JP6576409B2 - ポリイミドポリマー及びポリイミドフィルム - Google Patents
ポリイミドポリマー及びポリイミドフィルム Download PDFInfo
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- JP6576409B2 JP6576409B2 JP2017212386A JP2017212386A JP6576409B2 JP 6576409 B2 JP6576409 B2 JP 6576409B2 JP 2017212386 A JP2017212386 A JP 2017212386A JP 2017212386 A JP2017212386 A JP 2017212386A JP 6576409 B2 JP6576409 B2 JP 6576409B2
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- diamine
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- aromatic group
- dianhydride
- polyimide
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- 229920001721 polyimide Polymers 0.000 title claims description 66
- 239000004642 Polyimide Substances 0.000 title claims description 33
- 229920006254 polymer film Polymers 0.000 title description 2
- 150000004985 diamines Chemical class 0.000 claims description 56
- 125000003118 aryl group Chemical group 0.000 claims description 38
- 229920000642 polymer Polymers 0.000 claims description 31
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 25
- 239000000126 substance Substances 0.000 claims description 22
- 125000001931 aliphatic group Chemical group 0.000 claims description 20
- 125000000962 organic group Chemical group 0.000 claims description 20
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims description 13
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical group FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 claims description 9
- YGYCECQIOXZODZ-UHFFFAOYSA-N 4415-87-6 Chemical compound O=C1OC(=O)C2C1C1C(=O)OC(=O)C12 YGYCECQIOXZODZ-UHFFFAOYSA-N 0.000 claims description 7
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 7
- 229910052731 fluorine Inorganic materials 0.000 claims description 7
- 239000011737 fluorine Substances 0.000 claims description 7
- LJMPOXUWPWEILS-UHFFFAOYSA-N 3a,4,4a,7a,8,8a-hexahydrofuro[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1C2C(=O)OC(=O)C2CC2C(=O)OC(=O)C21 LJMPOXUWPWEILS-UHFFFAOYSA-N 0.000 claims description 6
- QVEIRZNRYOJFCL-UHFFFAOYSA-N 6053-46-9 Chemical compound O=C1OC(=O)C2CC1C1C2CC(=O)OC1=O QVEIRZNRYOJFCL-UHFFFAOYSA-N 0.000 claims description 6
- NUIURNJTPRWVAP-UHFFFAOYSA-N 3,3'-Dimethylbenzidine Chemical group C1=C(N)C(C)=CC(C=2C=C(C)C(N)=CC=2)=C1 NUIURNJTPRWVAP-UHFFFAOYSA-N 0.000 claims description 3
- MUGUJRSYUSHCBS-UHFFFAOYSA-N 3-(4-propylphenoxy)aniline Chemical compound C1=CC(CCC)=CC=C1OC1=CC=CC(N)=C1 MUGUJRSYUSHCBS-UHFFFAOYSA-N 0.000 claims description 3
- XTEBLARUAVEBRF-UHFFFAOYSA-N 4-(1,1,1,3,3,3-hexafluoropropan-2-yl)aniline Chemical compound NC1=CC=C(C(C(F)(F)F)C(F)(F)F)C=C1 XTEBLARUAVEBRF-UHFFFAOYSA-N 0.000 claims description 3
- QYIMZXITLDTULQ-UHFFFAOYSA-N 4-(4-amino-2-methylphenyl)-3-methylaniline Chemical group CC1=CC(N)=CC=C1C1=CC=C(N)C=C1C QYIMZXITLDTULQ-UHFFFAOYSA-N 0.000 claims description 3
