JP6539355B2 - 基板収納容器 - Google Patents
基板収納容器 Download PDFInfo
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- JP6539355B2 JP6539355B2 JP2017552602A JP2017552602A JP6539355B2 JP 6539355 B2 JP6539355 B2 JP 6539355B2 JP 2017552602 A JP2017552602 A JP 2017552602A JP 2017552602 A JP2017552602 A JP 2017552602A JP 6539355 B2 JP6539355 B2 JP 6539355B2
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- 239000000758 substrate Substances 0.000 title claims description 138
- 230000002093 peripheral effect Effects 0.000 claims description 56
- 238000007789 sealing Methods 0.000 claims description 32
- 229920001973 fluoroelastomer Polymers 0.000 claims description 5
- 239000007789 gas Substances 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 5
- 238000010926 purge Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67376—Closed carriers characterised by sealing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
図1は、本発明の第1実施形態に係る基板収納容器1に基板Wが収納された様子を示す分解斜視図である。図2は、本発明の第1実施形態に係る基板収納容器1の容器本体開口部21が閉塞される前のシール部材4と、蓋体3と、開口周縁部28とを示す拡大断面図である。図3は、本発明の第1実施形態に係る基板収納容器1の容器本体開口部21が閉塞されたときのシール部材4と、蓋体3と、開口周縁部28とを示す拡大断面図である。
図1に示すように、容器本体2の壁部20は、奥壁22と上壁23と下壁24と第1側壁25と第2側壁26とを有する。奥壁22、上壁23、下壁24、第1側壁25、及び第2側壁26は、上述した材料により構成されており、一体成形されて構成されている。
先ず、蓋体3の内面301を基板収納空間27に対向させ、前後方向D1で見て蓋体3を容器本体開口部21に一致する位置関係とさせる。そして、図2に示すように、蓋体3を後方向D12へ移動させて容器本体開口部21へ近づけてゆき、シール部材4の容器当接先端部43の本体当接部431を開口周縁部28に当接させる。
上述のように基板収納容器1は、一端部に容器本体開口部21が形成された開口周縁部28を有し、他端部が閉塞された筒状の壁部20を備え、壁部20の内面によって、複数の基板Wを収納可能であり容器本体開口部21に連通する基板収納空間27が形成された容器本体2と、容器本体開口部21に対して着脱可能であり、シール部材取付部303を有し、容器本体開口部21を閉塞可能な蓋体3と、蓋体3のシール部材取付部303に取り付けられ、開口周縁部28に当接可能であり、開口周縁部28と蓋体3との間に介在して開口周縁部28に密着して当接することにより、蓋体3と共に容器本体開口部21を気密状態で閉塞するシール部材4と、を備える。
シール部材4は、シール部材取付部303に固定される基部41と、開口周縁部28に当接する本体当接部431を有する容器当接先端部43と、基部41と容器当接先端部43とを連結し、基部41に対して容器当接先端部43を揺動可能に弾性変形可能な基部側変形部42と、基部側変形部42に接続されている容器当接先端部43の部分に存在し、容器当接先端部43の外面から突出する突起部44と、を有する。容器当接先端部43の揺動方向において、容器当接先端部43の厚さは、基部側変形部42の厚さよりも厚く構成されている。
例えば、基部側変形部42の厚さは、基部41に接続されている基部側変形部42の基端部から容器当接先端部43に接続されている先端側の端部に至るまで、一定であったが、これに限定されない。容器当接先端部の揺動方向において、容器当接先端部の厚さは、少なくとも基部側変形部の一部の厚さよりも厚く構成されていてもよい。従って、例えば、基部側変形部は、蓋体の周方向に直交する断面において、部分的に厚い部分や薄い部分を有していてもよい。
2 容器本体
3 蓋体
4、4A シール部材
7 溝部材(当接部)
20 壁部
21 容器本体開口部
27 基板収納空間
28 開口周縁部
41 基部
42 基部側変形部
43、43A 容器当接先端部
44 突起部
303 シール部材取付部
431、431A 本体当接部
432 屈曲部
W 基板
a 容器当接先端部の厚さ
b 基部側変形部の厚さ
Claims (4)
- 一端部に容器本体開口部が形成された開口周縁部を有し、他端部が閉塞された筒状の壁部を備え、前記壁部の内面によって、複数の基板を収納可能であり前記容器本体開口部に連通する基板収納空間が形成された容器本体と、
前記容器本体開口部に対して着脱可能であり、シール部材取付部を有し、前記容器本体開口部を閉塞可能な蓋体と、
前記蓋体の前記シール部材取付部に取り付けられ、前記開口周縁部に当接可能であり、前記開口周縁部と前記蓋体との間に介在して前記開口周縁部に密着して当接することにより、前記蓋体と共に前記容器本体開口部を気密状態で閉塞するシール部材と、を備え、
前記シール部材は、
前記シール部材取付部に固定される基部と、
前記開口周縁部に当接する本体当接部を有する容器当接先端部と、
前記基部と前記容器当接先端部とを連結し、前記基部に対して前記容器当接先端部を揺動可能に弾性変形可能な基部側変形部と、
前記基部側変形部には存在しておらず、前記基部側変形部に接続されている前記容器当接先端部の部分に存在し、前記容器当接先端部の外面から突出する突起部と、を有し、
前記容器当接先端部の揺動方向において、前記容器当接先端部及び前記基部の厚さは、前記基部側変形部の厚さよりも厚く構成され、前記基部側変形部は、前記基部と前記容器当接先端部との間の、前記基部及び前記容器当接先端部よりも薄い部分により構成されている基板収納容器。 - 前記容器当接先端部の揺動方向において、前記容器当接先端部の厚さは、少なくとも前記基部側変形部の一部の厚さよりも厚く構成されている請求項1に記載の基板収納容器。
- 前記容器当接先端部は、前記突起部から前記本体当接部へ向った所定の部分において、前記本体当接部が当接する前記開口周縁部の部分へ向って屈曲する屈曲部を有する、請求項1又は請求項2に記載の基板収納容器。
- 前記シール部材は、フッ素ゴムにより構成されている、請求項1〜請求項3のいずれかに記載の基板収納容器。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2015/083188 WO2017090143A1 (ja) | 2015-11-26 | 2015-11-26 | 基板収納容器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2017090143A1 JPWO2017090143A1 (ja) | 2018-09-27 |
JP6539355B2 true JP6539355B2 (ja) | 2019-07-03 |
