JP6552008B2 - ポリマー／窒化ホウ素化合物から生成される構成部品、かかる構成部品を生成するためのポリマー／窒化ホウ素化合物、及びそれらの使用 - Google Patents
ポリマー／窒化ホウ素化合物から生成される構成部品、かかる構成部品を生成するためのポリマー／窒化ホウ素化合物、及びそれらの使用 Download PDFInfo
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- JP6552008B2 JP6552008B2 JP2016520458A JP2016520458A JP6552008B2 JP 6552008 B2 JP6552008 B2 JP 6552008B2 JP 2016520458 A JP2016520458 A JP 2016520458A JP 2016520458 A JP2016520458 A JP 2016520458A JP 6552008 B2 JP6552008 B2 JP 6552008B2
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- Prior art keywords
- boron nitride
- polymer
- aggregates
- nitride
- thermal conductivity
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 18
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- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
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- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
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- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000012243 magnesium silicates Nutrition 0.000 description 1
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP13172870.1A EP2816083B1 (fr) | 2013-06-19 | 2013-06-19 | Elément fabriqué à partir d'un composé polymère - nitrure de bore, composé polymère - nitrure de bore pour la fabrication d'un tel élément et leur utilisation |
| EP13172870.1 | 2013-06-19 | ||
| PCT/EP2014/062797 WO2014202649A1 (fr) | 2013-06-19 | 2014-06-18 | Élément de composant produit à partir d'un composé polymère/nitrure de bore, composé polymère/nitrure de bore pour produire un tel élément de composant et son utilisation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016522298A JP2016522298A (ja) | 2016-07-28 |
| JP6552008B2 true JP6552008B2 (ja) | 2019-07-31 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016520458A Expired - Fee Related JP6552008B2 (ja) | 2013-06-19 | 2014-06-18 | ポリマー／窒化ホウ素化合物から生成される構成部品、かかる構成部品を生成するためのポリマー／窒化ホウ素化合物、及びそれらの使用 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20160145411A1 (fr) |
| EP (1) | EP2816083B1 (fr) |
| JP (1) | JP6552008B2 (fr) |
| KR (1) | KR102215273B1 (fr) |
| CN (1) | CN105579511B (fr) |
| TW (1) | TW201510016A (fr) |
| WO (1) | WO2014202649A1 (fr) |
Families Citing this family (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3029102A1 (fr) | 2014-12-05 | 2016-06-08 | Lanxess Elastomers B.V. | Composition de caoutchouc vulcanisable |
| EP3091047A1 (fr) * | 2015-05-07 | 2016-11-09 | Dupont Teijin Films U.S Limited Partnership | Film de polyester à isolation électrique et des propriétés de conduction de chaleur |
| EP3133103A1 (fr) * | 2015-08-21 | 2017-02-22 | LANXESS Deutschland GmbH | Compositions de polyamide |
| JP6581659B2 (ja) * | 2015-09-01 | 2019-09-25 | ポリプラスチックス株式会社 | カメラモジュール用液晶性樹脂組成物及びそれを用いたカメラモジュール |
| KR102033328B1 (ko) * | 2015-09-03 | 2019-10-17 | 쇼와 덴코 가부시키가이샤 | 육방정 질화붕소 분말, 그 제조 방법, 수지 조성물 및 수지 시트 |
| EP3359593B1 (fr) | 2015-10-09 | 2019-12-11 | INEOS Styrolution Group GmbH | Composition de résine à base de polymère thermoconducteur isolant basée sur des composés styréniques ayant des propriétés équilibrées |
| EP3359592B1 (fr) | 2015-10-09 | 2019-07-24 | INEOS Styrolution Group GmbH | Composition de résine à base de polymère conducteur électriquement et thermiquement basée sur des styréniques dotée de propriétés équilibrées |
