JP6595870B2 - 補正情報生成装置、描画装置、補正情報生成方法および描画方法 - Google Patents

補正情報生成装置、描画装置、補正情報生成方法および描画方法 Download PDF

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JP6595870B2
JP6595870B2 JP2015192920A JP2015192920A JP6595870B2 JP 6595870 B2 JP6595870 B2 JP 6595870B2 JP 2015192920 A JP2015192920 A JP 2015192920A JP 2015192920 A JP2015192920 A JP 2015192920A JP 6595870 B2 JP6595870 B2 JP 6595870B2
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Japan
Prior art keywords
mark
target
measurement
adjacent
target mark
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JP2015192920A
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Japanese (ja)
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JP2017068002A (ja
Inventor
清志 北村
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Priority to JP2015192920A priority Critical patent/JP6595870B2/ja
Priority to TW105122188A priority patent/TWI643247B/zh
Priority to KR1020160110816A priority patent/KR101836685B1/ko
Publication of JP2017068002A publication Critical patent/JP2017068002A/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/70—Adapting basic layout or design of masks to lithographic process requirements, e.g., second iteration correction of mask patterns for imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/72—Repair or correction of mask defects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2015192920A 2015-09-30 2015-09-30 補正情報生成装置、描画装置、補正情報生成方法および描画方法 Active JP6595870B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2015192920A JP6595870B2 (ja) 2015-09-30 2015-09-30 補正情報生成装置、描画装置、補正情報生成方法および描画方法
TW105122188A TWI643247B (zh) 2015-09-30 2016-07-14 補正資訊生成裝置、描繪裝置、補正資訊生成方法及描繪方法
KR1020160110816A KR101836685B1 (ko) 2015-09-30 2016-08-30 보정 정보 생성 장치, 묘화 장치, 보정 정보 생성 방법 및 묘화 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015192920A JP6595870B2 (ja) 2015-09-30 2015-09-30 補正情報生成装置、描画装置、補正情報生成方法および描画方法

Publications (2)

Publication Number Publication Date
JP2017068002A JP2017068002A (ja) 2017-04-06
JP6595870B2 true JP6595870B2 (ja) 2019-10-23

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Application Number Title Priority Date Filing Date
JP2015192920A Active JP6595870B2 (ja) 2015-09-30 2015-09-30 補正情報生成装置、描画装置、補正情報生成方法および描画方法

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Country Link
JP (1) JP6595870B2 (ko)
KR (1) KR101836685B1 (ko)
TW (1) TWI643247B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7027177B2 (ja) * 2018-01-22 2022-03-01 株式会社Ｓｃｒｅｅｎホールディングス 補正情報生成方法、描画方法、補正情報生成装置および描画装置
JP7204537B2 (ja) 2019-03-05 2023-01-16 キオクシア株式会社 基板貼合装置および半導体装置の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1048835A (ja) * 1996-08-06 1998-02-20 Ibiden Co Ltd プリント配線板の製造装置及び製造方法
JP4454706B2 (ja) * 1998-07-28 2010-04-21 キヤノン株式会社 電子ビーム露光方法及び装置、ならびにデバイス製造方法
US7068833B1 (en) * 2000-08-30 2006-06-27 Kla-Tencor Corporation Overlay marks, methods of overlay mark design and methods of overlay measurements
JP2002252157A (ja) * 2001-02-22 2002-09-06 Sony Corp マスク作製用部材およびその製造方法ならびにマスクおよびその製造方法ならびに露光方法ならびに半導体装置の製造方法
JP4299688B2 (ja) 2004-02-04 2009-07-22 パナソニック株式会社 基板検査方法及び基板検査装置
US7408618B2 (en) * 2005-06-30 2008-08-05 Asml Netherlands B.V. Lithographic apparatus substrate alignment
SG153747A1 (en) * 2007-12-13 2009-07-29 Asml Netherlands Bv Alignment method, alignment system and product with alignment mark
US7916295B2 (en) * 2008-09-03 2011-03-29 Macronix International Co., Ltd. Alignment mark and method of getting position reference for wafer
WO2011101187A1 (en) * 2010-02-19 2011-08-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2013058520A (ja) * 2011-09-07 2013-03-28 Dainippon Screen Mfg Co Ltd 描画装置、データ補正装置、再配線層の形成方法、および、データ補正方法

Also Published As

Publication number Publication date
KR101836685B1 (ko) 2018-03-08
TWI643247B (zh) 2018-12-01
TW201712732A (zh) 2017-04-01
KR20170038657A (ko) 2017-04-07
JP2017068002A (ja) 2017-04-06

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