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Application Number | Title | Priority Date | Filing Date |
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JP2017552602A Active JP6539355B2 (ja) | 2015-11-26 | 2015-11-26 | 基板収納容器 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10985043B2 (ja) |
JP (1) | JP6539355B2 (ja) |
KR (1) | KR102430081B1 (ja) |
CN (1) | CN108292618B (ja) |
TW (1) | TWI760317B (ja) |
WO (1) | WO2017090143A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11538703B2 (en) * | 2017-02-06 | 2022-12-27 | Achilles Corporation | Substrate housing container |
JP7069475B2 (ja) * | 2017-08-10 | 2022-05-18 | 信越ポリマー株式会社 | 基板収納容器及びその製造方法 |
JP2023546060A (ja) * | 2020-10-13 | 2023-11-01 | インテグリス・インコーポレーテッド | 容器用の一体型シール |
JP7383712B2 (ja) * | 2020-10-23 | 2023-11-20 | ミライアル株式会社 | 基板収納容器及びその製造方法並びにフィルタ部 |
JP2024524063A (ja) * | 2021-06-14 | 2024-07-05 | インテグリス・インコーポレーテッド | 扉ガスケットを有する基板容器 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
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US5112065A (en) * | 1991-03-14 | 1992-05-12 | Westinghouse Electric Corp. | Double directional gasket |
US6354601B1 (en) * | 1999-01-06 | 2002-03-12 | Fluoroware, Inc. | Seal for wafer containers |
JP3556185B2 (ja) * | 2000-06-13 | 2004-08-18 | 信越ポリマー株式会社 | シール部材、密封容器及びそのシール方法 |
US7413099B2 (en) * | 2001-06-08 | 2008-08-19 | Shin-Etsu Polymer Co., Ltd. | Sealing element with a protruding part approximately obliquely outward and a hermetic container using the same |
WO2003042059A1 (en) | 2001-11-14 | 2003-05-22 | Entegris, Inc. | Wafer enclosure sealing arrangement for wafer containers |
JP4664610B2 (ja) * | 2004-03-11 | 2011-04-06 | ミライアル株式会社 | シール部材 |
JP4482655B2 (ja) * | 2005-04-22 | 2010-06-16 | ゴールド工業株式会社 | 精密基板収納容器のガスケット |
JP2007062804A (ja) | 2005-08-31 | 2007-03-15 | Miraial Kk | シール部材 |
CN101823604B (zh) * | 2006-05-29 | 2012-06-27 | 信越聚合物株式会社 | 基板收纳容器 |
JP5264555B2 (ja) * | 2008-03-06 | 2013-08-14 | キヤノン株式会社 | 走査光学装置 |
US8899443B2 (en) * | 2008-12-15 | 2014-12-02 | Wki Holding Company, Inc. | Container assembly with flexible seal |
JP5281697B2 (ja) * | 2010-01-26 | 2013-09-04 | ミライアル株式会社 | 半導体ウエハ収納容器 |
JP5713875B2 (ja) * | 2011-11-15 | 2015-05-07 | 信越ポリマー株式会社 | 基板収納容器 |
JP5888492B2 (ja) | 2011-12-02 | 2016-03-22 | 信越ポリマー株式会社 | 基板収納容器 |
JP5240594B1 (ja) * | 2012-04-12 | 2013-07-17 | Nok株式会社 | ガスケット |
JP2015521377A (ja) * | 2012-05-04 | 2015-07-27 | インテグリス・インコーポレーテッド | ドア接点シールを有するウェハ容器 |
KR101183027B1 (ko) * | 2012-06-18 | 2012-09-14 | (주)상아프론테크 | 밀봉 수납용기 |
US9887116B2 (en) * | 2014-03-26 | 2018-02-06 | Miraial Co., Ltd. | Substrate storing container |
-
2015
- 2015-11-26 US US15/778,531 patent/US10985043B2/en active Active
- 2015-11-26 WO PCT/JP2015/083188 patent/WO2017090143A1/ja active Application Filing
- 2015-11-26 KR KR1020187015499A patent/KR102430081B1/ko active IP Right Grant
- 2015-11-26 JP JP2017552602A patent/JP6539355B2/ja active Active
- 2015-11-26 CN CN201580084744.9A patent/CN108292618B/zh active Active
-
2016
- 2016-11-23 TW TW105138355A patent/TWI760317B/zh active
Also Published As
Publication number | Publication date |
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US10985043B2 (en) | 2021-04-20 |
KR20180087277A (ko) | 2018-08-01 |
WO2017090143A1 (ja) | 2017-06-01 |
TWI760317B (zh) | 2022-04-11 |
CN108292618A (zh) | 2018-07-17 |
KR102430081B1 (ko) | 2022-08-05 |
CN108292618B (zh) | 2022-11-25 |
JPWO2017090143A1 (ja) | 2018-09-27 |
TW201724327A (zh) | 2017-07-01 |
US20180358251A1 (en) | 2018-12-13 |
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