- KWOIWTRRPFHBSI-UHFFFAOYSA-N 4-[2-[3-[2-(4-aminophenyl)propan-2-yl]phenyl]propan-2-yl]aniline Chemical compound C=1C=CC(C(C)(C)C=2C=CC(N)=CC=2)=CC=1C(C)(C)C1=CC=C(N)C=C1 KWOIWTRRPFHBSI-UHFFFAOYSA-N 0.000 claims description 3
- SSDBTLHMCVFQMS-UHFFFAOYSA-N 4-[4-(1,1,1,3,3,3-hexafluoropropan-2-yl)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C(C(F)(F)F)C(F)(F)F)C=C1 SSDBTLHMCVFQMS-UHFFFAOYSA-N 0.000 claims description 3
- LACZRKUWKHQVKS-UHFFFAOYSA-N 4-[4-[4-amino-2-(trifluoromethyl)phenoxy]phenoxy]-3-(trifluoromethyl)aniline Chemical compound FC(F)(F)C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1C(F)(F)F LACZRKUWKHQVKS-UHFFFAOYSA-N 0.000 claims description 3
- BKDVBBSUAGJUBA-UHFFFAOYSA-N bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic acid Chemical compound C1=CC2C(C(O)=O)C(C(=O)O)C1C(C(O)=O)C2C(O)=O BKDVBBSUAGJUBA-UHFFFAOYSA-N 0.000 claims description 3
- OLQWMCSSZKNOLQ-ZXZARUISSA-N (3s)-3-[(3r)-2,5-dioxooxolan-3-yl]oxolane-2,5-dione Chemical group O=C1OC(=O)C[C@H]1[C@@H]1C(=O)OC(=O)C1 OLQWMCSSZKNOLQ-ZXZARUISSA-N 0.000 claims description 2
- NHLGDELWVDRKBL-UHFFFAOYSA-N 4-[4-(1,1,1,3,3,3-hexafluoropropan-2-yl)phenoxy]-3-(trifluoromethyl)aniline Chemical compound NC1=CC(=C(OC2=CC=C(C=C2)C(C(F)(F)F)C(F)(F)F)C=C1)C(F)(F)F NHLGDELWVDRKBL-UHFFFAOYSA-N 0.000 claims description 2
- WOSVXXBNNCUXMT-UHFFFAOYSA-N cyclopentane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1CC(C(O)=O)C(C(O)=O)C1C(O)=O WOSVXXBNNCUXMT-UHFFFAOYSA-N 0.000 claims description 2
- 239000010408 film Substances 0.000 description 33
- 239000000178 monomer Substances 0.000 description 29
- 239000004952 Polyamide Substances 0.000 description 20
- 229920002647 polyamide Polymers 0.000 description 20
- 239000000463 material Substances 0.000 description 14
- 239000000243 solution Substances 0.000 description 13
- 229920005575 poly(amic acid) Polymers 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 10
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 239000009719 polyimide resin Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000011259 mixed solution Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYYUUQPLFHRZOY-UHFFFAOYSA-N 4-[2-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC=C1OC1=CC=C(N)C=C1 RYYUUQPLFHRZOY-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- NSGXIBWMJZWTPY-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropane Chemical compound FC(F)(F)CC(F)(F)F NSGXIBWMJZWTPY-UHFFFAOYSA-N 0.000 description 1
- -1 2-trifluoromethylphenoxy Chemical group 0.000 description 1
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 1
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 1
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 1
