールノボラック型エポキシ樹脂は、平均エポキシ当量が200〜600であり、
前記ゴム変性エポキシ樹脂は、平均エポキシ当量が100〜500である、
請求項1に記載の多層プリント配線板の層間絶縁組成物。 - 前記ポリビニルアセタール樹脂は、エポキシ系樹脂と硬化剤樹脂とを合わせた含量の100重量部に対して、1〜20重量部で含まれる、
請求項1に記載の多層プリント配線板の層間絶縁組成物。 - フェノキシ樹脂、ポリイミド樹脂、ポリアミドイミド樹脂、ポリエーテルイミド樹脂、ポリサルフォン樹脂、ポリエーテルスルホン樹脂、ポリフェニレンエーテル樹脂、ポリカーボネート樹脂、ポリエーテルエーテルケトン樹脂、ポリエステル樹脂及びポリアセタール樹脂よりなる群から選ばれる少なくとも一つをさらに含む、
請求項1に記載の多層プリント配線板の層間絶縁組成物。 - 前記無機充填剤は、直径0.05〜5μmである、
請求項1に記載の多層プリント配線板の層間絶縁組成物。 - 前記無機充填剤は、天然シリカ、溶融シリカ、非晶質シリカ、中空シリカ、アルミニウムヒドロキシド、ベーマイト、マグネシウムヒドロキシド、酸化モリブデン、モリブデン酸亜鉛、ぼう酸亜鉛、すず酸塩亜鉛、ぼう酸アルミニウム、チタン酸カリウム、硫酸マグネシウム、炭化けい素、酸化亜鉛、窒化ホウ素、シリコンナイトライド、シリコンオキシド、チタン酸塩アルミニウム、チタン酸塩バリウム、チタン酸塩バリウムストロンチウム、酸化アルミニウム、アルミナ、粘土、カオリン、タルク、焼成された粘土、焼成されたカオリン、焼成されたタルク、マイカ、ガラス単繊維及びこれらの混合物よりなる群から選ばれる少なくとも一つである、
請求項1に記載の多層プリント配線板の層間絶縁組成物。 - 前記多層プリント配線板の層間絶縁組成物は、ポリウレタン樹脂、ポリブタジエン、ブタジエン−アクリロニトリル共重合体、ポリクロロプレン、ブタジエン−スチレン共重合体、ポリイソプレン、ブチルゴム、フッ素ゴム、天然ゴム、スチレン−イソプレンゴム、アクリルゴム、及びマレート化されたポリブタジエンよりなる群から選ばれる少なくとも一つをさらに含む、
請求項1に記載の多層プリント配線板の層間絶縁組成物。 - 前記硬化剤は、分子内の窒素の含量が6〜20重量%のアミノトリアジンノボラック系化合物である、
請求項7に記載の多層プリント配線板の層間絶縁組成物。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2012-0097617 | 2012-09-04 | ||
KR1020120097617A KR20140030890A (ko) | 2012-09-04 | 2012-09-04 | 다층 인쇄회로기판의 절연 조성물, 및 이를 절연층으로 포함하는 다층 인쇄회로기판 |
Publications (2)
Publication Number | Publication Date |
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JP2014051645A JP2014051645A (ja) | 2014-03-20 |
JP6598144B2 true JP6598144B2 (ja) | 2019-10-30 |
Family
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Application Number | Title | Priority Date | Filing Date |
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JP2013078274A Active JP6598144B2 (ja) | 2012-09-04 | 2013-04-04 | 多層印刷回路基板の絶縁組成物 |
Country Status (3)
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US (1) | US20140066544A1 (ja) |
JP (1) | JP6598144B2 (ja) |
KR (1) | KR20140030890A (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103897349A (zh) * | 2014-04-21 | 2014-07-02 | 江苏恒神纤维材料有限公司 | 新型的树脂混合工艺 |
CN104311832B (zh) * | 2014-09-11 | 2017-05-24 | 北京化工大学 | 一种聚醚砜型超支化环氧树脂的制备方法及其在增韧线性环氧树脂中的应用 |
JP6610928B2 (ja) * | 2015-08-13 | 2019-11-27 | 味の素株式会社 | 熱硬化性樹脂組成物 |
WO2019202762A1 (ja) * | 2018-04-20 | 2019-10-24 | Jnc株式会社 | プリプレグ、およびそれを用いた繊維強化複合材料 |