| ES2769261T3 (es) | 2015-10-09 | 2020-06-25 | Ineos Styrolution Group Gmbh | Composición de resina termoconductora basada en compuestos estirénicos con baja densidad |
| DE102015219791A1 (de) | 2015-10-13 | 2017-04-13 | Siemens Aktiengesellschaft | Halbleitermodul, Stromrichter und Fahrzeug |
| JP6721692B2 (ja) | 2016-02-01 | 2020-07-15 | キャボット コーポレイションＣａｂｏｔ Ｃｏｒｐｏｒａｔｉｏｎ | カーボンブラックを含有する熱伝導性ポリマー組成物 |
| US9834713B2 (en) * | 2016-02-23 | 2017-12-05 | 3M Innovative Properties Company | Oriented thermally conductive dielectric film |
| WO2017147311A1 (fr) * | 2016-02-23 | 2017-08-31 | Advanced Environmental Recycling Technologies, Inc. | Compositions et procédés pour réduire la température de surface d'articles composites |
| DE102016105525A1 (de) * | 2016-03-24 | 2017-09-28 | Blanco Gmbh + Co Kg | Aushärtbare Gießmasse für die Herstellung von Kunststoffformteilen und deren Verwendung |
| JPWO2018070449A1 (ja) * | 2016-10-11 | 2019-08-15 | 株式会社ブリヂストン | ゴム組成物及びその製造方法、並びにタイヤ |
| JP6729898B2 (ja) * | 2016-12-28 | 2020-07-29 | 昭和電工株式会社 | 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート |
| CN106883618B (zh) * | 2017-02-23 | 2019-03-12 | 扬州亚光电缆有限公司 | 海工用耐海水高强度高电阻热塑性弹性体复合材料及其制备方法以及在防水软电缆中的应用 |
| TWI664159B (zh) * | 2017-04-28 | 2019-07-01 | 謝孟修 | 陶瓷散熱器及其製造方法 |
| DE102017215298A1 (de) * | 2017-09-01 | 2019-03-07 | Robert Bosch Gmbh | Verbundwerkstoff und Verfahren zu seiner Herstellung |
| TW201930437A (zh) | 2017-09-20 | 2019-08-01 | 德商艾朗希歐德意志有限公司 | 具有高導熱性之可硫化ｈｎｂｒ組成物 |
| CN107903441B (zh) * | 2017-11-14 | 2019-07-12 | 四川大学 | 一种提高聚合物击穿强度和储能密度的方法 |
| WO2019097445A1 (fr) * | 2017-11-16 | 2019-05-23 | 3M Innovative Properties Company | Composites à matrice polymère comprenant des particules thermoconductrices et procédés de fabrication associés |
| CN109988409B (zh) | 2017-12-29 | 2021-10-19 | 广东生益科技股份有限公司 | 一种氮化硼团聚体、包含其的热固性树脂组合物及其用途 |
| CN108483991A (zh) * | 2018-03-30 | 2018-09-04 | 南通通州湾新材料科技有限公司 | 一种纳米合晶瓷外观结构件及其制备方法和应用 |
| WO2019191541A1 (fr) * | 2018-03-30 | 2019-10-03 | Saint-Gobain Ceramics & Plastics, Inc. | Matériau particulaire et son procédé de formation |
| EP3647265A4 (fr) * | 2018-09-07 | 2020-09-16 | Showa Denko K.K. | Poudre de nitrure de bore hexagonal, son procédé de production, composition et matériau de dissipation de chaleur l'utilisant |
| JP2020053531A (ja) * | 2018-09-26 | 2020-04-02 | スリーエム イノベイティブ プロパティズ カンパニー | 熱伝導性シート前駆体、並びに該前駆体から得られる熱伝導性シート及びその製造方法 |
| US20220073698A1 (en) * | 2019-01-29 | 2022-03-10 | Denka Company Limited | Boron nitride powder and resin composition |
| CN110066115A (zh) * | 2019-04-16 | 2019-07-30 | 常州亚玛顿股份有限公司 | 一种增强太阳能光伏组件散热性能的彩色涂膜玻璃及制备方法 |
| EP3980494A1 (fr) * | 2019-06-07 | 2022-04-13 | Eaton Intelligent Power Limited | Polymères thermoconducteurs |
| KR20220038094A (ko) * | 2019-07-17 | 2022-03-25 | 티코나 엘엘씨 | 초음파 프로브 |
| KR20220133274A (ko) * | 2020-01-28 | 2022-10-04 | 도아고세이가부시키가이샤 | 실세스퀴옥산 유도체 및 그 이용 |
| CN111269530B (zh) * | 2020-04-03 | 2021-06-01 | 黑龙江英创新材料有限公司 | 一种聚醚醚酮基聚合物合金复合材料及其制备方法和应用 |
| CN111909498A (zh) * | 2020-07-31 | 2020-11-10 | 广东百汇达新材料有限公司 | 一种高导热smc及其制备方法 |
| RU2765849C1 (ru) * | 2021-04-07 | 2022-02-03 | Акционерное общество "Научно-исследовательский институт конструкционных материалов на основе графита "НИИграфит" | Способ получения теплорассеивающего анизотропного конструкционного диэлектрического композиционного материала и теплорассеивающий анизотропный конструкционный диэлектрический композиционный материал |