- LDFYRFKAYFZVNH-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenoxy]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 LDFYRFKAYFZVNH-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001244 carboxylic acid anhydrides Chemical group 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- RGSFGYAAUTVSQA-UHFFFAOYSA-N pentamethylene Natural products C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007363 ring formation reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
- C08G73/1078—Partially aromatic polyimides wholly aromatic in the diamino moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
- C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Description
前記芳香族基を有するジアミン由来の少なくとも1つの2価有機基は、フッ素含有芳香属基を有するジアミン由来の2価有機基、及び芳香族基及び脂肪族構造含有ジアミン由来の2価有機基の少なくとも1つを含み、
前記フッ素含有芳香族基を有するジアミンは、2,2’−ビス(トリフルオロメチル)−4,4’−ジアミノバイフェニル(TFMB)、4,4’−ジアミノ−2,2’−ビス(トリフルオロメチル)ジフェニルエーテル、1,4−ビス{4−アミノ−2−(トリフルオロメチル)フェノキシ}ベンゼン、2,2’−ビス{4−(4−アミノフェノキシ)フェニル}ヘキサフルオロプロパン、2,2’−ビス[4−(4−アミノ−2−トリフルオロメチルフェノキシ)−フェニル]ヘキサフルオロプロパン、あるいは2,2’−ビス(4−アミノフェニル)ヘキサフルオロプロパン、を含み、
前記芳香族基と前記脂肪族構造とを有するジアミンは、4,4’−ジアミノ−2,2’−ジメチルビフェニル(MTB)、4,4’−ジアミノ−3,3’−ジメチルビフェニル、2,2’−ビス[4−(3−アミノフェノキシ)フェニル]プロパン、あるいは4,4’−(1,3−フェニレンジイソプロピリデン)ビスアニリンを含む。
まず、実施例1乃至5及び比較例1のポリアミドフィルムを、それぞれ、長さ及び幅が5cm×5cmサイズのフィルム材料とした。次に、色成分b*及びYIを、分光光度計(コニカミノルタ社製のコニカ分光光度計CM−2300D)を用いて測定した。産業界において設定される基準では、0から3.5のb*の値は、ポリイミドフィルムが高い透明性及び低い黄色指数を有することを意味する。産業界において設定される基準でが、0から6.16のYIの値は、ポリイミドフィルムが低い黄色指数を有することを意味する。
まず、実施例1乃至5及び比較例1のポリアミドフィルムを、長さ及び幅が2mm×30mmサイズのフィルム材料とした。次に、フィルム材料は、熱機械分析器(TMA)(セイコーインスツル社製EXSTAR6000)を用いて窒素雰囲気及び温度上昇率10℃/分の条件で30℃から400℃まで加熱され、50℃から200℃の間における寸法変化量の平均値を算出してCTEを得た。産業界において設定される基準では、CTEは、好ましくは35ppm/℃以下である。
まず、実施例1乃至5及び比較例1のポリアミドフィルムを、長さ(ゲージ長)及び幅が25.4mm×3.2mmサイズで、ダンベル形状あるいはドッグボーン形状のフィルム材料とした。次に、フィルム材料の引張強度(MPa)、伸長性(%)及び弾性率(GPa)を、万能試験機(島津サイエンティフィックインスツルメント社製AG−1S)を用いて測定した。
Claims (5)
- 下記化学式1によって表される繰り返し単位を含むポリイミドポリマーであって、
下記化学式2以外の芳香族基を有するジアミン由来の少なくとも1つの2価有機基と、
を含み、
前記芳香族基を有するジアミン由来の少なくとも1つの2価有機基は、フッ素含有芳香属基を有するジアミン由来の2価有機基、及び芳香族基及び脂肪族構造含有ジアミン由来の2価有機基の少なくとも1つを含み、
前記フッ素含有芳香族基を有するジアミンは、2,2’−ビス(トリフルオロメチル)−4,4’−ジアミノバイフェニル(TFMB)、4,4’−ジアミノ−2,2’−ビス(トリフルオロメチル)ジフェニルエーテル、1,4−ビス{4−アミノ−2−(トリフルオロメチル)フェノキシ}ベンゼン、2,2’−ビス{4−(4−アミノフェノキシ)フェニル}ヘキサフルオロプロパン、2,2’−ビス[4−(4−アミノ−2−トリフルオロメチルフェノキシ)−フェニル]ヘキサフルオロプロパン、あるいは2,2’−ビス(4−アミノフェニル)ヘキサフルオロプロパン、を含み、
前記芳香族基と前記脂肪族構造とを有するジアミンは、4,4’−ジアミノ−2,2’−ジメチルビフェニル(MTB)、4,4’−ジアミノ−3,3’−ジメチルビフェニル、2,2’−ビス[4−(3−アミノフェノキシ)フェニル]プロパン、あるいは4,4’−(1,3−フェニレンジイソプロピリデン)ビスアニリンを含む、
ことを特徴とするポリイミドポリマー。 - 前記化学式2と、前記芳香族基を有するジアミン由来の少なくとも1つの2価有機基の総モル数に基づき、前記化学式2のモル百分率は、10%から35%である、ことを特徴とする請求項1に記載のポリイミドポリマー。
- 請求項1または2に記載のポリイミドポリマーを含有するポリイミドフィルム。
- CIEL*a*b*色空間に基づき、前記ポリイミドフィルムのb*の値は3.5未満である、ことを特徴とする請求項3に記載のポリイミドフィルム。
- 前記ポリイミドフィルムの伸長性が10%より大きい、ことを特徴とする請求項3または4に記載のポリイミドフィルム。
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