CN109762436B (zh) * | 2018-12-12 | 2021-04-13 | 苏州太湖电工新材料股份有限公司 | 一种适用于超导绝缘材料的耐低温导热绝缘树脂漆及其制备方法和应用 |
CN109517344B (zh) * | 2018-12-29 | 2021-03-16 | 江苏恒神股份有限公司 | 一种高模量高韧性环氧树脂 |
Family Cites Families (14)
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---|---|---|---|---|
WO1997002728A1 (en) * | 1995-07-04 | 1997-01-23 | Mitsui Mining & Smelting Co., Ltd. | Resin-coated copper foil for multilayer printed wiring board and multilayer printed wiring board provided with said copper foil |
JP3184485B2 (ja) * | 1997-11-06 | 2001-07-09 | 三井金属鉱業株式会社 | 銅張積層板用樹脂組成物、樹脂付き銅箔、多層銅張り積層板および多層プリント配線板 |
JP2006290997A (ja) * | 2005-04-08 | 2006-10-26 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物および該組成物を用いた接着シート並びに銅箔つき接着シート |
TWI457363B (zh) * | 2005-11-29 | 2014-10-21 | Ajinomoto Kk | 供多層印刷電路板之層間絕緣層用之樹脂組成物 |
JP4992396B2 (ja) * | 2005-11-29 | 2012-08-08 | 味の素株式会社 | 多層プリント配線板の層間絶縁層用樹脂組成物 |
JP2009091398A (ja) * | 2007-10-04 | 2009-04-30 | Showa Highpolymer Co Ltd | 樹脂付銅箔 |
TWI478810B (zh) * | 2008-03-25 | 2015-04-01 | Ajinomoto Kk | An insulating resin sheet, and a multilayer printed circuit board using the same |
JP5195454B2 (ja) * | 2009-01-22 | 2013-05-08 | 味の素株式会社 | 樹脂組成物 |
KR101228734B1 (ko) * | 2010-11-05 | 2013-02-01 | 삼성전기주식회사 | 다층배선기판용 난연성 수지 조성물 및 이를 포함하는 다층배선기판 |
KR101331646B1 (ko) * | 2012-06-14 | 2013-11-20 | 삼성전기주식회사 | 절연성 에폭시수지 조성물, 이로부터 제조된 절연필름 및 다층 인쇄회로기판 |
KR101388750B1 (ko) * | 2012-07-31 | 2014-04-25 | 삼성전기주식회사 | 인쇄회로기판용 에폭시 수지 조성물, 절연필름, 프리프레그 및 다층 인쇄회로기판 |
KR20140037645A (ko) * | 2012-09-19 | 2014-03-27 | 삼성전기주식회사 | 인쇄회로기판용 에폭시 수지 조성물, 절연필름, 프리프레그 및 다층 인쇄회로기판 |
KR20140066514A (ko) * | 2012-11-23 | 2014-06-02 | 삼성전기주식회사 | 인쇄회로기판용 수지 조성물, 절연필름, 프리프레그 및 인쇄회로기판 |
KR101987285B1 (ko) * | 2012-11-30 | 2019-06-10 | 삼성전기주식회사 | 인쇄회로기판용 수지 조성물, 절연필름, 프리프레그 및 인쇄회로기판 |
-
2012
- 2012-09-04 KR KR1020120097617A patent/KR20140030890A/ko not_active Application Discontinuation
-
2013
- 2013-03-13 US US13/800,465 patent/US20140066544A1/en not_active Abandoned
- 2013-04-04 JP JP2013078274A patent/JP6598144B2/ja active Active
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KR20140030890A (ko) | 2014-03-12 |
JP2014051645A (ja) | 2014-03-20 |
US20140066544A1 (en) | 2014-03-06 |
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