| JPWO2023038052A1 (fr) * | 2021-09-07 | 2023-03-16 | ||
| KR102705973B1 (ko) * | 2021-09-24 | 2024-09-10 | 코오롱이앤피 주식회사 | 절연 방열 및 저흡습용 폴리아미드 수지 조성물 및 이로 이루어진 성형품 |
| KR102408533B1 (ko) * | 2021-11-25 | 2022-06-14 | 주식회사 첨단랩 | 열계면 물질용 질화규소 충진제 제조 방법 |
| KR102672856B1 (ko) * | 2021-12-02 | 2024-06-07 | 한국전자기술연구원 | 분말혼합방식을 이용한 연성인쇄회로기판용 저유전 고방열 필름 조성물 및 그의 제조방법 |
| CN115124831B (zh) * | 2022-07-22 | 2024-02-02 | 义乌华鼎锦纶股份有限公司 | 一种凉感尼龙共混物及其应用 |
| CN115521736B (zh) * | 2022-10-28 | 2023-05-12 | 江苏鸿佳电子科技有限公司 | 一种led封装用复合膜及其制备方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6048919A (en) * | 1999-01-29 | 2000-04-11 | Chip Coolers, Inc. | Thermally conductive composite material |
| US7976941B2 (en) * | 1999-08-31 | 2011-07-12 | Momentive Performance Materials Inc. | Boron nitride particles of spherical geometry and process for making thereof |
| CN101035876A (zh) * | 2004-08-23 | 2007-09-12 | 莫门蒂夫性能材料股份有限公司 | 导热性组合物及其制备方法 |
| US8999023B2 (en) * | 2006-06-12 | 2015-04-07 | Sumitomo Electric Hardmetal Corp. | Composite sintered body |
| JP2010001402A (ja) * | 2008-06-20 | 2010-01-07 | Kaneka Corp | 高熱伝導性樹脂成形体 |
| KR101737592B1 (ko) * | 2010-04-07 | 2017-05-18 | 덴카 주식회사 | Led조명 하우징용 방열성 수지 조성물 및 그 led조명용 방열성 하우징 |
| CN103154133B (zh) * | 2010-10-13 | 2015-03-11 | 株式会社钟化 | 高导热性树脂成形体及其制造方法 |
| DE102010050900A1 (de) * | 2010-11-10 | 2012-05-10 | Esk Ceramics Gmbh & Co. Kg | Bornitrid-Agglomerate, Verfahren zu deren Herstellung und deren Verwendung |
| DE102011114413A1 (de) * | 2011-09-26 | 2013-03-28 | Esk Ceramics Gmbh & Co. Kg | Hydrodynamisches Axiallager |
| DE102012104049A1 (de) * | 2012-05-09 | 2013-11-28 | Esk Ceramics Gmbh & Co. Kg | Bornitrid-Agglomerate, Verfahren zu deren Herstellung und deren Verwendung |
| US20140080954A1 (en) * | 2012-09-19 | 2014-03-20 | Chandrashekar Raman | Methods for making thermally conductve compositions containing boron nitride |
| US20140080951A1 (en) * | 2012-09-19 | 2014-03-20 | Chandrashekar Raman | Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics |
| US20150259589A1 (en) * | 2012-11-21 | 2015-09-17 | Takagi Chemicals, Inc. | Highly filled high thermal conductive material, method for manufacturing same, composition, coating liquid and molded article |
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2013
- 2013-06-19 EP EP13172870.1A patent/EP2816083B1/fr not_active Not-in-force
-
2014
- 2014-06-18 US US14/899,741 patent/US20160145411A1/en not_active Abandoned
- 2014-06-18 JP JP2016520458A patent/JP6552008B2/ja not_active Expired - Fee Related
- 2014-06-18 CN CN201480035320.9A patent/CN105579511B/zh not_active Expired - Fee Related
- 2014-06-18 KR KR1020167001135A patent/KR102215273B1/ko active IP Right Grant
- 2014-06-18 TW TW103121083A patent/TW201510016A/zh unknown
- 2014-06-18 WO PCT/EP2014/062797 patent/WO2014202649A1/fr active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016522298A (ja) | 2016-07-28 |
| KR102215273B1 (ko) | 2021-02-15 |
| EP2816083A1 (fr) | 2014-12-24 |
| WO2014202649A1 (fr) | 2014-12-24 |
| US20160145411A1 (en) | 2016-05-26 |
| EP2816083B1 (fr) | 2019-02-20 |
| CN105579511A (zh) | 2016-05-11 |
| CN105579511B (zh) | 2018-11-09 |
| TW201510016A (zh) | 2015-03-16 |
| KR20160021832A (ko) | 2016-02-26 |
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