JPWO2023038052A1 - - Google Patents

Info

Publication number
JPWO2023038052A1
JPWO2023038052A1 JP2023546963A JP2023546963A JPWO2023038052A1 JP WO2023038052 A1 JPWO2023038052 A1 JP WO2023038052A1 JP 2023546963 A JP2023546963 A JP 2023546963A JP 2023546963 A JP2023546963 A JP 2023546963A JP WO2023038052 A1 JPWO2023038052 A1 JP WO2023038052A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023546963A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023038052A1 publication Critical patent/JPWO2023038052A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2023546963A 2021-09-07 2022-09-07 Pending JPWO2023038052A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021145364 2021-09-07
PCT/JP2022/033525 WO2023038052A1 (fr) 2021-09-07 2022-09-07 Feuille de rayonnement de chaleur

Publications (1)

Publication Number Publication Date
JPWO2023038052A1 true JPWO2023038052A1 (fr) 2023-03-16

Family

ID=85506358

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023546963A Pending JPWO2023038052A1 (fr) 2021-09-07 2022-09-07

Country Status (2)

Country Link
JP (1) JPWO2023038052A1 (fr)
WO (1) WO2023038052A1 (fr)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5781412A (en) * 1996-11-22 1998-07-14 Parker-Hannifin Corporation Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size
EP2816083B1 (fr) * 2013-06-19 2019-02-20 3M Innovative Properties Company Elément fabriqué à partir d'un composé polymère - nitrure de bore, composé polymère - nitrure de bore pour la fabrication d'un tel élément et leur utilisation
JP5719887B2 (ja) * 2013-07-31 2015-05-20 住友理工株式会社 エラストマー成形体およびその製造方法
CN106916450A (zh) * 2015-12-24 2017-07-04 北京中石伟业科技股份有限公司 一种电磁吸波导热组合物及电磁吸波导热垫片
JP6200119B1 (ja) * 2016-02-01 2017-09-20 バンドー化学株式会社 熱伝導性樹脂成形品
JP2020053531A (ja) * 2018-09-26 2020-04-02 スリーエム イノベイティブ プロパティズ カンパニー 熱伝導性シート前駆体、並びに該前駆体から得られる熱伝導性シート及びその製造方法

Also Published As

Publication number Publication date
WO2023038052A1 (fr) 2023-03-16

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Legal Events

Date Code Title Description
AA64 Notification of invalidation of claim of internal priority (with term)

Free format text: JAPANESE INTERMEDIATE CODE: A241764

Effective date: 20240528

A521 Request for written amendment filed

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Effective date: 20240626